Abstract: The present invention is a high-sensitivity strain probe used in high-sensitivity sensor elements of force type. By the use of semiconductor process and wire bonding technology as well as integrated forming method, the fabricated elements include: a probe, a cantilever, a cantilever substrate, resistance materials, and a processing circuit that can be applied to a probe microscope to greatly reduce the number of elements of the scanning probe microscopy. The invention attains the object of lowering the cost and effectively solves the problems of an excessively large signal-to-noise ratio and avoids using the optical elements present in a conventional microscopic probe avoiding various inconveniences and shortcomings of the prior art.

Abstract: An information recording medium including a substrate, an intermediate conductive layer, and a high molecular weight layer. When the high molecular weight layer is heated to close to its glass (transition) temperature by applying an AC field in order to induce thermal motion in molecular electric coupling poles present in the high molecular weight layer, the coupling poles are polarized by an external electric field applied between a microscopic probe tip and the intermediate conductive layer, the polarization becoming fixed when the temperature of the layer drops.

Abstract: The present invention is a high-sensitivity strain probe used in high-sensitivity sensor elements of force type. By the use of semiconductor process and wire bonding technology as well as integrated forming method, the fabricated elements include: a probe, a cantilever, a cantilever substrate, resistance materials, and a processing circuit that can be applied to a probe microscope to greatly reduce the number of elements of the scanning probe microscopy. The invention attains the object of lowering the cost and effectively solves the problems of an excessively large signal-to-noise ratio and avoids using the optical elements present in a conventional microscopic probe avoiding various inconveniences and shortcomings of the prior art.