Patents by Inventor Yung-Wei Chou

Yung-Wei Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure
    Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Semiconductor structure and method of forming the same
    Patent number: 11955522
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a buffer layer, a barrier layer, a dielectric layer, a source structure, and a drain structure. The buffer layer is disposed on the substrate. The barrier layer is disposed on the buffer layer. The dielectric layer is disposed on the barrier layer. The passivation layer is disposed on the dielectric layer. The source structure and the drain structure are disposed on the passivation layer.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Cheng-Wei Chou, Shin-Cheng Lin, Yung-Fong Lin
  • Connecting structure of printed circuit board of liquid crystal display module
    Patent number: 7410362
    Abstract: A connecting structure of a printed circuit board of a liquid crystal display (LCD) module includes a double side printed circuit board and a single side printed circuit board. With the design of the double side printed circuit board having a solder element with two solder surfaces with a plurality of plated through holes (PTHs), and the design of the opening neighboring the solder element, the conducting surface of the single side printed circuit board may easily accord with the structural requirements to select the corresponding solder surface for performing welding.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: August 12, 2008
    Assignee: Wintek Corporation
    Inventor: Yung-Wei Chou
  • Connecting structure of printed circuit board of liquid crystal display module
    Publication number: 20080045077
    Abstract: A connecting structure of a printed circuit board of a liquid crystal display (LCD) module includes a double side printed circuit board and a single side printed circuit board. With the design of the double side printed circuit board having a solder element with two solder surfaces with a plurality of plated through holes (PTHs), and the design of the opening neighboring the solder element, the conducting surface of the single side printed circuit board may easily accord with the structural requirements to select the corresponding solder surface for performing welding.
    Type: Application
    Filed: August 17, 2007
    Publication date: February 21, 2008
    Applicant: Wintek Corporation
    Inventor: Yung-Wei Chou