Patents by Inventor Yume Morita

Yume Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11028284
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: June 8, 2021
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya Ekinaka, Tatsuichirou Kon, Takehiro Suga, Hiroshi Kishimoto, Yume Morita, Satoshi Ogata, Masato Nakagomi
  • Patent number: 10385238
    Abstract: An adhesive laminate comprising (A) a light-transmitting substrate layer formed from a melt extruded thermoplastic resin, (B) a hard coat layer formed by using a hard coating agent comprising not less than 13 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the layer B excluding a solvent, (C) an adhesive primer layer, and (D) an elastic adhesive layer. Layers (A)-(D) are formed in this order. Layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 ?m and an indentation elasticity modulus of 500 to 4,000 MPa. Layer D has a thickness (Y) of 0.9 to 14 mm.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: August 20, 2019
    Assignee: TEIJIN LIMITED
    Inventors: Hiroshi Kishimoto, Yume Morita, Yukiko Uzawa, Daisuke Takahashi
  • Publication number: 20180265731
    Abstract: The present invention provides a polymer substrate with a hardcoat layer exhibiting excellent environmental resistance and wear resistance. A polymer substrate (60) is 1-20 mm thick and a hardcoat layer (70, 80) on the surface thereof comprises: an underlayer cured layer (70) with a thickness of 1-20 ?m, and including 10-90 parts by weight of a multifunctional acrylate, and 90-10 parts by weight of inorganic oxide fine particles and/or a silicon compound hydrolytic condensate; and a silicon oxide layer (80) which is in direct contract with the underlayer cured layer, is formed by PE-CVD with an organosilicon compound as the starter material, and satisfies all of the following conditions (a)-(c): (a) the film thickness of the silicon oxide layer is 3.5-9.0 ?m; (b) the maximum indentation depth of the surface of the silicon oxide layer by nanoindentation measurement at a maximum load of 1 mN is 150 nm or less; and (c) the limit compression ratio K of the silicon oxide layer is at most 0.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 20, 2018
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuya EKINAKA, Tatsuichirou KON, Takehiro SUGA, Hiroshi KISHIMOTO, Yume MORITA, Satoshi OGATA, Masato NAKAGOMI
  • Patent number: 9758630
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: September 12, 2017
    Assignees: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou Kon, Tatsuya Ekinaka, Hiroshi Kishimoto, Yume Morita, Takehiro Suga, Satoshi Ogata, Masato Nakagomi
  • Publication number: 20170107345
    Abstract: The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 ?m to 20 ?m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 ?m to 9.
    Type: Application
    Filed: March 27, 2015
    Publication date: April 20, 2017
    Applicants: TEIJIN LIMITED, TSUKISHIMA KIKAI CO., LTD.
    Inventors: Tatsuichirou KON, Tatsuya EKINAKA, Hiroshi KISHIMOTO, Yume MORITA, Takehiro SUGA, Satoshi OGATA, Masato NAKAGOMI
  • Publication number: 20150140324
    Abstract: An adhesive laminate having excellent adhesiveness required for attachment to a structural member. The adhesive laminate comprises (A) a light-transmitting substrate layer (layer A) formed from a melt extruded thermoplastic resin, (B) a hard coat layer (layer B) formed by using a hard coating agent containing not less than 10 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the hard coat excluding a solvent, (C) an adhesive primer layer (layer C) and GK228PCT-13-5-2 and is to be attached to a structural member, wherein (i) the layers A to D are formed in this order; (ii) the layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 ?m and an indentation elasticity modulus measured by a nano-indentation method under a load of 800 ?N of 500 to 4,000 MPa; and (iii) the thickness (Y) of the layer D is 0.
    Type: Application
    Filed: May 29, 2013
    Publication date: May 21, 2015
    Inventors: Hiroshi Kishimoto, Yume Morita, Yukiko Uzawa, Daisuke Takahashi
  • Publication number: 20120070676
    Abstract: An organosiloxane resin composition which greatly improves the weatherability, hot water resistance and durability against environmental variations and a high-temperature environment of a substrate, imparts excellent abrasion resistance and has high optical transparency and a laminate. The organosiloxane resin composition comprises (A) colloidal silica (component A), (B) a hydrolyzed and condensed product of an alkoxysilane (component B), (C) a hydrolyzed and condensed product of an alkoxysilane having high hydrophobic nature (component C) and (D) a metal oxide (component D).
    Type: Application
    Filed: May 25, 2010
    Publication date: March 22, 2012
    Inventors: Ryo Niimi, Takashi Yoda, Yume Morita