Abstract: A photosensitive composition and film prepared from the same are provided. The photosensitive composition includes 100 parts by weight of polyimide, 0.25-50 parts by weight of initiator and 0.25-100 parts by weight of crosslinking agent. The polyimide is a product of a reactant (a) and a reactant (b) via a reaction. The reactant (a) consists of a first dianhydride and a second dianhydride. The molar ratio of the first dianhydride to the second dianhydride is 3:7 to 8:2. The reactant (b) includes a first diamine. The first dianhydride, the second dianhydride and the first diamine are disclosed in the specification.

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

Abstract: A polyimide, a film composition, and film prepared from the same are provided. The polyimide is a product of a reactant (a) and a reactant (b). The reactant (a) consists of a first dianhydride and a second dianhydride. The first dianhydride has a structure represented by Formula (I) and the second dianhydride has a structure represented by Formula (II) wherein R1, R2 and Ar1 are as defined in specification. The reactant (b) includes a first diamine, wherein the first diamine is and R3, R4, R5, or R6 are as defined in specification.

Abstract: A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II) wherein A1 and A3 are independently tetravalent moiety; A2 is a divalent moiety; n?1; m?1; R1 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, or C6-12 aryl; and R2 is independently hydrogen, C1-8 alkyl, C1-8 fluoroalkyl, C1-8 alkoxy, C6-12 aryl, or a reactive functional group.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Abstract: To provide an optical film having improved bending resistance while maintaining optical characteristics, e.g. transparency, total light transmittance, and YI value and so on. An optical film containing a resin and silica fine particles whose average primary particle size measured by image analysis with a scanning electron microscope is not less than 21 nm and not more than 40 nm, wherein the content of the silica fine particles is not less than 15% by mass and not more than 80% by mass based on a total content of the resin and the silica fine particles.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A flexible substrate structure including a flexible metal carrier, a surface-modified layer and a flexible plastic substrate is provided. The flexible metal carrier includes a first region and a second region. The surface-modified layer is located on and contacts with the first region of the flexible metal carrier. The flexible plastic substrate is located over the first region and the second region. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier.

Abstract: A method of fabricating a flexible substrate structure is provided. A flexible metal carrier including at least one first region and at least one second region is provided. A surface-modified layer is formed on the first region of the flexible metal carrier. A flexible plastic substrate is formed over the first region and the second region of the flexible metal carrier. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier.

Abstract: An organic/inorganic hybrid material is provided, which includes an organic polymer and a plurality of inorganic nanoparticles, wherein the inorganic nanoparticles are self-connected or connected via a linker to constitute an inorganic network structure. By forming the inorganic network structure through interconnection of inorganic nanoparticles, the inorganic content in the hybrid materials can be drastically increased to improve the properties thereof. A method for fabricating the organic/inorganic hybrid material is also provided.

Abstract: A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. In Formula (I), B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4. The invention also provides a flexible electrical device including the polyimide polymer.

Abstract: An organic/inorganic hybrid material is provided, which includes an organic polymer and a plurality of inorganic nanoparticles, wherein the inorganic nanoparticles are self-connected or connected via a linker to constitute an inorganic network structure. By forming the inorganic network structure through interconnection of inorganic nanoparticles, the inorganic content in the hybrid materials can be drastically increased to improve the properties thereof. A method for fabricating the organic/inorganic hybrid material is also provided.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Abstract: Golf glove saving pads can be used and attached to a golf glove to serve as a glove saver. The saving pads comprise at least one layer of non-slip material that has a double sided glue tape, or a layer of releasable glue in stead, at the bottom so that the golf glove saving pads can be attached onto a golf glove and secured during golf swings. The whole golf glove saving pads can be easily removed by using the hot air to soften the glue bonding to a golf glove, therefore they are replaceable. Moreover, the golf glove saving pads also serve as a moisture barrier to eliminate the effect due to the moisture from the perspiration of the hands that causes the golf glove to become weaker to sustain the stress during golf swings, therefore, the golf glove saving pad can extend the normal usage life of a golf glove.

Abstract: A grip-aid gripping bandage adopted to be disposed over a finger or glove to protect the finger when using sports equipment or a hand tool and to provide enhanced control when using the sports equipment or hand tool. A first self-adhering strip is provided having a first predetermined length. A second non-self-adhering cushioning strip overlies a portion of and is bonded to the surface of the first self-adhering strip. The entire bandage, including the first self-adhering strip and the second non-self-adhering cushioning strip, provides protection from abrasion and pressure when the bandage is applied to a finger. In a further embodiment, an insert is disposed between the first self-adhering strip and the second non-self-adhering cushioning strip for enhanced protection for the finger.

Abstract: A grip-aid gripping bandage adopted to be disposed over a finger or glove to protect the finger when using sports equipment or a hand tool and to provide enhanced control when using the sports equipment or hand tool. A first self-adhering strip is provided having a first predetermined length. A coat of adhesive material may be applied to a portion of a bottom surface of the first self-adhering strip. A second cushioning strip overlies a portion of and is bonded to an upper surface of the first self-adhering strip. The entire bandage, including the first self-adhering strip and the second cushioning strip, provides protection from abrasion)and pressure when the bandage is applied to a finger. In a further embodiment, an insert is disposed between the first self-adhering strip and the second cushioning strip for enhanced protection for the finger.