Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: The invention provides a method for cargo sorting, configured to control an end effector with a package placement platform to sort the cargo, and the method includes: moving the package placement platform to a package obtaining position and obtaining the cargo to be sorted that enters into the package placement platform; moving the package placement platform to a package storage location; and exerting a first force to push the cargo into a package storage unit. With the help of the package placement platform, the method of the invention can receive the packages of different types or different sizes or different material so as to sort and transport all kinds of packages.

Abstract: A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (20), a second circuit board (40), at least one third circuit board (50), a fourth circuit board (60), a fifth circuit board (61), and a sixth circuit board (62); stacking the first circuit board (20), the second circuit board (40), and third circuit board (50) in that order, and stacking the fourth circuit board (60), the sixth circuit board (62), and the fifth circuit board (61) on the third circuit board (50), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Abstract: An image sleep analysis method and system thereof are disclosed. During sleep duration, a plurality of visible-light images of a body are obtained. Positions of image differences are determined by comparing the visible-light images. A plurality of features of the visible-light images are identified and positions of the features are determined. According to the positions of the image differences and features, the motion intensities of the features are determined. Therefore, a variation of the motion intensities is analyzed and recorded to provide accurate sleep quality.

Abstract: A power conversion apparatus supplies power to a load, and the power conversion apparatus includes a power switch, a transformer, and a control module. The control module alternately turns on and turns off a power switch of the power conversion apparatus to convert an input voltage into an output voltage through the transformer. When the power switch is turned off, a primary side of the transformer generates a resonance voltage. The control module sets a predetermined counting threshold according to the output voltage, and sets a blanking time interval according to a feedback signal related to the load. After the blanking time interval ends, the control module counts a number of an oscillation turning point generated by the resonance voltage due to the oscillation of the resonance voltage. When the number reaches the predetermined counting threshold, the control module turns on the power switch.

Abstract: The disclosed computer-implemented method for managing privacy policy violations may include obtaining, by the computing device, an intermediate representation of a privacy policy, wherein the intermediate representation denotes a formal policy and is generated by extracting the privacy policy in natural language from a website and parsing the privacy policy. The method may also include comparing, by the computing device, behavior of the website against the intermediate representation, thereby detecting at least one violation of the formal policy. The method may further include enforcing, by the computing device, the formal policy at least in part by taking a security action in response to the violation. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an interconnect structure over a substrate. The method includes forming a first conductive pad and a mask layer over the interconnect structure. The mask layer covers a top surface of the first conductive pad. The method includes forming a metal oxide layer over a sidewall of the first conductive pad. The method includes forming a second conductive pad over the first conductive pad and passing through the mask layer. The first conductive pad and the second conductive pad are made of different materials.

Abstract: A method for protecting sensitive data from being exposed in graph embedding vectors. In some embodiments, a method may include generating first graph embedding vectors from an original graph and generating a proxy graph from the first graph embedding vectors. The proxy graph may include a plurality of proxy nodes and proxy edges connecting the proxy nodes. The proxy nodes may include one or more attributes of the original nodes that are included in the first graph embedding vectors. Second graph embedding vectors may then be generated by encoding the proxy graph and a reconstructed graph may be generated from the second graph embedding vectors. Finally, the reconstructed graph may be compared to the original graph and if a threshold level of similarity is met, a security action may be performed to protect sensitive data from being exposed.

Abstract: An avalanche photodiode (APD) includes a first electrode, a substrate layer, a buffer layer, a gain layer, a gradient layer, an absorption layer, a diffusion barrier layer, a contact layer, and a second electrode. The gain layer, the gradient layer, and the absorption layer are arranged vertically in sequence. The gain layer, the gradient layer, and the absorption layer are located between the buffer layer and the diffusion barrier layer. The gain layer includes at least two gain units, and the gain units are arranged in a stacked manner. Each of the gain units includes a multiplication layer and a charge layer that are arranged vertically. A distance between the charge layer and the gradient layer is less than a distance between the multiplication layer and the gradient layer.

Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: Systems and methods for identifying anomalous activities in a cloud computing environment are provided. According to one embodiment, a customer's infrastructure may be fortified by leveraging deep learning technology (e.g., an encoder-decoder machine-learning (ML) model) to predict events in the cloud environment. During a training phase, the ML model may be trained to make a prediction regarding a next event based on a predetermined or configurable length of a sequence of contextual events. For example, historical events (e.g., cloud application programming interface (API) events logged to a cloud activity trace) observed within the customer's cloud infrastructure over the course of a particular date range may be split into appropriate event/context pairs and fed to the ML model. Subsequently, during a run-time anomaly detection phase, the ML model may be used to predict a next event based on a sequence of immediately preceding events to facilitate identification of anomalous activity.

Abstract: The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.

Abstract: The disclosed computer-implemented method for preventing social engineering attacks using distributed fact checking may include (i) capturing one or more words or tones received by a party to a communication, (ii) extracting speech features associated with the words or tones to identify one or more alleged facts in the communication, (iii) generating one or more queries to verify the alleged facts in the communication, (iv) determining, utilizing distributed fact checking, whether the alleged facts are true based on the queries, and (v) performing a security action that generates an alert to protect against a potential social engineering attack on the receiving party when at least one of the alleged facts are determined to be false. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing

Abstract: A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Abstract: A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Abstract: A method for preparing a flexible sol-gel polishing block, the method comprises: (1) adding a gel agent and a 20 ?m diamond abrasive into deionized water, and stirring to even to obtain a first material; (2) adding carbon fiber into the first material obtained in the step 1, and mixing to even to obtain a second material; (3) injecting the second material obtained in the step 2 into a mold, and curing to obtain a cured gel; and (4) drying the cured gel to obtain the flexible sol-gel polishing block.