Patents by Inventor Yuriy Atanasov

Yuriy Atanasov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dynamic release tapes for assembly of discrete components
    Patent number: 11942354
    Abstract: A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 26, 2024
    Assignee: Uniqarta, Inc.
    Inventors: Val Marinov, Yuriy Atanasov
  • DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
    Publication number: 20220130694
    Abstract: A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.
    Type: Application
    Filed: February 14, 2020
    Publication date: April 28, 2022
    Inventors: Val Marinov, Yuriy Atanasov
  • DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
    Publication number: 20210375659
    Abstract: A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 2, 2021
    Inventors: Val Marinov, Yuriy Atanasov
  • DYNAMIC RELEASE TAPES FOR ASSEMBLY OF DISCRETE COMPONENTS
    Publication number: 20210375649
    Abstract: A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 2, 2021
    Inventors: Val Marinov, Yuriy Atanasov
  • Placing ultra-small or ultra-thin discrete components
    Patent number: 10748802
    Abstract: A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 18, 2020
    Assignee: Uniqarta, Inc.
    Inventors: Val Marinov, Yuriy Atanasov
  • Placing Ultra-Small or Ultra-Thin Discrete Components
    Publication number: 20190057891
    Abstract: A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.
    Type: Application
    Filed: January 12, 2017
    Publication date: February 21, 2019
    Applicant: Uniqarta, Inc.
    Inventors: Val Marinov, Yuriy Atanasov