Patents by Inventor Yung-Sheng Lee

Yung-Sheng Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178002
    Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen, Ru-Gun Liu, Shau-Lin Shue, Tsai-Sheng Gau, Yung-Hsu Wu
  • Publication number: 20240102194
    Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.
    Type: Application
    Filed: August 7, 2023
    Publication date: March 28, 2024
    Inventors: Cheng-EN HO, Yu-Lian CHEN, Cheng-Chi WANG, Yu-Jen CHANG, Yung-Sheng LU, Cheng-Yu LEE, Yu-Ming LIN
  • Patent number: 9609098
    Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: March 28, 2017
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Yung-Sheng Lee, Cheng-Wei Chen, Chia-Hao Wu, Kang-Yu Lai, Cheng-Yao Huang, Shih-Hsuan Huang
  • Publication number: 20160240945
    Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.
    Type: Application
    Filed: February 4, 2016
    Publication date: August 18, 2016
    Inventors: Yung-Sheng Lee, Cheng-Wei Chen, Chia-Hao Wu, Kang-Yu Lai, Cheng-Yao Huang, Shih-Hsuan Huang
  • Publication number: 20160186449
    Abstract: A tile flattener device structure, which has a bottom edge support contacting the surface and positioned between the bottom of a front plate and a rear plate of a base plate, and the tiles desired to be levelled are individually positioned at the left and right elastic adjustment areas of the front and rear recesses of the front plate and the rear plate, and the levelling adjustment of tiles is performed by means of an inclined adjustment body passing through the perforation via the clamping piece, and since the front and rear recesses of the front plate and the rear plate dividing the left and right elastic adjustment areas have elasticity, they can perform levelling of various tiles, effectively reduce the working time and increase construction speed, and also reduce the usage of the tile flattener device, so that ensures the results of ease of use and reducing usage costs.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 30, 2016
    Inventor: Yung Sheng LEE
  • Publication number: 20060146507
    Abstract: Disclosed is a dual-usage fastener, which includes first support member, which has a body for fastening to a case for computer server, a bearing surface at the top of the body for supporting a first circuit board with a SCSI connector, and a top neck vertically upwardly extending from the bearing surface at the center, and a second support member, which has a body fixedly mounted at the top of the top neck of the first support member, and a bearing surface at the top side of the body for supporting a second circuit board with a S-ATA connector.
    Type: Application
    Filed: April 26, 2005
    Publication date: July 6, 2006
    Applicant: TATUNG CO., LTD.
    Inventor: Yung-Sheng Lee