Abstract: According to one embodiment, an isolator includes a first coil, a second coil, a plate-shaped first magnet, and a first insulator. The second coil is aligned with the first coil along a first axis and faces the first coil. The first magnet is provided on a side of the second coil and faces the second coil, the side being opposite to a side where the first coil is located. The first magnet extends along a first plane intersecting the first axis. The first insulator seals the first coil, the second coil, and the first magnet.

Abstract: According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.

Abstract: According to one embodiment, an isolator includes: an isolator module including a first coil and a second coil that are separated with respect to a first direction and face each other; a magnetic member provided on the isolator module in such a manner that the magnetic member overlaps the first coil and the second coil when viewed in the first direction; and an insulating member covering the isolator module and the magnetic member.

Abstract: According to one embodiment, an isolator includes a first wiring board and a second wiring board. The first wiring board includes a first insulating layer including first and second principal surfaces; a first coil provided on the first principal surface; and a first pad provided on the first principal surface and electrically connected to the first coil. The second wiring board includes a second insulating layer including third and fourth principal surfaces; a second coil provided on the third principal surface; and a second pad provided on the fourth principal surface and electrically connected to the second coil. The first and second coils are arranged in such a manner as to face each other, and an external size of the second wiring board is smaller than an external size of the first wiring board.

Abstract: A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.

Abstract: According to one embodiment, a semiconductor device c includes: a package substrate including a base including a mount portion, and terminals; a semiconductor chip including a first pad to which a ground voltage is supplied, a second pad electrically connected to a first terminal among the terminals, and a semiconductor circuit connected to the first and second pads, the semiconductor chip being provided above the mount portion; and a first capacitor chip including a first capacitor unit provided in a silicon substrate, a first node supplied with the ground voltage, and a second node electrically connected to the second pad, the first capacitor chip being provided above the mount portion.

Abstract: An engine control device configured to control an engine includes: a turbocharger having a turbine that is configured to be driven by exhaust gas of the engine; and a compressor coupled to the turbine and configured to compress fresh air; an air-bypass passage that communicates between an upstream and a downstream of the compressor; an air-bypass valve configured to open/close the passage; a canister configured to store evaporated fuel gas generated in a fuel tank; an ejector configured to suction the evaporated fuel gas from the canister by using differential pressure between the upstream and the downstream of the compressor and introduce the evaporated fuel gas to the upstream; a purge valve configured to open/close a purge passage through which the evaporated fuel gas is to delivered from the canister to the ejector; and a purge valve diagnosis unit configured to detect stuck open malfunction of the purge valve.

Abstract: An engine control device configured to control an engine includes: a turbocharger having a turbine that is configured to be driven by exhaust gas of the engine; and a compressor coupled to the turbine and configured to compress fresh air; an air-bypass passage that communicates between an upstream and a downstream of the compressor; an air-bypass valve configured to open/close the passage; a canister configured to store evaporated fuel gas generated in a fuel tank; an ejector configured to suction the evaporated fuel gas from the canister by using differential pressure between the upstream and the downstream of the compressor and introduce the evaporated fuel gas to the upstream; a purge valve configured to open/close a purge passage through which the evaporated fuel gas is to delivered from the canister to the ejector; and a purge valve diagnosis unit configured to detect stuck open malfunction of the purge valve.

Abstract: According to one embodiment, a memory card includes a ground layer, a memory, a controller, a first communication unit and a second communication unit. The ground layer is provided with a first region, a second region and an opening between the first region and the second region. The memory is overlapped with the first region. The controller is overlapped with the second region. The second communication unit including a part configured to transmit/receive an electromagnetic wave.

Abstract: According to one embodiment, a memory card includes a ground layer, a memory, a controller, a first communication unit and a second communication unit. The ground layer is provided with a first region, a second region and an opening between the first region and the second region. The memory is overlapped with the first region. The controller is overlapped with the second region. The second communication unit including a part configured to transmit/receive an electromagnetic wave.

Abstract: According to one embodiment, a design support apparatus includes a first detector configured to detect a cable connected to the printed circuit board, a second detector configured to detect a conducting component from components of a housing, a third detector configured to detect an electromagnetic wave radiating component from electronic components mounted on the printed circuit board, a fourth detector configured to detect a path which propagates the electromagnetic waves, a first setting module configured to set, as sources, the electromagnetic wave radiating component and the path, a second setting module configured to set, for the sources, intensity attributes corresponding to an operation clock frequency of the electromagnetic wave radiating component, a calculator configured to calculate spaces of the sources, the spaces includes volumes corresponding to the intensity attributes, and a determining module configured to determine whether at least one of the cable passes at least one of the spaces.

Abstract: According to one embodiment, a system including a decoder and a high definition multimedia interface (HDMI) whose copy protection protocol has been modified to allow the received uncompressed digital audio-video content from the decoder to be re-encoded and recorded.

Abstract: According to one embodiment, a design support system which supports verification of design of a product, the system includes material information acquiring unit which acquires information on a material for each of the part shape models for the product including a housing, reference ground setting unit which sets one of the part shape models to be a reference ground, extracting/measuring unit which extracts conductive paths from the part shape models ranging from the part shape model set to be check target to the part shape model serving as the reference ground on the basis of the information on the material for each of the part models, and measuring the lengths of the extracted paths, and detecting unit which detects where electromagnetic radiation of a level equal to or greater than a criterion value is likely to leak outside the housing.