Patents by Inventor Yumi Maruyama
Yumi Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190064509Abstract: A variable focus mirror includes a base portion, a first piezoelectric element, a reflection surface portion, and a second piezoelectric element. The base portion has a plate shape with a recessed portion on a back surface. The first piezoelectric element is arranged on a front surface of the base portion where the recessed portion is arranged. The reflection surface portion is arranged on the first piezoelectric element. The reflection surface portion is arranged opposite to the base portion with respect to the first piezoelectric element. The second piezoelectric element is arranged on the front surface of the base portion. The second piezoelectric element covers the part of the base portion where the recessed portion is arranged and the part of the base portion outside the recessed portion. The second piezoelectric element is separated from the first piezoelectric element.Type: ApplicationFiled: January 12, 2017Publication date: February 28, 2019Applicant: DENSO CORPORATIONInventors: Koichi OYAMA, Takashi KATSUMATA, Tetsuya ENOMOTO, Yumi MARUYAMA
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Patent number: 9029960Abstract: The semiconductor device has a sensor unit including a sensing part, and a semiconductor substrate. The semiconductor substrate is bonded to the sensor unit through an insulation film such that the sensing part is disposed in an air-tightly sealed chamber provided between a recessed portion of the semiconductor substrate and the sensor unit. A surface of the semiconductor substrate provided on a periphery of the recessed portion includes a boundary region at a perimeter of the recessed portion and a bonding region on a periphery of the boundary region. The bonding region has an area greater than an area of the boundary region. The bonding region of the semiconductor substrate is bonded to the sensor unit through the insulation film.Type: GrantFiled: March 26, 2013Date of Patent: May 12, 2015Assignee: DENSO CORPORATIONInventor: Yumi Maruyama
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Publication number: 20130256813Abstract: The semiconductor device has a sensor unit including a sensing part, and a semiconductor substrate. The semiconductor substrate is bonded to the sensor unit through an insulation film such that the sensing part is disposed in an air-tightly sealed chamber provided between a recessed portion of the semiconductor substrate and the sensor unit. A surface of the semiconductor substrate provided on a periphery of the recessed portion includes a boundary region at a perimeter of the recessed portion and a bonding region on a periphery of the boundary region. The bonding region has an area greater than an area of the boundary region. The bonding region of the semiconductor substrate is bonded to the sensor unit through the insulation film.Type: ApplicationFiled: March 26, 2013Publication date: October 3, 2013Applicant: DENSO CORPORATIONInventor: Yumi MARUYAMA
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Patent number: 7901967Abstract: A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.Type: GrantFiled: November 16, 2006Date of Patent: March 8, 2011Assignee: DENSO CORPORATIONInventors: Atsushi Komura, Muneo Tamura, Kazuhiko Sugiura, Hirotsugu Funato, Yumi Maruyama, Tetsuo Fujii, Kenji Kohno
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Patent number: 7838396Abstract: A semiconductor substrate is bonded to a joining face of a sheet and is dividable along predetermined dividing lines of the semiconductor substrate by expanding the sheet so as to form semiconductor chips. A bonding layer for bonding a substrate face of the semiconductor substrate and the joining face of the sheet to each other can be formed in each region encircled with the predetermined dividing lines, between the substrate face and the joining face of the sheet. Thus, when the substrate face of the semiconductor substrate and the joining face of the sheet are bonded to each other, the bonding layer does not reach any of the predetermined dividing lines set between the regions. The bonding layer can be formed in dotted segments or a pattern of lattice between the substrate face of the semiconductor substrate and the joining face of the sheet.Type: GrantFiled: November 9, 2006Date of Patent: November 23, 2010Assignee: Denso CorporationInventors: Yumi Maruyama, Makoto Asai
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Publication number: 20070232107Abstract: In an attachment structure, a protective cap is provided with an adhesion layer on its outer peripheral edge part and its internal surface. The protective cap is bonded and fixed to an adherend member through the adhesion layer. This attachment structure can be suitably used for a semiconductor device. Alternatively, in a semiconductor device, a protective cap can be bonded using an adhesive. In this case, an outer peripheral edge part of the protective cap has a first end positioned on its inner rim surface, and a second end positioned on its outer rim surface. Furthermore, the first end protrudes toward a sensor chip more than the second end, and is adjacent to the sensor chip.Type: ApplicationFiled: March 20, 2007Publication date: October 4, 2007Applicant: DENSO CORPORATIONInventors: Kazuhiko Sugiura, Hirotsugu Funato, Tetsuo Fujii, Yumi Maruyama
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Publication number: 20070111477Abstract: A semiconductor wafer is disclosed for which irradiation of a laser beam forms a modified region due to multiphoton absorption to thereby facilitate dicing of the semiconductor wafer. The semiconductor wafer includes a formation member and a scribe groove located on the formation member according to an irradiation position of the laser beam. The scribe groove defines an open end and a bottom end. A width of the scribe groove is greater at the open end than at the bottom end.Type: ApplicationFiled: November 16, 2006Publication date: May 17, 2007Applicant: DENSO CORPORATIONInventors: Yumi Maruyama, Tetsuo Fujii
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Publication number: 20070111483Abstract: A semiconductor substrate is bonded to a joining face of a sheet and is dividable along predetermined dividing lines of the semiconductor substrate by expanding the sheet so as to form semiconductor chips. A bonding layer for bonding a substrate face of the semiconductor substrate and the joining face of the sheet to each other can be formed in each region encircled with the predetermined dividing lines, between the substrate face and the joining face of the sheet. Thus, when the substrate face of the semiconductor substrate and the joining face of the sheet are bonded to each other, the bonding layer does not reach any of the predetermined dividing lines set between the regions. The bonding layer can be formed in dotted segments or a pattern of lattice between the substrate face of the semiconductor substrate and the joining face of the sheet.Type: ApplicationFiled: November 9, 2006Publication date: May 17, 2007Applicant: DENSO CORPORATIONInventors: Yumi Maruyama, Makoto Asai
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Publication number: 20070111480Abstract: A semiconductor wafer has two faces, one of which is a laser light incident face. A dicing sheet is attached to the other face of the wafer, so that it is stretched to thereby apply tensile stress to a laser-reformed region and cause cutting with the reformed region taken as a starting point for cutting. A protection layer, such as light scattering projections and depressions, a light scattering member or a light reflecting member, is provided between the wafer and the dicing sheet to scatter or reflect the laser light passing through the wafer. Thus, the dicing sheet can be protected from being damaged because the laser light converging point is not formed in the dicing sheet.Type: ApplicationFiled: October 26, 2006Publication date: May 17, 2007Applicant: DENSO CORPORATIONInventors: Yumi Maruyama, Muneo Tamura, Tetsuo Fujii, Hirotsugu Funato
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Publication number: 20070111478Abstract: A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.Type: ApplicationFiled: November 16, 2006Publication date: May 17, 2007Applicant: DENSO CORPORATIONInventors: Atsushi Komura, Muneo Tamura, Kazuhiko Sugiura, Hirotsugu Funato, Yumi Maruyama, Tetsuo Fujii, Kenji Kohno