Abstract: A USB connector is adapted to a USB receptacle in compliance with two different USB standards including a first USB standard and a second USB standard. The USB connector includes a first USB plug and a second USB plug. The first USB plug is in compliance with the first USB standard, and the second USB plug integrated with the first USB plug is in compliance with the second USB standard. The second USB plug is detachably connected to the first USB plug.

Abstract: A bumped chip is revealed, including a chip, a UBM layer, an Ag bump, and a creeping-resist layer. The chip has a bonding pad and a passivation layer covering one surface of the chip and exposing the bonding pad. The UBM layer is disposed on the bonding pad and covers the passivation layer at the peripheries of the opening. The Ag bump is disposed on the UBM layer to form as a pillar bump having a top surface and a pillar sidewall. The creeping-resist layer is formed at least on the pillar sidewall to fully encapsulate the Ag bump. Therefore, the disclosed bumped chip will have no Ag-creeping due to exerting stresses nor changing of joint heights under high temperature environment to meet the bumping requirements of lead-free, high reliability, and lower cost.