Patents by Inventor Yuko Motoyama

Yuko Motoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive, bonding method and assembly of mounting substrate
    Patent number: 6576081
    Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: June 10, 2003
    Assignee: Fujitsu Limited
    Inventors: Hiroaki Date, Yuko Motoyama, Hideshi Tokuhira, Makoto Usui, Nobuhiro Imaizumi
  • ADHESIVE, BONDING METHOD AND ASSEMBLY OF MOUNTING SUBSTRATE
    Publication number: 20020084019
    Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
    Type: Application
    Filed: November 12, 1999
    Publication date: July 4, 2002
    Inventors: HIROAKI DATE, YUKO MOTOYAMA, HIDESHI TOKUHIRA, MAKOTO USUI, NOBUHIRO IMAIZUMI