Patents by Inventor Yumiko Iijima

Yumiko Iijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for soldering electronic components
    Patent number: 5526978
    Abstract: A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: June 18, 1996
    Assignee: TDK Corporation
    Inventors: Toshiyuki Nagatsuka, Yumiko Iijima, Hiroyuki Ohira