Abstract: A moveable edge ring system for a substrate processing system includes a top moveable ring including a first annular body arranged around a substrate support. The top moveable ring is exposed to plasma during substrate processing. A moveable support ring is arranged below the top moveable ring and radially outside of a baseplate of the substrate support and includes a second annular body. A shield ring is arranged radially outside of the moveable support ring and includes a third annular body. A cover ring includes a fourth annular body arranged above a radially outer edge of the top moveable ring. An actuator and a lift pin are configured to adjust a position of the top moveable ring and the moveable support ring relative to the shield ring and the cover ring.

Abstract: A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move relative to the first printed circuit board.

Abstract: Wafer chucks or baseplates therefor are disclosed that feature thermal tuning cavity features that are positioned and sized so as to provide a more uniform temperature distribution across a wafer support surface of such a wafer chuck. Each thermal tuning cavity feature may be positioned adjacent to a portion or portions of a heat exchange passage or passages within a baseplate of the wafer chuck. By locating thermal tuning cavity features in locations underneath where the wafer support surface of the wafer chuck would otherwise demonstrate localized regions of lower temperature (as compared with adjacent regions of the wafer chuck support surface), the lower-temperature regions may be caused to have elevated temperatures that more closely match the surrounding temperatures, thereby increasing temperature uniformity.

Abstract: A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.

Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, at least one of a heating layer and a ceramic layer arranged on the baseplate, and a plurality of heating elements provided within the at least one of the heating layer and the ceramic layer. The plurality of heating elements includes a first material having a first electrical resistance. Wiring is provided through the baseplate in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone to a first heating element of the plurality of heating elements. The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance.

Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.

Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.

Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, at least one of a heating layer and a ceramic layer arranged on the baseplate, and a plurality of heating elements provided within the at least one of the heating layer and the ceramic layer. The plurality of heating elements includes a first material having a first electrical resistance. Wiring is provided through the baseplate in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone to a first heating element of the plurality of heating elements. The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance.

Abstract: A method of combustion includes: (1) introducing microparticles and nanoparticles into a combustion chamber, where the microparticles and the nanoparticles are formed of different materials; and (2) using an optical source, irradiating the microparticles and the nanoparticles within the combustion chamber to ignite the microparticles.

Abstract: An engine includes: (1) a housing defining a combustion chamber; (2) a set of injection mechanisms connected to the housing and configured to introduce a fuel and nanoparticles into the combustion chamber; and (3) an optical ignition system connected to the housing and configured to irradiate the nanoparticles to ignite the fuel.