Patents by Inventor Yunxiang Hu

Yunxiang Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ZnO multilayer chip varistor with base metal inner electrodes and preparation method thereof
    Patent number: 9236170
    Abstract: Provided are a multilayer chip ZnO varistor with base metal inner electrodes and a preparation method thereof. The varistor is formed by ceramic sheets and inner electrodes which were alternately laminated. Wherein the main material of inner electrodes is the base metal nickel(Ni), both ends of the varistor are coated with silver electrodes.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: January 12, 2016
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qiuyun Fu, Dongxiang Zhou, Yunxiang Hu, Zhiping Zheng, Wei Luo, Tao Chen
  • Laminated chip composite resistor combining thermistor and varistor and preparation method thereof
    Patent number: 9159477
    Abstract: Provided are a laminated chip composite resistor combining a thermistor and a varistor, and a preparation method thereof. The composite resistor comprises a varistor part, a transition layer part and a thermistor part overlapped sequentially, wherein the varistor part is formed by alternately laminating a ceramic layer of a varistor, a first electrode layer, another ceramic layer of a varistor and a second electrode layer; the thermistor part is formed by alternately laminating a ceramic layer of a thermistor, a third electrode layer, another ceramic layer of a thermistor and a fourth electrode layer; and the transition layer part is located between the thermistor part and the varistor part. Co-firing is employed and the base metal Ni is the main material of inner electrodes, which can reduce costs, simplify the preparation process, and improve the reliability.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: October 13, 2015
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qiuyun Fu, Dongxiang Zhou, Yunxiang Hu, Zhiping Zheng, Wei Luo, Tao Chen
  • LAMINATED CHIP COMPOSITE RESISTOR COMBINING THERMISTOR AND VARISTOR AND PREPARATION METHOD THEREOF
    Publication number: 20150145639
    Abstract: Provided are a laminated chip composite resistor combining a thermistor and a varistor, and a preparation method thereof. The composite resistor comprises a varistor part, a transition layer part and a thermistor part overlapped sequentially, wherein the varistor part is formed by alternately laminating a ceramic layer of a varistor, a first electrode layer, another ceramic layer of a varistor and a second electrode layer; the thermistor part is formed by alternately laminating a ceramic layer of a thermistor, a third electrode layer, another ceramic layer of a thermistor and a fourth electrode layer; and the transition layer part is located between the thermistor part and the varistor part. Co-firing is employed and the base metal Ni is the main material of inner electrodes, which can reduce costs, simplify the preparation process, and improve the reliability.
    Type: Application
    Filed: June 30, 2014
    Publication date: May 28, 2015
    Inventors: Qiuyun Fu, Dongxiang Zhou, Yunxiang Hu, Zhiping Zheng, Wei Luo, Tao Chen
  • ZnO MULTILAYER CHIP VARISTOR WITH BASE METAL INNER ELECTRODES AND PREPARATION METHOD THEREOF
    Publication number: 20150145638
    Abstract: Provided are a multilayer chip ZnO varistor with base metal inner electrodes and a preparation method thereof. The varistor is formed by ceramic sheets and inner electrodes which were alternately laminated. Wherein the main material of inner electrodes is the base metal nickel(Ni), both ends of the varistor are coated with silver electrodes.
    Type: Application
    Filed: June 30, 2014
    Publication date: May 28, 2015
    Inventors: Qiuyun Fu, Dongxiang Zhou, Yunxiang Hu, Zhiping Zheng, Wei Luo, Tao Chen