Abstract: A piezoelectric speaker (10) includes: a piezoelectric film (35); a fixing face (17) for fixing the piezoelectric film (35) to a support; and an interposed layer (40) disposed between the piezoelectric film (35) and the fixing face (17). The interposed layer (40) has a holding degree of 5×108 N/m3 or less.

Abstract: An active noise control system (500) includes a structure (80) and a plurality of piezoelectric speakers (10). The piezoelectric speakers (10) are disposed on a surface (80s) of the structure (80). The piezoelectric speakers (10) each have a radiation surface extending along a first direction (D1) and a second direction (D2). The first direction (D1) is a direction along which centers of the radiation surfaces of the piezoelectric speakers (10) are arranged so that the piezoelectric speakers (10) are adjacent to each other. The second direction (D2) is a direction orthogonal to the first direction (D1). The radiation surface of each of the piezoelectric speakers (10) is shorter in a dimension (L1) in the first direction (D1) than in a dimension (L2) in the second direction (D2).

Abstract: A speaker (10) includes a radiation surface (15). The radiation surface (15) has a first region (15a), a second region (15b), and a third region (15c) between the first region (15a) and the second region (15b). When an axis passing through the third region (15c) and extending away from the radiation surface (15) is defined as a reference axis (10X), the speaker (10) forms a first wavefront (16a) propagating from the first region so as to approach the reference axis (10X) and a second wavefront (16b) propagating from the second region (15b) so as to approach the reference axis (10X).

Abstract: A piezoelectric speaker-forming laminate (10) includes: a piezoelectric film (35); a pressure-sensitive adhesive face (17); an interposed layer (40) being a porous body layer and/or a resin layer disposed between the piezoelectric film (35) and the pressure-sensitive adhesive face (17); and a release layer (20) joined to the pressure-sensitive adhesive face (17). The pressure-sensitive adhesive face (17) is disposed in such a manner that at least a portion of the piezoelectric film (35) overlaps the pressure-sensitive adhesive face (17) when the piezoelectric film (35) is viewed in plan. The piezoelectric film (35) and the interposed layer (40) are allowed to be fixed to a support (80) as a piezoelectric speaker or a portion of a piezoelectric speaker by sticking the pressure-sensitive adhesive face (17) from which the release layer (20) has been removed to the support (80).

Abstract: A piezoelectric speaker-forming laminate (10) includes: a piezoelectric film (35); a pressure-sensitive adhesive face (17); an interposed layer (40) being a porous body layer and/or a resin layer disposed between the piezoelectric film (35) and the pressure-sensitive adhesive face (17); and a release layer (20) joined to the pressure-sensitive adhesive face (17). The pressure-sensitive adhesive face (17) is disposed in such a manner that at least a portion of the piezoelectric film (35) overlaps the pressure-sensitive adhesive face (17) when the piezoelectric film (35) is viewed in plan. The piezoelectric film (35) and the interposed layer (40) are allowed to be fixed to a support (80) as a piezoelectric speaker or a portion of a piezoelectric speaker by sticking the pressure-sensitive adhesive face (17) from which the release layer (20) has been removed to the support (80).

Abstract: A piezoelectric speaker (10) includes: a piezoelectric film (35); a fixing face (17) for fixing the piezoelectric film (35) to a support; and an interposed layer (40) disposed between the piezoelectric film (35) and the fixing face (17). The interposed layer (40) has a holding degree of 5×108 N/m3 or less.

Abstract: A sound reducing system (500) includes at least one sound reducing speaker for radiating a sound wave for sound reduction. The at least one sound reducing speaker includes a piezoelectric speaker (10). The piezoelectric speaker (10) includes a piezoelectric film (35), a fixing face (17) in contact with a support supporting the piezoelectric speaker (35), and a film holding portion (55) disposed between the piezoelectric film (35) and the fixing face (17). (i) The film holding portion (55) includes a pressure-sensitive adhesive layer and the fixing face (17) is formed of a surface of the pressure-sensitive adhesive layer and/or (ii) the film holding portion (55) includes a porous body layer.

Abstract: A piezoelectric speaker (10) includes a piezoelectric film (35), a first joining layer (51), and an interposed layer (40). The piezoelectric film (35) includes a first electrode (61), a second electrode (62), and a piezoelectric body (30) sandwiched by the first electrode (61) and the second electrode (62). The first joining layer (51) is a layer having pressure-sensitive adhesiveness or adhesiveness. The interposed layer (40) is disposed between the piezoelectric film (35) and the first joining layer (51). Both principal surfaces of the piezoelectric film (35) vibrate up and down as a whole.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.

Abstract: A method for producing an organic electroluminescence device using a roll-to-roll method includes the step of sticking a belt-shaped sealing substrate 5 transported while being applied with tension on a belt-shaped supporting substrate 21 on which an organic electroluminescence element is formed, wherein either one substrate of the supporting substrate 21 or the sealing substrate 5 has a tensile modulus of elasticity larger than that of another substrate, in the step, the sticking is performed in the middle of transporting the belt-shaped supporting substrate 21 in the long-side direction while being applied with tension, and in the step, the substrate having a smaller tensile modulus of elasticity is applied with tension less than or equal to 170 N/m and the substrate having a larger tensile modulus of elasticity is applied with tension greater than the tension applied to the substrate having a smaller tensile modulus of elasticity.

Abstract: A radiant heat conduction-suppressing sheet according to an embodiment of the present invention includes: a heat conduction-suppressing layer and a heat conductive layer. The heat conduction-suppressing layer has a heat conductivity of 0.06 W/m·K or less. The heat conductive layer has a far-infrared absorptivity at a wavelength of 7 ?m to 10 ?m of 0.6 or less, and a heat conductivity of 200 W/m·K or more. The radiant heat conduction-suppressing sheet is used by being fixed to a housing containing a heating element under a state in which a side of the heat conduction-suppressing layer is fixed to the housing at such a position that the heat conductive layer faces a heat radiating surface of the heating element while being free of close contact with the heating element.

Abstract: A layout system performs layout on a printed document to readily and uniformly treat a plurality of types of print products, and performs the layout on content of a document using a template associated with a design theme to be applied to the plurality of types of print products associated with a usage of the printed document.

Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.