Patents by Inventor Yung-Hsiang Wu
Yung-Hsiang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240176093Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: ApplicationFiled: February 5, 2024Publication date: May 30, 2024Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
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Patent number: 11988625Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.Type: GrantFiled: December 23, 2020Date of Patent: May 21, 2024Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATIONInventors: Cheng-Ping Chang, Chien-Hui Li, Chien-Hsun Wu, Tai-I Yang, Yung-Hsiang Chen
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Patent number: 11973148Abstract: A semiconductor device and a method of forming the same is disclosed. The semiconductor device includes a substrate, a first well region disposed within the substrate, a second well region disposed adjacent to the first well region and within the substrate, and an array of well regions disposed within the first well region. The first well region includes a first type of dopants, the second well region includes a second type of dopants that is different from the first type of dopants, and the array of well regions include the second type of dopants. The semiconductor device further includes a metal silicide layer disposed on the array of well regions and within the substrate, a metal silicide nitride layer disposed on the metal silicide layer and within the substrate, and a contact structure disposed on the metal silicide nitride layer.Type: GrantFiled: November 18, 2021Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ting-Ying Wu, Yung-Hsiang Chen, Yu-Lung Yeh, Yen-Hsiu Chen, Wei-Liang Chen, Ying-Tsang Ho
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Patent number: 11952264Abstract: An electronic device including a substrate, a sensor, a partition wall structure, a pressurizing component, and a stopping structure is provided. The substrate has a carrying surface. The sensor is disposed on the carrying surface. The partition wall structure is disposed on the carrying surface and surrounds the sensor. The pressurizing component is disposed on the partition wall structure. The pressurizing component, the partition wall structure, and the substrate jointly form a cavity, and the pressurizing component includes a mass and a vibration membrane. The stopping structure is disposed between the pressurizing component and the partition wall structure and extends into the cavity. The stopping structure has at least one opening penetrating the stopping structure.Type: GrantFiled: December 21, 2021Date of Patent: April 9, 2024Assignee: Merry Electronics (Shenzhen) Co., Ltd.Inventors: Jia Yin Wu, Yung-Hsiang Chang, Yueh-Kang Lee
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Publication number: 20240094600Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly and a first driving assembly. The movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The optical element driving mechanism further includes a first opening, and an external light beam travels along a first axis to pass through the first opening.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Inventors: Tso-Hsiang WU, Chao-Chang HU, Yung-Yun CHEN, Ya-Hsiu WU
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Publication number: 20230201598Abstract: A movement monitor sensor includes a body, a conduction area, at least one depth electrode set and a flat electrode set. The body has an axis and two axial ends. The conduction area at one axial end connects a conductive wire. The depth electrode set includes four separate depth electrodes disposed on the body by surrounding the axis and connected individually with first wires. The flat electrode set includes a substrate disposed at another axial end and four separate flat electrodes disposed at the substrate by surrounding the axis and connected individually with second wires. The conductive wire, the first and second wires are individually connected with the conduction area, the depth electrodes and the flat electrodes. When a human movement changes, a processor evaluates impedance variations generated by the depth electrode set, the flat electrode set and/or the conduction area to determine electrical stimulation control upon human brain.Type: ApplicationFiled: December 27, 2022Publication date: June 29, 2023Inventors: JO-PING LEE, SHENG-HONG TSENG, CHUNG-HSIN SU, YUNG-HSIANG WU
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Publication number: 20080223820Abstract: A method for forming miniature wires by printing or dispensing a solution on a substrate, the solution comprising a solute being capable of being etched and forming an inner and outer region on the substrate, each region having a thickness. After an etching process is applied on the substrate, the region inner region is removed so the outer region remains as desired wires. A line width of thus formed wires is narrowed to reach micron-scale wires.Type: ApplicationFiled: February 20, 2008Publication date: September 18, 2008Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yung-Hsiang WU, Je-Ping HU, Ming-Huan YANG, Chun-Jung CHEN, Chien-Hung LIU
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Publication number: 20050136337Abstract: A method for forming wires of nano-meter grade, wherein by printing or dispensing a solution on a substrate, the solute contained in the solution will form two regions with different thicknesses on the substrate when the solvent has dried. After an etching process is comprehensively applied on the substrate, the region with thinner solute will be completely removed, and only the region with the thicker solute remains as the desired wires. With such a process, the line width of the created wires is narrowed to reach the nano-grade.Type: ApplicationFiled: April 26, 2004Publication date: June 23, 2005Applicant: Industrial Technology Research InstituteInventors: Yung-Hsiang Wu, Je-Ping Hu, Ming-Huan Yang, Chun-Jung Chen, Chien-Hung Liu
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Patent number: D506167Type: GrantFiled: April 1, 2004Date of Patent: June 14, 2005Inventor: Yung-Hsiang Wu
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Patent number: D506420Type: GrantFiled: April 1, 2004Date of Patent: June 21, 2005Inventor: Yung-Hsiang Wu