Patents by Inventor Yung-Jiun Dai

Yung-Jiun Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8137121
    Abstract: A fastener for securing a chip module onto a circuit board includes a fixing bracket mounted on the circuit board; a pressing frame covering the chip module; a lever having a driving portion and a shaft portion, wherein the shaft portion is formed by extending and bending from the driving portion, with the shaft portion running through the fixing bracket and the pressing frame for controlling the forward and backward rotation of the pressing frame; a protective cover mounted on the pressing frame, wherein a projection portion is formed on a bottom surface of the protective cover and located at the rear end of the chip module, and the projection portion has a slant surface adjacent to the chip module; and thereby, when the pressing frame moves forward, the slant surface presses against the chip module.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: March 20, 2012
    Assignee: Lotes Co., Ltd.
    Inventor: Yung-Jiun Dai
  • Publication number: 20110294330
    Abstract: A fastener for securing a chip module onto a circuit board includes a fixing bracket mounted on the circuit board; a pressing frame covering the chip module; a lever having a driving portion and a shaft portion, wherein the shaft portion is formed by extending and bending from the driving portion, with the shaft portion running through the fixing bracket and the pressing frame for controlling the forward and backward rotation of the pressing frame; a protective cover mounted on the pressing frame, wherein a projection portion is formed on a bottom surface of the protective cover and located at the rear end of the chip module, and the projection portion has a slant surface adjacent to the chip module; and thereby, when the pressing frame moves forward, the slant surface presses against the chip module.
    Type: Application
    Filed: October 27, 2010
    Publication date: December 1, 2011
    Applicant: LOTES CO., LTD.
    Inventor: YUNG-JIUN DAI