Patents by Inventor Yung-Chung Chang

Yung-Chung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139142
    Abstract: Provided is a method for preventing or treating a liver disease, including administering a therapeutically effective amount of pharmaceutical composition to a subject in need, and the pharmaceutical composition includes the isothiocyanate structural modified compound and a pharmaceutically acceptable carrier thereof.
    Type: Application
    Filed: September 14, 2023
    Publication date: May 2, 2024
    Applicants: TAIPEI VETERANS GENERAL HOSPITAL, NATIONAL YANG MING CHIAO TUNG UNIVERSITY, PHARMAESSENTIA CORPORATION
    Inventors: Jaw-Ching WU, Yung-Sheng CHANG, Kuo-Hsi KAO, Chan-Kou HWANG, Ko-Chung LIN
  • Patent number: 11966628
    Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 23, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Wei-Chen Wang, Han-Wen Hu, Yung-Chun Li, Huai-Mu Wang, Chien-Chung Ho, Yuan-Hao Chang, Tei-Wei Kuo
  • Patent number: 8783579
    Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.
    Type: Grant
    Filed: July 4, 2012
    Date of Patent: July 22, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Li-Chi Chang, Yung-Chung Chang, Chang-Chih Liu, Cheng-Hua Tsai, Meng-Sheng Chen
  • Patent number: 8686821
    Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: April 1, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Cheng-Hua Tsai
  • Publication number: 20140008443
    Abstract: An RFID sealing device for a bottle is disclosed, which provides information of production resumes, stock control, sale control and so like, where the information may be adapted for a computerized foods management system for the upstream manufacturer and the downstream sellers. Since the metal cap plays a part in the RFID sealing device, the RFID shall malfunction once the bottle cap has been turned or opened before sale, so that the present RFID sealing device plays a function of safety identifier to the bottled liquid or food in addition.
    Type: Application
    Filed: July 4, 2012
    Publication date: January 9, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Li-Chi Chang, Yung-Chung Chang, Chang-Chih Liu, Cheng-Hua Tsai, Meng-Sheng Chen
  • Patent number: 8610626
    Abstract: An antenna having a signal feeding structure, an antenna conductor coupled to the signal feeding structure and forming a slot in the antenna conductor. A closing portion capacitively closing the at least one slot at a mechanically open end of the slot.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: December 17, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Li-Chi Chang, Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Chang-Sheng Chen
  • Publication number: 20130187743
    Abstract: An inductor structure including a plurality of solenoids and at least one connecting line is provided. One of the solenoids serves as a core, and the remaining solenoids are sequentially wound around the core solenoid. Axes of the solenoids are substantially directed to the same direction. Each connecting line is correspondingly connected between ends of two adjacent solenoids to serially connect the solenoids.
    Type: Application
    Filed: June 19, 2012
    Publication date: July 25, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yung-Chung Chang, Meng-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Cheng-Hua Tsai
  • Patent number: 8480773
    Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: July 9, 2013
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Patent number: 8339233
    Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: December 25, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Hua Tsai, Chang-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Yung-Chung Chang
  • Publication number: 20120146853
    Abstract: An antenna having a signal feeding structure, an antenna conductor coupled to the signal feeding structure and forming a slot in the antenna conductor. A closing portion capacitively closing the at least one slot at a mechanically open end of the slot.
    Type: Application
    Filed: December 9, 2010
    Publication date: June 14, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Chi CHANG, Yung-Chung CHANG, Meng-Sheng CHEN, Chang-Chih LIU, Chang-Sheng CHEN
  • Publication number: 20120146757
    Abstract: A three-dimensional inductor is provided. The three-dimensional inductor is disposed in a multi-layered substrate. The multi-layered substrate includes at least a dielectric layer and at least two metal layers. The three-dimensional inductor includes a first coil and a second coil. The second coil is electrically connected to the first coil. The first coil is on a first plane and formed on a first metal layer. The second coil is on a second plane and disposed in a variety of dielectric layers and metal layer. The first plane is not parallel to or is vertical to the second plane such that the magnetic field generated by the first coil and the magnetic field generated by the second coil are not parallel to each other or are vertical to each other.
    Type: Application
    Filed: May 18, 2011
    Publication date: June 14, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Hua Tsai, Chang-Sheng Chen, Chang-Chih Liu, Li-Chi Chang, Yung-Chung Chang
  • Publication number: 20110241258
    Abstract: A polishing pad having a compressibility-aiding stripe buried therein is fabricated by assembling the compressibility-aiding stripe in a mold cavity, filling the mold cavity with a polymer material, and releasing the polishing pad from the mold. Embodiments include assembling a compressibility-aiding stripe comprising a solid pillar of material having a larger compressibility than that of the polishing pad body, and releasing a single layer polishing pad from the mold.
    Type: Application
    Filed: June 14, 2011
    Publication date: October 6, 2011
    Applicant: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Patent number: 8016647
    Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: September 13, 2011
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Patent number: 7875335
    Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: January 25, 2011
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Publication number: 20080102741
    Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
    Type: Application
    Filed: December 26, 2007
    Publication date: May 1, 2008
    Applicant: IV TECHNOLOGIES CO., LTD.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
  • Patent number: 7335094
    Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.
    Type: Grant
    Filed: July 22, 2006
    Date of Patent: February 26, 2008
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
  • Publication number: 20070259612
    Abstract: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
    Type: Application
    Filed: March 20, 2007
    Publication date: November 8, 2007
    Applicant: IV TECHNOLOGIES CO., LTD.
    Inventors: Yung-Chung Chang, Shen-Yu Chang, Wen-Chang Shih
  • Patent number: 7285233
    Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: October 23, 2007
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Patent number: 7258602
    Abstract: A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the window has at least one second groove therein. More particularly, the first groove is deeper than the second groove. The polishing pad having a grooved window therein has advantages of providing precise endpoint detection and thereby reducing or resolving defect problems.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: August 21, 2007
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu
  • Patent number: 7241408
    Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: July 10, 2007
    Assignee: I.V. Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei