Abstract: A curable silicone release coating composition and method for its preparation are disclosed. The curable silicone release coating composition cures to form a silicone release coating after exposure to ultra-violet radiation at an intensity ?1 J/cm2.

Abstract: A composition contains 45-65 weight-percent (wt %) of a linear polyorganosiloxane with terminal vinyl functionality, 39 wt % to less than 50 wt % alkenyl-free polyorganosiloxane resin comprising R3SiO1/2 and SiO4/2 siloxane units at an average molar ratio of greater than zero to 10; where R is independently in each occurrence selected from a group consisting of alkyl groups containing from one to 10 carbon atoms; 0.5-15 wt % mercapto-functional linear polyorganosiloxane crosslinker; 0.01-0.1 wt % radical stabilizer; 0.01-3 wt % thiol-ene photopolymerization initiator; 0-10 wt % fumed silica; and 0-5 wt % polydimethylsiloxane; wherein weight-percent values are relative to composition weight, the composition has a molar ratio of SiH/vinyl functional groups that is greater than 0.3 and at the same time less than 0.

Abstract: An ultraviolet (UV) curable organopolysiloxane composition with excellent workability when applied to a substrate is provided, in which a product obtained by curing the composition has a low dielectric constant. The UV curable organopolysiloxane composition comprises (A) one or more organosiloxane and/or organopolysiloxane having an average of two or more UV reactive functional groups in one molecule, and (B) one or more organosilane, organosiloxane, and/or organopolysiloxane having one UV reactive functional group in one molecule. An organic solvent is not included in the composition. In addition to components (A) and (B), the composition can comprise one or a plurality of additives selected from a group consisting of: (D1) nonionic surfactants not containing a silicon atom and are not acrylic; (D2) nonionic surfactants containing a silicon atom and having an HLB value of 4 or less; and (D3) silicone oils with a viscosity of 90 mPa-s or less at 25° C.

Abstract: The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.

Abstract: The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.

Abstract: A curable silicone composition includes at least: (A) an organopolysiloxane represented by an average composition formula and having at least two alkenyl groups in the molecule thereof; (B) an organopolysiloxane having at least two silicon-atom-bonded hydrogen atoms in the molecule thereof, at least 5 mol % of silicon-atom-bonded groups other than hydrogen atoms being aryl groups; (C) an organopolysiloxane represented by an average unit formula and having an alkenyl group, an aryl group, and an epoxy-containing organic group; and (D) a hydrosilylation catalyst. The silicone composition can be cured to form an optical semiconductor device having good efficiency.