Patents by Inventor Yun Young YANG

Yun Young YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Magnetic composition and inductor including the same
    Patent number: 9875839
    Abstract: A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Youn Kyu Choi, Mi Jung Kang, Hea Ah Kim, Yun Young Yang, Jae Yeol Choi
  • Chip electronic component and manufacturing method thereof
    Patent number: 9704640
    Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: July 11, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Youn Kyu Choi, Hye Ah Kim, Yun Young Yang, Mi Jung Kang, Jae Yeol Choi
  • Chip electronic component
    Patent number: 9659704
    Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Young Yang, Youn Kyu Choi, Hye Ah Kim, Do Won Kang, Mi Jung Kang
  • MAGNETIC COMPOSITION AND INDUCTOR INCLUDING THE SAME
    Publication number: 20160217902
    Abstract: A magnetic composition includes: coarse powder containing a non-crystalline iron-based material; medium powder containing a crystalline iron-based material; and fine powder containing nickel. A ratio of the coarse powder and the medium powder is in a range of 65:35 to 80:20, and the amount of the fine powder is in a range of 3 wt % to 7 wt % on the basis of a total weight of the coarse powder and the medium powder.
    Type: Application
    Filed: January 19, 2016
    Publication date: July 28, 2016
    Inventors: Youn Kyu CHOI, Mi Jung KANG, Hea Ah KIM, Yun Young YANG, Jae Yeol CHOI
  • CHIP ELECTRONIC COMPONENT
    Publication number: 20160126004
    Abstract: A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 ?m to 10 ?m.
    Type: Application
    Filed: October 16, 2015
    Publication date: May 5, 2016
    Inventors: Yun Young YANG, Youn Kyu CHOI, Hye Ah KIM, Do Won KANG, Mi Jung KANG
  • CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    Publication number: 20160086716
    Abstract: There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.
    Type: Application
    Filed: May 6, 2015
    Publication date: March 24, 2016
    Inventors: Youn Kyu CHOI, Hye Ah KIM, Yun Young YANG, Mi Jung KANG, Jae Yeol CHOI