Patents by Inventor Yusuke Tanazawa
Yusuke Tanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9681595Abstract: The present invention relates to a cover tape and to an electronic component package that uses the cover tape, the cover tape including at least a substrate layer, a heat seal layer, and an antistatic layer, the antistatic layer containing (A) an ionic liquid including a cyclic quaternary nitrogen-containing cation, (B) a quaternary ammonium salt, and (C) a polyalkylene glycol being formed on a surface toward the heat seal layer, and an anion constituting the (A) ionic liquid including a cyclic quaternary nitrogen-containing cation and the (B) quaternary ammonium salt being one or more anions selected from the group consisting of carboxylic acids, sulfuric acid esters, phosphoric acid esters, sulfonic acids, and phosphoric acids.Type: GrantFiled: June 12, 2012Date of Patent: June 13, 2017Assignee: DENKA COMPANY LIMITEDInventors: Yusuke Tanazawa, Takeshi Ono
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Patent number: 8828535Abstract: Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20.Type: GrantFiled: November 5, 2009Date of Patent: September 9, 2014Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hisatsugu Tokunaga, Yusuke Tanazawa
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Publication number: 20140134365Abstract: The present invention relates to a cover tape and to an electronic component package that uses the cover tape, the cover tape including at least a substrate layer, a heat seal layer, and an antistatic layer, the antistatic layer containing (A) an ionic liquid including a cyclic quaternary nitrogen-containing cation, (B) a quaternary ammonium salt, and (C) a polyalkylene glycol being formed on a surface toward the heat seal layer, and an anion constituting the (A) ionic liquid including a cyclic quaternary nitrogen-containing cation and the (B) quaternary ammonium salt being one or more anions selected from the group consisting of carboxylic acids, sulfuric acid esters, phosphoric acid esters, sulfonic acids, and phosphoric acids.Type: ApplicationFiled: June 12, 2012Publication date: May 15, 2014Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Yusuke Tanazawa, Takeshi Ono
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Publication number: 20140037940Abstract: A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) includes a resin composition which includes (a) a styrene-based resin composition and (b) an ethylene-?-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50 mass %, and which has a Vicat softening temperature of 55 to 80° C., while the heat seal layer (D) includes an acrylic resin having a glass transition temperature of 55 to 80° C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape.Type: ApplicationFiled: March 27, 2012Publication date: February 6, 2014Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Tetsuo Fujimura, Hisatsugu Tokunaga, Yusuke Tanazawa, Takeshi Ono, Tomoharu Watanabe, Akira Sasaki, Takayuki Iwasaki, Kazuya Sugimoto
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Patent number: 8453421Abstract: The method for packaging together a plurality of record rolls of cover tape according to the present invention comprises wrapping a stack obtained by roughly coaxially stacking said record rolls in a heat-shrink film; and heat-shrinking said heat-shrink film, so that a pressure of at least 0.8 mN/mm2 and at most 1.2 mN/mm2 is applied between the record rolls. This method will not deform the rolled state after packaging, while suppressing the occurring of roll collapse when exposed to a high-temperature environment or a low-temperature environment.Type: GrantFiled: August 29, 2008Date of Patent: June 4, 2013Assignee: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hisatsugu Tokunaga, Yusuke Tanazawa
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Publication number: 20110212324Abstract: Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20.Type: ApplicationFiled: November 5, 2009Publication date: September 1, 2011Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHAInventors: Hisatsugu Tokunaga, Yusuke Tanazawa
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Publication number: 20100275554Abstract: The method for packaging together a plurality of record rolls of cover tape according to the present invention comprises wrapping a stack obtained by roughly coaxially stacking said record rolls in a heat-shrink film; and heat-shrinking said heat-shrink film, so that a pressure of at least 0.8 mN/mm2 and at most 1.2 mN/mm2 is applied between the record rolls. This method will not deform the rolled state after packaging, while suppressing the occurring of roll collapse when exposed to a high-temperature environment or a low-temperature environment.Type: ApplicationFiled: August 29, 2008Publication date: November 4, 2010Applicant: Denki Kagaku Kogyo Kabushiki KaishaInventors: Hisatsugu Tokunaga, Yusuke Tanazawa