Abstract: An integrated circuit package including a die substrate having a first and second die surfaces, a die high voltage input power connection in the die substrate to receive a high voltage input power and transmit the high voltage input power to a high voltage power trace on the first die surface, a power converter module on the first die surface and electrically connected to the high voltage power trace to convert the high voltage input power to a low voltage output power, a low voltage power trace located on the first die surface and electrically connected to the power converter module to carry the low voltage output power to a circuit die on the first die surface. A method of manufacturing the integrated circuit package and a computer having one or more circuits that include the package is also disclosed.

Abstract: A virtual keyboard with dynamically adjusted recognition zones for predicted user-intended characters. When a user interaction with the virtual keyboard is received on the virtual keyboard, a character in a recognition zone encompassing the detected interaction location is selected as the current input character. Characters likely to be the next input character are predicted based on the current input character. The recognition zones of the predicted next input characters are adjusted to be larger than their original sizes.

Abstract: A virtual keyboard with dynamically adjusted recognition zones for predicted user-intended characters. When a user interaction with the virtual keyboard is received on the virtual keyboard, a character in a recognition zone encompassing the detected interaction location is selected as the current input character. Characters likely to be the next input character are predicted based on the current input character. The recognition zones of the predicted next input characters are adjusted to be larger than their original sizes.