Patents by Inventor Yurika OTSUKA

Yurika OTSUKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting structure, structural component, and method for manufacturing mounting structure
    Patent number: 10686267
    Abstract: A mounting structure has a first board, an extended portion which is extended from the end portion of the first board and has a smaller thickness than the first board, and a second board having a connection terminal connected to a connector. The second board is placed on the extended portion.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: June 16, 2020
    Assignee: NEC CORPORATION
    Inventor: Yurika Otsuka
  • Electronic component, and electronic component manufacturing method
    Patent number: 10643976
    Abstract: An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: May 5, 2020
    Assignee: NEC CORPORATION
    Inventors: Yurika Otsuka, Tsutomu Takeda, Hironobu Ikeda, Yuki Matsumoto
  • MOUNTING STRUCTURE, STRUCTURAL COMPONENT, AND METHOD FOR MANUFACTURING MOUNTING STRUCTURE
    Publication number: 20190245285
    Abstract: A mounting structure has a first board, an extended portion which is extended from the end portion of the first board and has a smaller thickness than the first board, and a second board having a connection terminal connected to a connector. The second board is placed on the extended portion.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 8, 2019
    Applicant: NEC CORPORATION
    Inventor: Yurika OTSUKA
  • ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
    Publication number: 20180261577
    Abstract: An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.
    Type: Application
    Filed: February 12, 2018
    Publication date: September 13, 2018
    Applicant: NEC Corporation
    Inventors: Yurika OTSUKA, Tsutomu TAKEDA, Hironobu IKEDA, Yuki MATSUMOTO