Patents by Inventor Yushi Sato
Yushi Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021281Abstract: An information management apparatus includes at least one processor configured to acquire first time information and second time information, the first time information being related to a time taken to acquire a predetermined amount of at least one or more specific nucleic acids based on a first cell acquired from a cancer patient, the second time information being related to a time taken to culture a second cell different from the first cell until a predetermined amount is reached; and store individual patient information in which the first time information and the second time information are associated with attribute information of the cancer patient.Type: ApplicationFiled: September 27, 2023Publication date: January 18, 2024Inventors: Masahiro OKANOJO, Tatsuya MATSUNO, Mao KAMEDA, Yushi SATO, Shangwu CHEN, Yuma SUZUKI, Ryosuke TAKAHASHI, Tetsuya NAKATSURA
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Patent number: 11825591Abstract: A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.Type: GrantFiled: August 26, 2020Date of Patent: November 21, 2023Assignee: FUJI ELECTRIC CO., LTD.Inventor: Yushi Sato
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Publication number: 20230227773Abstract: A culture manufacturing method that includes: bringing adherent cells into contact with a dissolvable culture carrier that is larger than the size of the adherent cells and disposing the adherent cells on the surface of the dissolvable culture carrier, subjecting the adherent cells disposed on the surface of the dissolvable culture carrier to suspension culture in a culture medium, subjecting the dissolvable culture carrier to a modification treatment that modifies at least a portion of the surface in order to detach the adherent cells in the suspension culture from the surface of the dissolvable culture carrier, and, following the modification treatment, separating and harvesting the adherent cells from the modified dissolvable culture carrier that is larger than the size of the adherent cells on the basis of the size difference.Type: ApplicationFiled: March 29, 2022Publication date: July 20, 2023Applicant: RESONAC CORPORATIONInventors: Yushi Sato, Masahiro Okanojo, Shangwu Chen, Ryosuke Takahashi
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Publication number: 20230104790Abstract: Provided is a method for evaluating a sample, the method including using a mixture containing a sample including at least one member selected from the group consisting of cell support-derived components, a cell suspension containing cells, an evaluation sample obtained from a cell suspension, a sample containing a liquid and microcarriers for use in cell culture, and a sample containing a liquid obtained following treatment of microcarriers, together with at least one substance selected from the group consisting of an aromatic compound having at least one functional group selected from the group consisting of a hydroxyl group, an amino group, a nitro group and a carbonyl group, and a fluorescent dye.Type: ApplicationFiled: September 25, 2020Publication date: April 6, 2023Applicant: Showa Denko Materials Co., Ltd.Inventors: Masashi Maruyama, Hirotaka Sakuma, Yushi Sato, Yasuhiko Tada
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Publication number: 20220328665Abstract: A semiconductor module includes: a first power semiconductor element that includes a first main current electrode; a main body that accommodates therein the first power semiconductor element; and a first main current terminal connectable to the first main current electrode. The main body includes: a top face; a side face that connects to the top face; a bottom face fixable to a cooler; and a recessed portion that is on the side face, and accommodates therein an end portion of an insulating member. The first main current terminal protrudes from the side face of the main body, and includes: a first face; and a second face on an opposite side of the first face. The second face is closer to the bottom face than the first face on the side face. The recessed portion is on the side face between the bottom face and the second face, and is at a position apart from the bottom face.Type: ApplicationFiled: February 22, 2022Publication date: October 13, 2022Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yushi SATO
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Publication number: 20220315898Abstract: One embodiment relates to a method for manufacturing a cell suspension, the method including (A), (B) and (C) described below: (A) culturing adherent cells in a cell suspension containing the adherent cells, a microcarrier and a medium, and having a volume of at least 0.3 L, (B) culturing the adherent cells in a cell suspension containing the adherent cells obtained through (A), a microcarrier and a medium, and having a volume of at least 5 L, and (C) culturing the adherent cells in a cell suspension containing the adherent cells obtained through (B), a microcarrier and a medium, and having a volume of at least 10 L.Type: ApplicationFiled: December 22, 2020Publication date: October 6, 2022Applicant: Showa Denko Materials Co., Ltd.Inventors: Shangwu Chen, Fumiko Nakagawa, Yasuhiko Tada, Masahiro Okanojo, Yushi Sato, Yuma Suzuki, Katsuhiko Nakashima, Ryosuke Takahashi
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Publication number: 20220306980Abstract: Apparatus, system, and method are disclosed for cell recovery or cell separation. A cell separation system has at least a first container having a first filter for separating a first removal target from a suspension comprising cells and a removal target including at least the first removal target and a second removal target; a cell separation apparatus; a first flow path connecting the first container and the cell separation apparatus; and a first pump interposed in the first flow path for transferring the suspension from the first container to the cell separation apparatus by decompression suction, for example.Type: ApplicationFiled: December 15, 2020Publication date: September 29, 2022Applicant: SHOWA DENKO MATERIALS CO., LTD.Inventors: Yushi Sato, Masahiro Okanojo, Shangwu Chen, Katsuhiko Nakashima, Ryosuke Takahashi, Yasuhiko Tada
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Publication number: 20220278018Abstract: A semiconductor device includes a semiconductor chip, an insulated circuit board including a metal plate, an insulating plate and a circuit pattern, each of which has a rectangular shape, and a spacer part disposed on the periphery of a rear surface of the metal plate including at least one of the four corners thereof. The spacer part protrudes from a rear surface of the metal plate in the thickness direction away from a front surface of the insulated circuit board.Type: ApplicationFiled: January 27, 2022Publication date: September 1, 2022Applicant: FUJI ELECTRIC CO., LTD.Inventors: Yushi SATO, Yuichiro HINATA, Naoyuki KANAI
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Publication number: 20210120706Abstract: A semiconductor module, including a cooler having first and second flow passages respectively formed on first and second sides of the semiconductor module that are opposite to each other, and a third flow passage connecting the first and second flow passages. The semiconductor module further includes a laminated substrate disposed on the cooler and having first to third circuit boards, a first sensing chip having a sensing function for detecting a temperature and a first non-sensing chip not having the sensing function, disposed on the first circuit board side by side along the third flow passage, and a second sensing chip having the sensing function and a second non-sensing chip not having the sensing function, disposed on the third circuit board side by side along the third flow passage. The first and second sensing chips are respectively disposed on the second side and the first side of the semiconductor module.Type: ApplicationFiled: August 26, 2020Publication date: April 22, 2021Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yushi SATO
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Publication number: 20210050277Abstract: A semiconductor apparatus, including an insulated substrate having a first surface and a second surface that are opposite to each other, a semiconductor element that is mounted on the first surface of the insulated substrate, and a cooler for cooling the semiconductor element. The cooler includes a heat dissipation board having a bonding surface and a heat dissipation surface that are opposite to each other, the bonding surface being bonded to the second surface of the insulated substrate, a plurality of fins provided on the heat dissipation surface of the heat dissipation board, and a cooling case having a recess accommodating the plurality of fins, an inner wall surface of the cooling case being in the recess. The heat dissipation surface is provided with a plurality of engagement pieces that position the cooling case by engaging portions of the inner wall surface of the cooling case.Type: ApplicationFiled: September 30, 2020Publication date: February 18, 2021Applicant: FUJI ELECTRIC CO., LTD.Inventor: Yushi SATO
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Patent number: 9047549Abstract: To provide an antenna for dipole-type IC tag, which can conform to various IC chip specifications and communication frequencies in a wide area without causing an increase in the size of antenna, while advantageously suppressing a decrease in a communication distance caused by a defect part in an antenna pattern, in an antenna for dipole-type IC tag, an antenna radiation part is configured by extending an antenna wire in a radiation part extending direction, while repeatedly forming a pair of branch paths that branches in a direction intersecting with the radiation part extending direction, and a connection path which connects the pair of branch paths. The connection path is configured to extend in the radiation part extending direction from a junction of a pair of branch paths to a branch point of a next pair of branch paths.Type: GrantFiled: July 29, 2011Date of Patent: June 2, 2015Assignee: SINFONIA TECHNOLOGY CO., LTD.Inventors: Yuji Yamanaka, Yushi Sato, Hisakazu Shibata
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Patent number: 8892338Abstract: A damping apparatus for an automobile is provided, capable of ensuring a high level of reliability while obtaining excellent damping effect with simple configuration. The damping apparatus for an automobile that reduces vibrations of an automobile body may include an actuator that is attached to the automobile body and drives an auxiliary mass; a current detector that detects a current flowing through an armature of the actuator; a section that detects a terminal voltage applied to the actuator; a calculation circuit that calculates an induced voltage of the actuator, and further calculates at least one of the relative velocity, relative displacement, and relative acceleration of the actuator, based on a current detected by the current detector and the terminal voltage; and a control circuit that drive-controls the actuator based on at least one of the relative velocity, relative displacement, and relative acceleration of the actuator calculated by the calculation circuit.Type: GrantFiled: April 10, 2012Date of Patent: November 18, 2014Assignee: Shinko Electric Co., Ltd.Inventors: Yasushi Muragishi, Hideaki Moriya, Yushi Sato, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Takayoshi Fujii, Takashi Onoue, Masaaki Narihisa
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Patent number: 8818625Abstract: A damping apparatus for an automobile is provided, capable of ensuring a high level of reliability while obtaining excellent damping effect with simple configuration. The damping apparatus for an automobile that reduces vibrations of an automobile body may include an actuator that is attached to the automobile body and drives an auxiliary mass; a current detector that detects a current flowing through an armature of the actuator; a section that detects a terminal voltage applied to the actuator; a calculation circuit that calculates an induced voltage of the actuator, and further calculates at least one of the relative velocity, relative displacement, and relative acceleration of the actuator, based on a current detected by the current detector and the terminal voltage; and a control circuit that drive-controls the actuator based on at least one of the relative velocity, relative displacement, and relative acceleration of the actuator calculated by the calculation circuit.Type: GrantFiled: April 10, 2012Date of Patent: August 26, 2014Assignee: Shinko Electric Co., Ltd.Inventors: Yasushi Muragishi, Hideaki Moriya, Yushi Sato, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Takayoshi Fujii, Takashi Onoue, Masaaki Narihisa
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Patent number: 8626386Abstract: A damping apparatus for an automobile is provided, capable of ensuring a high level of reliability while obtaining excellent damping effect with simple configuration. The damping apparatus for an automobile that reduces vibrations of an automobile body may include an actuator that is attached to the automobile body and drives an auxiliary mass; a current detector that detects a current flowing through an armature of the actuator; a section that detects a terminal voltage applied to the actuator; a calculation circuit that calculates an induced voltage of the actuator, and further calculates at least one of the relative velocity, relative displacement, and relative acceleration of the actuator, based on a current detected by the current detector and the terminal voltage; and a control circuit that drive-controls the actuator based on at least one of the relative velocity, relative displacement, and relative acceleration of the actuator calculated by the calculation circuit.Type: GrantFiled: April 10, 2012Date of Patent: January 7, 2014Assignee: Shinko Electric Co., Ltd.Inventors: Yasushi Muragishi, Hideaki Moriya, Yushi Sato, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Takayoshi Fujii, Takashi Onoue, Masaaki Narihisa
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Publication number: 20130306743Abstract: To provide an antenna for dipole-type IC tag, which can conform to various IC chip specifications and communication frequencies in a wide area without causing an increase in the size of antenna, while advantageously suppressing a decrease in a communication distance caused by a defect part in an antenna pattern, in an antenna for dipole-type IC tag, an antenna radiation part is configured by extending an antenna wire in a radiation part extending direction, while repeatedly forming a pair of branch paths that branches in a direction intersecting with the radiation part extending direction, and a connection path which connects the pair of branch paths. The connection path is configured to extend in the radiation part extending direction from a junction of a pair of branch paths to a branch point of a next pair of branch paths.Type: ApplicationFiled: July 29, 2011Publication date: November 21, 2013Applicant: SINFONIA TECHNOLOGY CO., LTD.Inventors: Yuji Yamanaka, Yushi Sato, Hisakazu Shibata
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Patent number: 8560129Abstract: [Object] To predetermine a target vibration level and keep vibration generated at a position at which vibration is to be controlled equal to or smaller than a target vibration level.Type: GrantFiled: May 13, 2009Date of Patent: October 15, 2013Assignee: Sinfonia Technology Co., Ltd.Inventors: Hideaki Moriya, Yushi Sato, Takeo Ito, Katsuyoshi Nakano, Yasushi Muragishi
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Patent number: 8504239Abstract: A damping apparatus for an automobile is provided, capable of ensuring a high level of reliability while obtaining excellent damping effect with simple configuration. The damping apparatus for an automobile that reduces vibrations of an automobile body may include an actuator that is attached to the automobile body and drives an auxiliary mass; a current detector that detects a current flowing through an armature of the actuator; a section that detects a terminal voltage applied to the actuator; a calculation circuit that calculates an induced voltage of the actuator, and further calculates at least one of the relative velocity, relative displacement, and relative acceleration of the actuator, based on a current detected by the current detector and the terminal voltage; and a control circuit that drive-controls the actuator based on at least one of the relative velocity, relative displacement, and relative acceleration of the actuator calculated by the calculation circuit.Type: GrantFiled: April 10, 2012Date of Patent: August 6, 2013Assignee: Shinko Electric Co., Ltd.Inventors: Yasushi Muragishi, Hideaki Moriya, Yushi Sato, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Takayoshi Fujii, Takashi Onoue, Masaaki Narihisa
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Patent number: 8401735Abstract: A damping apparatus for an automobile is provided, capable of ensuring a high level of reliability while obtaining excellent damping effect with simple configuration. The damping apparatus for an automobile that reduces vibrations of an automobile body may include an actuator that is attached to the automobile body and drives an auxiliary mass; a current detector that detects a current flowing through an armature of the actuator; a section that detects a terminal voltage applied to the actuator; a calculation circuit that calculates an induced voltage of the actuator, and further calculates at least one of the relative velocity, relative displacement, and relative acceleration of the actuator, based on a current detected by the current detector and the terminal voltage; and a control circuit that drive-controls the actuator based on at least one of the relative velocity, relative displacement, and relative acceleration of the actuator calculated by the calculation circuit.Type: GrantFiled: April 27, 2007Date of Patent: March 19, 2013Assignee: Shinko Electric Co., Ltd.Inventors: Yaushi Muragishi, Hideaki Moriya, Yushi Sato, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Takayoshi Fujii, Takashi Onoue, Masaaki Narihisa
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Patent number: 8381579Abstract: The present invention provides a vibration damping device which can enhance a vibration damping effect even in a case where a vibration damping target position and a vibration damping force generation position are different from each other.Type: GrantFiled: May 13, 2009Date of Patent: February 26, 2013Assignee: Sinfonia Technology Co., Ltd.Inventors: Yushi Sato, Hideaki Moriya, Takeo Ito, Takayoshi Fujii, Takashi Fukunaga, Katsuyoshi Nakano, Hiroshi Nakagawa, Hidetoshi Katada, Takeshi Tomizaki, Takashi Onoue, Yasushi Muragishi
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Publication number: 20120222929Abstract: An automobile vibration damping device for an automobile in which a power plant in which an engine, a transmission and the like are combined is supported by a vehicle body, including a vibrating means that generates vibration separate from vibration of the engine. Thereby, it is possible to reduce the vibration amplitude of a seat portion by the reaction force of the vibrating means. Also, if the vibration mode of the vehicle body is adjusted so as to become a node in the vicinity of the seat portion, the vibration amplitude decreases in the vicinity of the seat portion, and improves riding comfort.Type: ApplicationFiled: May 11, 2012Publication date: September 6, 2012Applicant: SINFONIA TECHNOLOGY CO., LTD.Inventors: Yasushi MURAGISHI, Takayoshi FUJII, Takashi FUKUNAGA, Hideaki MORIYA, Katsuyoshi NAKANO, Hiroshi NAKAGAWA, Takashi ONOUE, Yushi SATO