Abstract: An image sensor device has a first number of first pixels disposed in a substrate and a second number of second pixels disposed in the substrate. The first number is substantially equal to the second number. A light-blocking structure disposed over the first pixels and the second pixels. The light-blocking structure defines a plurality of first openings and second openings through which light can pass. The first openings are disposed over the first pixels. The second openings are disposed over the second pixels. The second openings are smaller than the first openings. A microcontroller is configured to turn on different ones of the second pixels at different points in time.

Abstract: A method for fabricating nonenzymatic glucose sensor, which comprises steps of: (a) providing a bottom substrate; (b) preparing a graphene layer on the bottom substrate; (c) depositing plural amount of zinc oxide (ZnO) seed crystals on the graphene layer; (d) growing the ZnO seed crystals into columnar nanorods with hydrothermal method; (e) coating a thin film of cuprous oxide (Cu2O) on the surface of the ZnO nanorods by electrochemistry-based electrodeposition; and (f) grafting single-walled carbon nanotubes (SWCNTs) on surface of the Cu2O thin film, by using Nafion fixative composited with SWCNTs. The structure of the above sensor, therefore, comprises a bottom substrate and other components orderly assembled on it, including, from inside to outside, a graphene layer, plural amount of ZnO nanorods, a Cu2O thin film, plural amount of SWCNTs, and the Nafion fixative. Accordingly, the sensor has advantages of low cost, rapid response, and easy for preservation.

Abstract: The present disclosure provides an optical structure and a method for fabricating an optical structure, the method includes forming a light detection region in a substrate, forming an isolation structure at surrounding the light detection region, and forming a primary grid over the isolation structure, including forming a metal layer over the isolation structure, forming a first dielectric layer over the metal layer, and partially removing the metal layer and the first dielectric layer with a first mask by patterning, and forming a secondary grid at least partially surrounded by the primary grid laterally.

Abstract: A plurality of photovoltaic junctions for a subpixel may be formed in a semiconductor substrate. After thinning the backside of the semiconductor substate, at least one transparent refraction structure may be formed on the backside surface of the thinned semiconductor substrate. Each transparent refraction structure has a variable thickness that decreases with a lateral distance from a vertical axis passing through a geometrical center of the second-conductivity-type pillar structures for the subpixel. A subpixel optics assembly including an optical lens may be formed over the at least one transparent refraction structure. Each transparent refraction structure may reduce the tilt angle of light that propagate downward into the photodetectors, and increases total internal reflection of light and increase the efficiency of the photodetectors.

Abstract: A plurality of photovoltaic junctions for a subpixel may be formed in a semiconductor substrate. After thinning the backside of the semiconductor substrate, at least one transparent refraction structure may be formed on the backside surface of the thinned semiconductor substrate. Each transparent refraction structure has a variable thickness that decreases with a lateral distance from a vertical axis passing through a geometrical center of the second-conductivity-type pillar structures for the subpixel. A subpixel optics assembly including an optical lens may be formed over the at least one transparent refraction structure. Each transparent refraction structure may reduce the tilt angle of light that propagate downward into the photodetectors, and increases total internal reflection of light and increase the efficiency of the photodetectors.

Abstract: The present disclosure provides an optical structure and a method for fabricating an optical structure, the method includes forming a light detection region in a substrate, forming an isolation structure at surrounding the light detection region, and forming a primary grid over the isolation structure, including forming a metal layer over the isolation structure, forming a first dielectric layer over the metal layer, and partially removing the metal layer and the first dielectric layer with a first mask by patterning, and forming a secondary grid at least partially surrounded by the primary grid laterally.

Abstract: The present disclosure provides an optical structure, including a substrate, a light detection region in the substrate, an isolation structure in the substrate, surrounding the light detection region, a color filter layer over the substrate, and a dielectric grid structure in the color filter layer, the dielectric grid structure overlapping with the light detection region.

Abstract: A plurality of photovoltaic junctions for a subpixel may be formed in a semiconductor substrate. After thinning the backside of the semiconductor substrate, at least one transparent refraction structure may be formed on the backside surface of the thinned semiconductor substrate. Each transparent refraction structure has a variable thickness that decreases with a lateral distance from a vertical axis passing through a geometrical center of the second-conductivity-type pillar structures for the subpixel. A subpixel optics assembly including an optical lens may be formed over the at least one transparent refraction structure. Each transparent refraction structure may reduce the tilt angle of light that propagate downward into the photodetectors, and increases total internal reflection of light and increase the efficiency of the photodetectors.

Abstract: The present disclosure provides an optical structure, including a substrate, a light detection region in the substrate, an isolation structure in the substrate, surrounding the light detection region, a color filter layer over the substrate, and a dielectric grid structure in the color filter layer, the dielectric grid structure overlapping with the light detection region.

Abstract: A charging cabinet includes a housing including a plurality of horizontal storage chambers for storing mobile electronic devices, a mounting chamber at a back side relative to the horizontal storage chambers, a plurality of flip covers pivotally mounted at a front panel thereof and biasable to close/open the respective horizontal storage chambers and clocks for locking the respective flip covers, and a power supply unit including a power input module mounted at a back panel of the housing and electrically connectable to an external power source for power input, and a power socket module and an expansion module respectively electrically connected to the power input module with respective power jacks and respective USB connectors thereof arranged at different elevations to face toward the respective horizontal storage chambers for the connection of the respective storage mobile electronic device for charging.

Abstract: The present disclosure illustrates a charging cabinet in which a main body comprises a frame defining a receiving space, a panel disposed on a front surface of the frame, a hinge lid movably disposed on the panel corresponding in position to the receiving space, a locking device disposed at a side of the hinge lid and configured to control open or lock of the hinge lid. The power supply device comprises a power input module connected with an external power source for supplying power to a power socket module and an expansion connection module which comprise a socket and an adaptor socket respectively. An electronic device can be placed into the receiving space to be charged through the power socket module or expansion connection module, and the hinge lid can be locked by the locking device, so as to achieve anti-theft effect.

Abstract: A charging cabinet includes a housing including a plurality of horizontal storage chambers for storing mobile electronic devices, a mounting chamber at a back side relative to the horizontal storage chambers, a plurality of flip covers pivotally mounted at a front panel thereof and biasable to close/open the respective horizontal storage chambers and clocks for locking the respective flip covers, and a power supply unit including a power input module mounted at a back panel of the housing and electrically connectable to an external power source for power input, and a power socket module and an expansion module respectively electrically connected to the power input module with respective power jacks and respective USB connectors thereof arranged at different elevations to face toward the respective horizontal storage chambers for the connection of the respective storage mobile electronic device for charging.