Patents by Inventor YUNLONG KONG

YUNLONG KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230306730
    Abstract: The present disclosure discloses an extraction method of raft culture area based on multi-temporal optical remote sensing images, including: constructing a raft culture marker sample library including culture types such as fish, shellfish, and algae; optimizing the deep learning model of the UNet network by using ASPP (Atrous Spatial Pyramid Pooling) and the shape constraint module; using the deep learning model to extract a corresponding multi-temporal raft culture area by using the multi-temporal optical remote sensing images with medium resolution in the target area; combining prior knowledge, fusing the extraction results of the raft culture area to obtain a final extraction results of the raft culture area.
    Type: Application
    Filed: November 2, 2022
    Publication date: September 28, 2023
    Applicant: Aerospace Information Research Institute, Chinese Academy of Sciences
    Inventors: Chengyi WANG, Lianfa LI, Lei WANG, Zujia WANG, Yunlong KONG, Yi ZHANG
  • Patent number: 11133275
    Abstract: A method for manufacturing a bond pad structure includes providing a substrate structure including a substrate, a first metal layer on the substrate, and a passivation layer on the first metal layer, the passivation layer having an opening extending to the first metal layer; and filling the opening of the passivation layer with a second metal layer. The bond pad structure has a significantly increased thickness compared with the thickness of the exposed portion of the first metal layer in the opening, thereby ensuring wire bonding reliability and yield.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: September 28, 2021
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Yunlong Kong
  • Publication number: 20180096958
    Abstract: A method for manufacturing a bond pad structure includes providing a substrate structure including a substrate, a first metal layer on the substrate, and a passivation layer on the first metal layer, the passivation layer having an opening extending to the first metal layer; and filling the opening of the passivation layer with a second metal layer. The bond pad structure has a significantly increased thickness compared with the thickness of the exposed portion of the first metal layer in the opening, thereby ensuring wire bonding reliability and yield.
    Type: Application
    Filed: July 28, 2017
    Publication date: April 5, 2018
    Inventor: YUNLONG KONG