Patents by Inventor Yumi Saitou

Yumi Saitou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190280283
    Abstract: An electrode for a lithium-ion battery (100) of the present invention includes a collector layer (101) and an electrode active material layer (103) which is provided on at least one surface of the collector layer (101) and includes an electrode active material, a binder resin, and a conductive auxiliary agent, and an interface resistance between the collector layer (101) and the electrode active material layer (103), which is measured at a normal pressure by bringing an electrode probe into contact with a surface of the electrode active material layer (103), is more than 0.0010 ?·cm2 and less than 0.10 ?·cm2.
    Type: Application
    Filed: July 19, 2017
    Publication date: September 12, 2019
    Applicant: NEC Energy Devices, Ltd.
    Inventor: Yumi SAITOU
  • Patent number: 7884031
    Abstract: The semiconductor device includes an interconnect having a width of 0.1 ?m or less and formed in an insulating layer constituted of a low relative dielectric constant film having a relative dielectric constant of 3.0 or lower, a via having a diameter of 0.1 ?m or less and connected to the interconnect, and a dummy metal provided in the insulating layer. The dummy metal is located close to an end portion of the interconnect along an extension thereof, and the dummy metal and the interconnect are spaced by a distance of 0.3 ?m or less.
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: February 8, 2011
    Assignee: Renesas Electronics Corporation
    Inventor: Yumi Saitou
  • Patent number: 7863744
    Abstract: A semiconductor device includes an insulating interlayer formed above a silicon substrate and provided with a concave portion in a certain location, a barrier metal film covering an inner wall of the insulating interlayer, a lower layer copper interconnect provided so as to be in contact with the barrier metal film and buried in the interior of the concave portion, and a protective film provided so as to be in contact with the lower layer copper interconnect and also provided on substantially the entire top surface of the lower layer copper interconnect. An upper surface of the lower layer copper interconnect is provided so as to be retracted to be closer to the substrate than an upper surface of barrier metal film on the side wall of the concave portion.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: January 4, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Naoyoshi Kawahara, Yumi Saitou
  • Patent number: D616083
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: May 18, 2010
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D641849
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 19, 2011
    Assignee: Daikin Industries Ltd.
    Inventors: Yumi Saitou, Masahiko Chouji
  • Patent number: D641850
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 19, 2011
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D641854
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: July 19, 2011
    Assignee: Daikin Industrues Ltd.
    Inventors: Kouichirou Seki, Yumi Saitou
  • Patent number: D654031
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: February 14, 2012
    Assignee: Daikin Industries Ltd.
    Inventors: Kouichirou Seki, Yumi Saitou
  • Patent number: D656103
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: March 20, 2012
    Assignee: Daikin Industries Ltd.
    Inventors: Kouichirou Seki, Yumi Saitou
  • Patent number: D667739
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: September 25, 2012
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D667797
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: September 25, 2012
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D699826
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: February 18, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D699827
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: February 18, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D699828
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: February 18, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D700308
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: February 25, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D702335
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: April 8, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D705916
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: May 27, 2014
    Assignee: Daikin Industries Ltd.
    Inventor: Yumi Saitou
  • Patent number: D759225
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: June 14, 2016
    Assignee: DAIKIN INDUSTRIES LTD.
    Inventor: Yumi Saitou
  • Patent number: D760881
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: July 5, 2016
    Assignee: DAIKIN INDUSTRIES LTD.
    Inventor: Yumi Saitou
  • Patent number: D763421
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: August 9, 2016
    Assignee: DAIKIN INDUSTRIES LTD.
    Inventor: Yumi Saitou