Abstract: The present invention provides a method for producing instant noodles having fresh noodle-like texture and flavor and having an excellent reconstitution property even if the noodles are thick. In the present invention, superheated steam flow is directly sprayed to raw noodle strings for 5 to 50 seconds such that a temperature of superheated steam to which surfaces of the noodle strings are exposed becomes 125 to 220° C., the noodle strings are supplied with moisture using water or hot water, the noodle strings are further steamed by directly spraying the superheated steam flow to the noodle strings for 5 to 50 seconds and/or steamed by using non-superheated steam, and the noodle strings are dried to produce the instant noodles.

Abstract: A surface conditioning composition for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes at least one kind of zinc compound particles selected from the group consisting of zinc oxide particles, zinc hydroxide particles, and basic zinc carbonate particles; phosphoric acid and/or condensed phosphoric acid; and an amine compound having a specific structure and in which the zinc compound particles are dispersed and stabilized by the phosphoric acid and/or condensed phosphoric acid, and the amine compound.

Abstract: The present invention provides a surface conditioning composition having a surface conditioning function that is even more superior as compared with conventional surface conditioning compositions. A surface conditioning composition is provided for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes nearly spherical zinc phosphate particles having an average particle diameter from 0.05 ?m to 3 ?m, and in which the zinc phosphate particles are produced by mixing at least one kind of zinc compound particles selected from the group consisting of zinc oxide, zinc hydroxide, and basic zinc carbonate with phosphoric acid and/or condensed phosphoric acid to allow for their reaction in an acidic aqueous solution having a pH lower than 7, and dispersing and stabilizing by a dispersion means.

Abstract: The present invention provides a method for producing instant noodles having fresh noodle-like texture and flavor and having an excellent reconstitution property even if the noodles are thick. In the present invention, superheated steam flow is directly sprayed to raw noodle strings for 5 to 50 seconds such that a temperature of superheated steam to which surfaces of the noodle strings are exposed becomes 125 to 220° C., the noodle strings are supplied with moisture using water or hot water, the noodle strings are further steamed by directly spraying the superheated steam flow to the noodle strings for 5 to 50 seconds and/or steamed by using non-superheated steam, and the noodle strings are dried to produce the instant noodles.

Abstract: A surface conditioning composition is provided in which a titanium phosphate compound can be stored in the state of a dispersion liquid for a long period of time while being stably present in the dispersion liquid, with favorable stability also in the bath, and with the composition being capable of forming a conversion coating film in a sufficient amount of the film even in the case of application to conversion resistant metal materials such as high-tensile steel sheets.

Abstract: The present invention provides a surface conditioning composition having a surface conditioning function that is even more superior as compared with conventional surface conditioning compositions. A surface conditioning composition is provided for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes nearly spherical zinc phosphate particles having an average particle diameter from 0.05 ?m to 3 ?m, and in which the zinc phosphate particles are produced by mixing at least one kind of zinc compound particles selected from the group consisting of zinc oxide, zinc hydroxide, and basic zinc carbonate with phosphoric acid and/or condensed phosphoric acid to allow for their reaction in an acidic aqueous solution having a pH lower than 7, and dispersing and stabilizing by a dispersion means.

Abstract: A surface conditioning composition for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes at least one kind of zinc compound particles selected from the group consisting of zinc oxide particles, zinc hydroxide particles, and basic zinc carbonate particles; phosphoric acid and/or condensed phosphoric acid; and an amine compound having a specific structure and in which the zinc compound particles are dispersed and stabilized by the phosphoric acid and/or condensed phosphoric acid, and the amine compound.

Abstract: A surface conditioning composition is provided in which a titanium phosphate compound can be stored in the state of a dispersion liquid for a long period of time while being stably present in the dispersion liquid, with favorable stability also in the bath, and with the composition being capable of forming a conversion coating film in a sufficient amount of the film even in the case of application to conversion resistant metal materials such as high-tensile steel sheets. A conversion coating film in a sufficient amount of the coating film can be formed with favorable dispersibility by blending an amine compound having a specified structure, an aromatic organic acid, a phenolic compound, a phenolic resin and the like in a surface conditioning composition, which contains the titanium phosphate compound and has a specified pH.

Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.

Abstract: A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet.

Abstract: A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

Abstract: A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.

Abstract: An electrochromic display device comprising two electrode substrates, at least one of which is transparent is prepared by applying a solution containing one or more transition metal compounds under an inert atmosphere to the surface of at least one of said electrode substrates. Then, the solution is dried so as to form an electrochromic layer on the surface of the electrode substrate. The drying is carried out by using a temperature ranging between room temperature and 120.degree. C. Finally, the two electrode substrates are fixed in a manner to face each other with an ionic conductor layer or electrolyte layer disposed therebetween to obtain the electrochromic display device.