Abstract: The invention disclose a light emitting diode (LED) illustration device, comprising a platform, a substrate and a light emitting diode die. The said platform comprises an upper surface and a bottom surface. A first concave portion is formed on the upper surface of the platform, and a second concave portion is formed on the bottom surface of the platform. The first concave portion is connected with the second concave portion. The substrate is embedded in the second concave portion, wherein the said substrate comprises an electrostatic discharge protection structure. The said light emitting diode die is disposed on the said substrate.

Abstract: The invention discloses a photoelectric energy transducing apparatus, which includes a photoelectric energy transducing module and a semiconductor switch. The photoelectric energy transducing module includes a photoelectric energy transducing semiconductor structure, a first positive electrode, and a negative electrode. The semiconductor switch includes a second positive electrode and a second negative electrode. The second positive electrode is electrically connected to the first negative electrode. The second negative electrode is electrically connected to the first positive electrode. When light radiates onto the photoelectric energy transducing semiconductor structure, an electromotive force is induced between the first positive electrode and the first negative electrode, and the electromotive force provides a reverse bias on the semiconductor switch so that the semiconductor switch is cut off.

Abstract: The invention discloses a chip lead frame and a photoelectric energy transducing module. The chip lead frame includes an insulator and a plurality of conductors. The insulator includes a first surface, a second surface, a first recess structure formed on the first surface, a through hole passing through the second surface and the first recess structure, and a venting structure. The first recess structure forms an accommodating space. The venting structure communicates with the accommodating space so that when a substrate is being bound to the first recess structure, the air in the accommodating space pressed by the substrate could flow through the venting structure out of the insulator without remaining between the substrate and the first recess structure. A photoelectric energy transducing semiconductor structure could be disposed on the substrate and electrically connected to the conductors, so as to form the photoelectric energy transducing module of the invention.