Patents by Inventor Yumio Nakamura

Yumio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6791347
    Abstract: A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: September 14, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaaki Ishizaka, Yumio Nakamura
  • Publication number: 20020190740
    Abstract: A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.
    Type: Application
    Filed: May 15, 2002
    Publication date: December 19, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masaaki Ishizaka, Yumio Nakamura