Patents by Inventor Yusuke Tanazawa

Yusuke Tanazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9681595
    Abstract: The present invention relates to a cover tape and to an electronic component package that uses the cover tape, the cover tape including at least a substrate layer, a heat seal layer, and an antistatic layer, the antistatic layer containing (A) an ionic liquid including a cyclic quaternary nitrogen-containing cation, (B) a quaternary ammonium salt, and (C) a polyalkylene glycol being formed on a surface toward the heat seal layer, and an anion constituting the (A) ionic liquid including a cyclic quaternary nitrogen-containing cation and the (B) quaternary ammonium salt being one or more anions selected from the group consisting of carboxylic acids, sulfuric acid esters, phosphoric acid esters, sulfonic acids, and phosphoric acids.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: June 13, 2017
    Assignee: DENKA COMPANY LIMITED
    Inventors: Yusuke Tanazawa, Takeshi Ono
  • Patent number: 8828535
    Abstract: Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: September 9, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hisatsugu Tokunaga, Yusuke Tanazawa
  • Publication number: 20140134365
    Abstract: The present invention relates to a cover tape and to an electronic component package that uses the cover tape, the cover tape including at least a substrate layer, a heat seal layer, and an antistatic layer, the antistatic layer containing (A) an ionic liquid including a cyclic quaternary nitrogen-containing cation, (B) a quaternary ammonium salt, and (C) a polyalkylene glycol being formed on a surface toward the heat seal layer, and an anion constituting the (A) ionic liquid including a cyclic quaternary nitrogen-containing cation and the (B) quaternary ammonium salt being one or more anions selected from the group consisting of carboxylic acids, sulfuric acid esters, phosphoric acid esters, sulfonic acids, and phosphoric acids.
    Type: Application
    Filed: June 12, 2012
    Publication date: May 15, 2014
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Yusuke Tanazawa, Takeshi Ono
  • Publication number: 20140037940
    Abstract: A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) includes a resin composition which includes (a) a styrene-based resin composition and (b) an ethylene-?-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50 mass %, and which has a Vicat softening temperature of 55 to 80° C., while the heat seal layer (D) includes an acrylic resin having a glass transition temperature of 55 to 80° C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape.
    Type: Application
    Filed: March 27, 2012
    Publication date: February 6, 2014
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Tetsuo Fujimura, Hisatsugu Tokunaga, Yusuke Tanazawa, Takeshi Ono, Tomoharu Watanabe, Akira Sasaki, Takayuki Iwasaki, Kazuya Sugimoto
  • Patent number: 8453421
    Abstract: The method for packaging together a plurality of record rolls of cover tape according to the present invention comprises wrapping a stack obtained by roughly coaxially stacking said record rolls in a heat-shrink film; and heat-shrinking said heat-shrink film, so that a pressure of at least 0.8 mN/mm2 and at most 1.2 mN/mm2 is applied between the record rolls. This method will not deform the rolled state after packaging, while suppressing the occurring of roll collapse when exposed to a high-temperature environment or a low-temperature environment.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: June 4, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hisatsugu Tokunaga, Yusuke Tanazawa
  • Publication number: 20110212324
    Abstract: Provided is a cover tape that has a small range of stripping strength and generates little static electricity when stripped at a high speed. The cover tape according to the present invention comprises at least a substrate layer, an intermediate layer, a charge transfer layer, and a heat seal layer, characterized in that (A) the charge transfer layer containing an acid-modified polyolefin resin and a conductive agent, and (B) the heat seal layer containing (a) a thermoplastic resin component composed of an acrylic resin, and (b) a styrene-conjugated diene copolymer or a hydrogenated resin thereof, the mass ratio of the two components ((a)/(b)) being 20/80 to 80/20.
    Type: Application
    Filed: November 5, 2009
    Publication date: September 1, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hisatsugu Tokunaga, Yusuke Tanazawa
  • Publication number: 20100275554
    Abstract: The method for packaging together a plurality of record rolls of cover tape according to the present invention comprises wrapping a stack obtained by roughly coaxially stacking said record rolls in a heat-shrink film; and heat-shrinking said heat-shrink film, so that a pressure of at least 0.8 mN/mm2 and at most 1.2 mN/mm2 is applied between the record rolls. This method will not deform the rolled state after packaging, while suppressing the occurring of roll collapse when exposed to a high-temperature environment or a low-temperature environment.
    Type: Application
    Filed: August 29, 2008
    Publication date: November 4, 2010
    Applicant: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hisatsugu Tokunaga, Yusuke Tanazawa