Patents by Inventor Yumi Fuchida

Yumi Fuchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring structure
    Patent number: 5723908
    Abstract: A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially parallel to the first line layer. The second line layer consists of strip-shaped signal lines which extend parallel to one another and at an angle to the strip-shaped power/ground lines of the first line layer in a skewed position.
    Type: Grant
    Filed: March 11, 1994
    Date of Patent: March 3, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yumi Fuchida, Jun Hanari, Kazuhiro Matsumoto, Junichi Kudo, Kunio Yoshihara, Ayako Takagi