Patents by Inventor Yunn-Tzu Yu

Yunn-Tzu Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board structure and spliced circuit board
    Patent number: 11477886
    Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: October 18, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Yunn-Tzu Yu, Ching-Ho Hsieh, Wang-Hsiang Tsai
  • CIRCUIT BOARD STRUCTURE AND SPLICED CIRCUIT BOARD
    Publication number: 20220232702
    Abstract: A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.
    Type: Application
    Filed: July 5, 2021
    Publication date: July 21, 2022
    Applicant: Unimicron Technology Corp.
    Inventors: Yunn-Tzu Yu, Ching-Ho Hsieh, Wang-Hsiang Tsai