Patents by Inventor Yunqiang Yang

Yunqiang Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless interconnects in an interposer
    Patent number: 9165791
    Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: October 20, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Xiaoxia Wu, Yunqiang Yang, Chengjie Zuo, Durodami Joscelyn Lisk
  • WIRELESS INTERCONNECTS IN AN INTERPOSER
    Publication number: 20150115405
    Abstract: Some implementations provide an interposer that includes a substrate, a first passive device in the substrate, and a second passive device. The first passive device includes a first set of through substrate vias (TSVs) in the substrate. The second passive device is configured to wirelessly couple to the first passive device. In some implementations, the second passive device includes a second set of through substrate vias (TSVs) in the substrate. In some implementations, the second passive device is configured to inductively couple to the first passive device. In some implementations, the first passive device is a first inductor and the second passive device is a second inductor. In some implementations, the interposer further includes a first set of interconnects coupled to the first set of TSVs, and a second set of interconnects coupled to the second set of TSVs.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Applicant: QUALCOMM Incorporated
    Inventors: Xiaoxia Wu, Yunqiang Yang, Chengjie Zuo, Durodami Joscelyn Lisk