Abstract: A method for monitoring paging is provided. The method is performed by a user equipment (UE) and includes actions of receiving a first Physical Downlink Control Channel (PDCCH) addressed to a first Radio Network Temporary Identifier (RNTI), and stopping monitoring a second PDCCH addressed to a second RNTI if the first PDCCH includes a paging stop indicator, where the second RNTI is the same as the first RNTI.

Abstract: A semiconductor manufacturing method is provided. The semiconductor manufacturing method includes the following steps. A first semiconductor element with a bonding film and a first stressing film is formed. The first bonding film and the first stressing film are formed on two opposite sides of the first semiconductor element. The first stressing film makes the first bonding film to have a first convex surface. A second semiconductor element with a second bonding film is formed. The second bonding film is formed on one side of the second semiconductor element. The first semiconductor element and the second semiconductor element are bonded by bonding the first bonding film and the second bonding film.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

Abstract: A user equipment (UE) and a method performed by the UE are provided. The method includes transitioning from a radio resource control (RRC) inactive (RRC_INACTIVE) state to an RRC idle (RRC_IDLE) state upon determining that the UE has failed to find a suitable cell and camped on an acceptable cell; and discarding a radio access network (RAN) notification area (RNA) configuration that comprises at least one of a list of tracking area identities (IDs) or a list of RAN area IDs in response to the transitioning from the RRC_INACTIVE state to the RRC_IDLE state. The acceptable cell fulfills a minimum set of requirements to initiate an emergency call and to receive one or more Earthquake & Tsunami Warning System (ETWS) and Commercial Mobile Alert System (CMAS) notifications. The suitable cell provides normal services. The acceptable cell provides limited services.

Abstract: A display includes an outer frame, a supporting frame, a display module, and a covering member. The supporting frame is accommodated in the outer frame. The display module is disposed on a supporting member of the supporting frame. The supporting member extends toward a display region of the display module from the supporting frame. On a first surface of the display module, a projection area of the supporting member and a projection area of an first optical film of the display module are partially overlapped with each other. A third surface of the covering member is closely attached to a second optical film of the display module. The covering member has an extension portion. The extension portion extends from a fourth surface opposite to the third surface toward a direction away from the third surface, and the extension portion is coplanar with the outer side surface of the outer frame.

Abstract: A method performed by a BS for CHO is provided. The method includes transmitting a CHO command to a UE, the CHO command including a CHO command ID and a measurement ID associated with the CHO command ID; causing the UE to execute the CHO command to handover to a target BS when a trigger condition associated with the measurement ID is fulfilled; causing the UE to forgo transmitting the measurement report during the execution of the CHO command despite the UE being configured, via a report configuration associated with the measurement ID, to transmit the measurement report; transmitting, to the UE, a message that causes the UE to remove the CHO command; and after transmitting the message to the UE, determining that the report configuration is removed by the UE without transmitting, to the UE, an instruction to remove the report configuration.

Abstract: An automatic power-off circuit automatically disconnects a path between a battery and a load after the battery supplying power to the load for a specific time period. The automatic power-off circuit includes a first switch, a first capacitor, a first reverse circuit, a timing circuit, and a logic circuit. The first reverse circuit provides a first signal reversed to a potential change based on the potential change of the first capacitor. The timing circuit provides a second signal with the first potential to the logic circuit based on the first signal with the first potential, and adjusts the second signal with the second potential after the specific time period. The logic circuit turns on the first switch based on the second signal with the first potential, and turns off the first switch based on the second signal with the second potential.