Patents by Inventor Yusuke Kubo
Yusuke Kubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11315889Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level.Type: GrantFiled: June 18, 2019Date of Patent: April 26, 2022Assignee: DEXERIALS CORPORATIONInventors: Yusuke Kubo, Sergey Bolotov
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Publication number: 20220089919Abstract: A thermally conductive sheet includes a sheet body and an adhesive layer. The sheet body is obtained by curing a thermally conductive resin composition. The thermally conductive resin composition includes a polymer matrix component and a fibrous thermally conductive filler. The adhesive layer is formed on at least one surface of the sheet body and imparts tackiness to the at least one surface of the sheet body. A volume of the adhesive layer is 0.0002 cm3 or more and 0.001 cm3 or less per 1 cm2 of the sheet body.Type: ApplicationFiled: January 21, 2020Publication date: March 24, 2022Applicant: DEXERIALS CORPORATIONInventors: Yusuke KUBO, Keisuke ARAMAKI
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Publication number: 20220080718Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.Type: ApplicationFiled: January 21, 2020Publication date: March 17, 2022Applicant: DEXERIALS CORPORATIONInventors: Yusuke KUBO, Keisuke ARAMAKI
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Patent number: 11264451Abstract: A semiconductor device includes a semiconductor layer having a first surface and a second surface, a first region of a first conductivity type formed on the first surface side of the semiconductor layer, a second region of a second conductivity type in contact with the first region, a third region of the first conductivity type that is in contact with the second region and exposed from the first surface side of the semiconductor layer, a gate electrode facing the second region through a gate insulating film, a first electrode that is physically separated from the gate electrode and faces the second region and the third region through an insulating film, a second electrode formed on the semiconductor layer and electrically connected to the first region, the second region, and the first electrode, and a third electrode electrically connected to the third region.Type: GrantFiled: March 19, 2020Date of Patent: March 1, 2022Assignee: ROHM CO., LTD.Inventor: Yusuke Kubo
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Publication number: 20220051189Abstract: An automatic negotiation apparatus is an apparatus for automatically negotiating with the other party. The automatic negotiation apparatus includes: a proposal candidate setting unit configured to set proposal candidates to be presented to the other party in a negotiation; a utility value calculation unit configured to calculate a utility value indicating a utility for when the candidate is accepted by the other party for each of the set candidates; a priority setting unit configured to select a candidate that meets set criteria using the utility value for each of the candidates, and further set a priority of each of the selected candidates; and a proposal unit configured to propose one of the selected candidates to the other party according to the priority.Type: ApplicationFiled: March 14, 2019Publication date: February 17, 2022Applicant: NEC CorporationInventors: Yusuke KUBO, Satoshi MORINAGA, Shinji NAKADAI
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Publication number: 20210296264Abstract: Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level.Type: ApplicationFiled: June 18, 2019Publication date: September 23, 2021Applicant: DEXERIALS CORPORATIONInventors: Yusuke KUBO, Sergey BOLOTOV
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Patent number: 11127850Abstract: A semiconductor device includes a first conductivity type semiconductor layer including an active cell portion and an outer peripheral portion around the active cell portion, a second conductivity type body region selectively formed at a surface portion of the semiconductor layer in the active cell portion, a first conductivity type source region formed at an inner part of the body region, a gate electrode that faces a part of the body region through a gate insulating film, a second conductivity type column layer straddling a boundary between the active cell portion and the outer peripheral portion inside the semiconductor layer such that the column layer is disposed at a lower part of the body region in the active cell portion, a source electrode that is electrically connected to the source region, and an outer peripheral electrode that is electrically connected to the column layer in the outer peripheral portion.Type: GrantFiled: January 25, 2018Date of Patent: September 21, 2021Assignee: ROHM CO., LTD.Inventor: Yusuke Kubo
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Publication number: 20210272879Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor element 30; a conductive cooling member 40 provided above the semiconductor element 30, a conductive thermally conductive member 10 that is provided between the semiconductor element 30 and the cooling member 40 and contains a cured resin. The conductive thermally conductive member 10 is connected to a ground 60 in the substrate 50 to electrically connect the cooling member 40 and the ground 60.Type: ApplicationFiled: June 19, 2019Publication date: September 2, 2021Applicant: Dexerials CorporationInventors: Yusuke KUBO, Sergey BOLOTOV
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Publication number: 20210225777Abstract: Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor device 1 includes a semiconductor device 30; a tubular conductive shield can 20 provided to surround a side surface 30a of the semiconductor device 30; a conductive cooling member 40; and a conductive thermally conductive sheet 10 formed between the semiconductor device 30 and the cooling member 40. The conductive shield can 20 and the cooling member 40 are electrically connected through the conductive thermally conductive sheet 10 therebetween.Type: ApplicationFiled: June 19, 2019Publication date: July 22, 2021Applicant: Dexerials CorporationInventors: Sergey BOLOTOV, Yusuke KUBO
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Publication number: 20210074698Abstract: A semiconductor device includes a semiconductor layer, a first conductor disposed on the semiconductor layer, a second conductor disposed on the semiconductor layer so as to be separated from the first conductor, a relay portion that is formed on the semiconductor layer so as to straddle the first conductor and the second conductor and that is made of a semiconductor having a first conductivity type region and a second conductivity type region, a first contact by which the first conductivity type region and the second conductivity type region are electrically connected to the first conductor, and a second contact that electrically connects the first conductivity type region of the relay portion and the second conductor together and that is insulated from the second conductivity type region.Type: ApplicationFiled: March 29, 2019Publication date: March 11, 2021Inventor: Yusuke KUBO
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Patent number: 10892204Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.Type: GrantFiled: March 24, 2017Date of Patent: January 12, 2021Assignee: Dexerials CorporationInventors: Tatsuo Kumura, Yusuke Kubo, Keisuke Aramaki, Hiroyuki Ryoson
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Patent number: 10847616Abstract: A semiconductor device includes: semiconductor layer having first and second surfaces; first base region of first conductivity type formed in the semiconductor layer; second base region of second conductivity type adjacent to the first base region and formed in the semiconductor layer; first surface region of the second conductivity type selectively formed in the first base region; second surface region of the first conductivity type selectively formed in the second base region separate from the first base region; gate electrode facing portion of the first base region between boundary between the first and second base regions and the first surface region and portion of the second base region between the boundary and the second surface region, the gate electrode extending across the boundary; first and second electrodes connected to the first and second surface regions respectively; and third electrode connected in common to the first and second base regions.Type: GrantFiled: March 27, 2019Date of Patent: November 24, 2020Assignee: ROHM CO., LTD.Inventor: Yusuke Kubo
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Publication number: 20200312955Abstract: A semiconductor device includes a semiconductor layer having a first surface and a second surface, a first region of a first conductivity type formed on the first surface side of the semiconductor layer, a second region of a second conductivity type in contact with the first region, a third region of the first conductivity type that is in contact with the second region and exposed from the first surface side of the semiconductor layer, a gate electrode facing the second region through a gate insulating film, a first electrode that is physically separated from the gate electrode and faces the second region and the third region through an insulating film, a second electrode formed on the semiconductor layer and electrically connected to the first region, the second region, and the first electrode, and a third electrode electrically connected to the third region.Type: ApplicationFiled: March 19, 2020Publication date: October 1, 2020Inventor: Yusuke KUBO
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Patent number: 10720525Abstract: A semiconductor device includes: a semiconductor layer of a first conductive type having a first surface and a second surface opposite to the first surface; a body region of a second conductive type selectively formed on the first surface of the semiconductor layer; a source region of the first conductive type formed inside the body region; a gate electrode opposing part of the body region via a gate insulating film; a column layer of the second conductive type formed at the second surface side with respect to the body region; an embedded electrode embedded in the column layer such that the embedded electrode is electrically isolated from the column layer; and a first electrode electrically connected to the embedded electrode.Type: GrantFiled: March 19, 2019Date of Patent: July 21, 2020Assignee: ROHM CO., LTD.Inventor: Yusuke Kubo
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Publication number: 20190305130Abstract: A semiconductor device includes: a semiconductor layer of a first conductive type having a first surface and a second surface opposite to the first surface; a body region of a second conductive type selectively formed on the first surface of the semiconductor layer; a source region of the first conductive type formed inside the body region; a gate electrode opposing part of the body region via a gate insulating film; a column layer of the second conductive type formed at the second surface side with respect to the body region; an embedded electrode embedded in the column layer such that the embedded electrode is electrically isolated from the column layer; and a first electrode electrically connected to the embedded electrode.Type: ApplicationFiled: March 19, 2019Publication date: October 3, 2019Inventor: YUSUKE KUBO
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Publication number: 20190305086Abstract: A semiconductor device includes: semiconductor layer having first and second surfaces; first base region of first conductivity type formed in the semiconductor layer; second base region of second conductivity type adjacent to the first base region and formed in the semiconductor layer; first surface region of the second conductivity type selectively formed in the first base region; second surface region of the first conductivity type selectively formed in the second base region separate from the first base region; gate electrode facing portion of the first base region between boundary between the first and second base regions and the first surface region and portion of the second base region between the boundary and the second surface region, the gate electrode extending across the boundary; first and second electrodes connected to the first and second surface regions respectively; and third electrode connected in common to the first and second base regions.Type: ApplicationFiled: March 27, 2019Publication date: October 3, 2019Inventor: YUSUKE KUBO
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Publication number: 20190080978Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.Type: ApplicationFiled: March 24, 2017Publication date: March 14, 2019Applicant: Dexerials CorporationInventors: Tatsuo KUMURA, Yusuke KUBO, Keisuke ARAMAKI, Hiroyuki RYOSON
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Patent number: 10103228Abstract: A semiconductor device includes a semiconductor layer, having a drain region, a body region, and a source region, a gate electrode, facing the body region via a gate insulating film, a first pillar layer disposed inside the semiconductor layer so as to be continuous to the body region, and a trap level region, disposed inside the semiconductor layer and containing charged particles that form a trap level, and an electric field concentration portion, where an electric field concentrates in an off state in which a channel is not formed in the body region, and the trap level region are disposed at mutually different depth positions in a depth direction of the first pillar layer.Type: GrantFiled: March 16, 2017Date of Patent: October 16, 2018Assignee: ROHM CO., LTD.Inventor: Yusuke Kubo
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Publication number: 20180219092Abstract: A semiconductor device includes a first conductivity type semiconductor layer including an active cell portion and an outer peripheral portion around the active cell portion, a second conductivity type body region selectively formed at a surface portion of the semiconductor layer in the active cell portion, a first conductivity type source region formed at an inner part of the body region, a gate electrode that faces a part of the body region through a gate insulating film, a second conductivity type column layer straddling a boundary between the active cell portion and the outer peripheral portion inside the semiconductor layer such that the column layer is disposed at a lower part of the body region in the active cell portion, a source electrode that is electrically connected to the source region, and an outer peripheral electrode that is electrically connected to the column layer in the outer peripheral portion.Type: ApplicationFiled: January 25, 2018Publication date: August 2, 2018Inventor: Yusuke KUBO
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Patent number: 10002704Abstract: A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.Type: GrantFiled: November 27, 2013Date of Patent: June 19, 2018Assignee: DEXERIALS CORPORATIONInventors: Tatsuo Kumura, Yusuke Kubo