Abstract: A defect detection device including an illumination optical system, an image capturing optical system configured to capture an image of scattered light generated by the illumination optical system irradiating the wafer, and an image processing unit configured to process a picture of the image of the scattered light to extract a defect on the wafer. The image capturing optical system includes an objective lens, a filter unit configured to shield a part of light transmitted through the objective lens, and an imaging lens configured to form an image of light transmitted through the filter unit. The filter unit includes a first microlens array configured to condense parallel light transmitted through the objective lens, a shutter array including a light transmission unit at a focus position of the first microlens array, and a second microlens array disposed opposite to the first microlens array with respect to the shutter array.

Abstract: Provided is a highly reliable optical filtering device used as a spatial filter for an optical inspection apparatus and configured to prevent a shutter from sticking to a wall surface of a shutter opening. The optical filtering device includes the shutter openable and closeable by voltage control and a substrate having the shutter opening serving as a movable range of the shutter, in which the substrate includes a sticking prevention part configured to prevent the shutter from sticking to the wall surface of the shutter opening when the shutter is opened.

Abstract: The invention is to provide a defect detection device capable of using a compact optical system to detect a plurality of types of defects with high sensitivity and high speed. The defect detection device includes an irradiation system that irradiates light onto an object to be inspected; an optical system that forms scattered light produced by a light irradiation into an image; a microlens array disposed at an image plane of the optical system; an imaging element that is disposed at a position offset from the imaging plane of the optical system and that images light that passes through the microlens array; a mask image storage unit that stores a plurality of mask images generated for each type of defect or each defect direction; and a calculation unit that carries out mask processing on an image obtained from the imaging element using the plurality of mask images and carries out defect detection processing.

Abstract: Regarding a microscope system, a technique capable of suitably achieving a focusing on a surface of a sample is provided. The microscope system includes an irradiation optical system (laser light source 101 or the like) that irradiates a surface of a sample 3 on a stage 104 with light from an oblique direction, an observation optical system (camera 112 or the like) that forms an image of scattered light from the surface of the sample 3, a focus mechanism (piezo stage 106 or the like) that changes a height position of focus with respect to the surface of the sample 3, and a computer system 100 that acquires an image from the observation optical system.

Abstract: A defect detection device including an illumination optical system, an image capturing optical system configured to capture an image of scattered light generated by the illumination optical system irradiating the wafer, and an image processing unit configured to process a picture of the image of the scattered light to extract a defect on the wafer. The image capturing optical system includes an objective lens, a filter unit configured to shield a part of light transmitted through the objective lens, and an imaging lens configured to form an image of light transmitted through the filter unit. The filter unit includes a first microlens array configured to condense parallel light transmitted through the objective lens, a shutter array including a light transmission unit at a focus position of the first microlens array, and a second microlens array disposed opposite to the first microlens array with respect to the shutter array.

Abstract: The invention is to provide a defect detection device capable of using a compact optical system to detect a plurality of types of defects with high sensitivity and high speed. The defect detection device includes an irradiation system that irradiates light onto an object to be inspected; an optical system that forms scattered light produced by a light irradiation into an image; a microlens array disposed at an image plane of the optical system; an imaging element that is disposed at a position offset from the imaging plane of the optical system and that images light that passes through the microlens array; a mask image storage unit that stores a plurality of mask images generated for each type of defect or each defect direction; and a calculation unit that carries out mask processing on an image obtained from the imaging element using the plurality of mask images and carries out defect detection processing.

Abstract: A defect observation device detects a defect with high accuracy regardless of a defect size. One imaging configuration for observing an observation target on a sample is selected from an optical microscope, an optical microscope, and an electron microscope, and an imaging condition of the selected imaging configuration is controlled.

Abstract: Provided is a defect detection device including an illumination unit including a condenser lens and a plurality of light beam synthesis units, and a detection unit detecting scattered light generated on a sample by the illumination unit. The condenser lens condenses a plurality of light beams, emitted onto the sample and having substantially the same wavelength and substantially the same polarization, on the sample. The plurality of light beam synthesis units bring the plurality of light beams close to each other and make the light beams have light paths parallel to the optical axis of the condenser lens.

Abstract: A defect observation apparatus includes a storage unit configured to store defect information about defects detected by an external inspection apparatus; a first imaging unit configured to capture an image of a defect using a first imaging condition and a second imaging condition; a control unit configured to correct positional information on the defect using the image captured with the first imaging unit; and a second imaging unit configured to capture an image of the defect based on the corrected positional information.

Abstract: To review minute defects that were buried in roughness scattered light with an observation device provided with a dark-field microscope, a scanning electron microscope (SEM), and a control unit, the present invention configures the dark-field microscope by installing a filter for blocking a portion of the scattered light, an imaging lens for focusing the scattered light that has passed through the filter, and a detector for dividing the image of the scattered light focused by the imaging lens into the polarization directions converted by a wavelength plate and detecting the resulting images, and the control has a calculation unit for determining the position of a defect candidate detected by another inspection device using the plurality of images separated into polarization directions and detected by the detector.

Abstract: A defect observation method for observing a defect on a sample detected by another inspection device with a scanning electron microscope including the steps of: optically detecting the defect using the position information for the defect: illuminating the sample including the defect with an illumination intensity pattern having periodic intensity variation in two dimensions by irradiating a plurality of illumination light beams onto the surface of the sample while phase modulating the light beams in a single direction and successively moving the light beams in small movements in a direction different from the single direction, imaging the surface of the sample that is illuminated by the illumination intensity pattern having periodic intensity variation in two dimensions and includes the defect detected by the other inspection device, and detecting the defect detected by the other inspection device from the image obtained through the imaging of the surface of the sample.

Abstract: A defect observation device detects a defect with high accuracy regardless of a defect size. One imaging configuration for observing an observation target on a sample is selected from an optical microscope, an optical microscope, and an electron microscope, and an imaging condition of the selected imaging configuration is controlled.

Abstract: The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration incorporating an optimal microscope that re-detects defects, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope.

Abstract: A defect inspection method includes irradiating a sample with laser, condensing and detecting scattered light beams, processing signals that detectors have detected and extracting a defect on a sample surface, and outputting information on the extracted defect. Detection of the scattered light beams is performed by condensing the scattered light beams, adjusting polarization directions of the condensed scattered light beams, mutually separating the light beams depending on the polarization direction, and detecting the light beams by a plurality of detectors. Extraction of the defect is performed by processing output signals from the detectors by multiplying each detection signal by a gain, discriminating between a noise and the defect, and detecting the defect.

Abstract: Provided is a defect detection device including an illumination unit including a condenser lens and a plurality of light beam synthesis units, and a detection unit detecting scattered light generated on a sample by the illumination unit. The condenser lens condenses a plurality of light beams, emitted onto the sample and having substantially the same wavelength and substantially the same polarization, on the sample. The plurality of light beam synthesis units bring the plurality of light beams close to each other and make the light beams have light paths parallel to the optical axis of the condenser lens.

Abstract: An object of the present invention is to provide a lysophosphatidylserine derivative or a salt thereof. The present invention provides a lysophosphatidylserine derivative or a salt thereof, or a pharmaceutical composition or a lysophosphatidylserine receptor function modulator comprising said compound or a salt thereof.

Abstract: The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration incorporating an optimal microscope that re-detects defects, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope.

Abstract: Provided are a defect observation method and a defect observation device which detect a defect from an image obtained by imaging the defect on a sample with an optical microscope by using positional information of the defect on the sample detected by a different inspection device to correct the positional information of the defect and observe in detail the defect on the sample with a scanning electron microscope using the corrected positional information. The defect observation method includes detecting the defect from the image to correct the positional information of the defect, switching a spatially-distributed optical element of a detection optical system of the optical microscope according to the defect to be detected, and changing an image acquisition condition for acquiring the image and an image processing condition for detecting the defect from the image according to a type of the switched spatially-distributed optical element.

Abstract: Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.

Abstract: The disclosed device, which, using an electron microscope or the like, minutely observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, can reliably insert a defect to be observed into the field of an electron microscope or the like, and can be a device of smaller scale. The electron microscope, which observes defects detected by an optical appearance-inspecting device or an optical defect-inspecting device, has a configuration incorporating an optimal microscope that re-detects defects, and a spatial filter and a distribution polarization element are inserted at the pupil plane when making dark-field observations using this optical microscope.