Patents by Inventor Yurie NAKAMURA

Yurie NAKAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10351728
    Abstract: A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Mariko Takahara, Kenji Mimura, Yurie Nakamura, Motoki Masaki
  • Patent number: 10177068
    Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: January 8, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji Mimura, Yurie Nakamura, Xiaohong Yin, Kazuhiro Tada
  • Patent number: 9983230
    Abstract: A probe pin according to an embodiment of the present invention has a two-piece structure consisting of a pogo pin part and a barrel part, in which the pogo pin part includes an upper plunger having an outside contact point at an upper end, a lower plunger having an outside contact point at a lower end, and a spring portion composed of one or more springs and connected to a lower end of the upper plunger and an upper end of the lower plunger; and the barrel part has a cylindrical shape surrounding a portion of the pogo pin part and has a barrel-fixing spring portion protruding on an outer side of the barrel part to apply elasticity outward.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 29, 2018
    Inventors: Seon Young Choi, Yurie Nakamura
  • Publication number: 20170219623
    Abstract: A probe pin according to an embodiment of the present invention has a two-piece structure consisting of a pogo pin part and a barrel part, in which the pogo pin part includes an upper plunger having an outside contact point at an upper end, a lower plunger having an outside contact point at a lower end, and a spring portion composed of one or more springs and connected to a lower end of the upper plunger and an upper end of the lower plunger; and the barrel part has a cylindrical shape surrounding a portion of the pogo pin part and has a barrel-fixing spring portion protruding on an outer side of the barrel part to apply elasticity outward.
    Type: Application
    Filed: February 23, 2016
    Publication date: August 3, 2017
    Inventors: Seon Young CHOI, Yurie NAKAMURA
  • Publication number: 20160115343
    Abstract: A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties.
    Type: Application
    Filed: January 10, 2014
    Publication date: April 28, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Mariko TAKAHARA, Kenji MIMURA, Yurie NAKAMURA, Motoki MASAKI
  • Publication number: 20160013116
    Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
    Type: Application
    Filed: March 11, 2014
    Publication date: January 14, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenji MIMURA, Yurie NAKAMURA, Xiaohong YIN, Kazuhiro TADA