Abstract: An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.

Abstract: A method and a device implementing the method for making coffee are provided herein. The method and the related device use pressurized air as a media for pushing water under uniform pressure to flow through the coffee cake such that high-quality crema will be formed. The method basically contains the following steps. First, a water tank partially filled with hot water is provided. Then, high pressure air is filled and maintained within the water tank without releasing. A check valve leading to the coffee cake is then opened and the hot water is pushed by the high-pressure air to flow through the check valve and coffee cake. The temperature of the hot water is between 80˜100° C., and the amount of water is between one to two thirds of the volume of the water tank. The pressure level of the high-pressure air is between 6˜10 atm.