Abstract: A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.

Abstract: A tape feeder pulls out a component supply tape including a cover tape adhered on a carrier tape accommodating multiple components from a reel, feeds the component supply tape to a predetermined supply position, and separates the cover tape from the carrier tape in front of the supply position to expose a component on the carrier tape. The tape feeder includes a pair of rotating members configured to separate the cover tape from the carrier tape by pinching and drawing the cover tape; a drum member configured to rotate and wind the cover tape drawn by the pair of rotating members; and a torque limiter provided in a rotary shaft of the drum member.

Abstract: A tape feeder feeds a component supply tape including a cover tape adhered on a carrier tape accommodating multiple components to a predetermined supply position, and separates the cover tape from the carrier tape in front of the supply position to expose a component on the carrier tape. The tape feeder includes a pair of rotating members configured to separate the cover tape from the carrier tape by pinching and drawing the cover tape; a drum member configured to rotate and wind the cover tape drawn by the pair of rotating members; a driving motor; and a distribution mechanism configured to distribute a rotational driving force from the driving motor to one rotating member of the pair of rotating members and the drum member.

Abstract: A mounting accuracy measurement chip includes a chip main body; and one or more protrusions provided on a mounting face of the chip main body, which serve as a contact surface with a mounting target at a position shifted from the mounting face of the chip main body. The one or more protrusions are disposed only within a range defined by a circle whose center is center of gravity of the mounting face and whose radius is half the length of the longest distance from center of gravity to the outer edge of chip main body. Further, a mounting accuracy measurement kit includes the above-mentioned mounting accuracy measurement chip and placement portion, having a degree of adhesiveness, to which the contact surface of mounting accuracy measurement chip, which can be placed, adheres.

Abstract: A work device including a cover provided on a base to form a work space between the cover and the base; a linear motor disposed in the work space having an extended stator and a movable element moving along the stator in a transfer direction; and a work executing section provided on the movable element to execute a predetermined work; wherein the movable element includes: a heat-dissipating section to dissipate heat generated from a constituent member to air, the constituent member constituting at least one of the movable element and the work executing section; a duct, covering the heat-dissipating section, having an intake port and an exhaust port; and a blower to blow the air from the intake port of to the exhaust port.

Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

Abstract: The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height.

Abstract: A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.

Abstract: A component mounting machine includes a mark imaging camera that images a board mark of a circuit board and has a function of identifying an identification target, such as a character attached to an upper surface of a component supplied by a component supply device. An illumination light source illuminates the identification target on the upper surface of the component imaged by the mark imaging camera and is attached to a lower portion of an electric component holding frame provided to protrude to the side of the mounting head. As the identification target on the upper surface of the component, which is illuminated by the illumination light source from obliquely above, is imaged by the mark imaging camera from above and the image is processed, the identification target on the upper surface of the component is identified.

Abstract: A component mounting machine that performs mounting of components by moving a mounting head attached to slide using linear motor, stator of the linear motor that is forms of magnets arranged side by side is arranged on base, movable element is fixed to a slide so as to pass through the stator, and bracket for holding a portion of wires for supplying power to the linear motor and wire protector is fixed to the movable element. Since the bracket is located at a position close to the axis line of the movable element, the rotational moment acting on the slide due to the deformation resistance of the wires and the wire protector caused by the movement of the slide is reduced, and appropriate movement of the slide is ensured.

Abstract: A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

Abstract: A mounting accuracy measurement chip includes a chip main body; and one or more protrusions provided on a mounting face of the chip main body, which serve as a contact surface with a mounting target at a position shifted from the mounting face of the chip main body. The one or more protrusions are disposed only within a range defined by a circle whose center is center of gravity of the mounting face and whose radius is half the length of the longest distance from center of gravity to the outer edge of chip main body. Further, a mounting accuracy measurement kit includes the above-mentioned mounting accuracy measurement chip and placement portion, having a degree of adhesiveness, to which the contact surface of mounting accuracy measurement chip, which can be placed, adheres.

Abstract: An illumination device configured to illuminate an imaging target, an image of which is to be captured by a camera, provided with a current adjusting device configured to adjust a current flowing through the LEDs of four LED-mounted boards on which many of the LEDs are mounted, wherein the four LED-mounted boards are arranged in a four-sided shape centered around the light axis of the camera as viewed from the imaging target, and each of the LED-mounted boards is inclined at a specified angle so that the LEDs of the LED-mounted boards face the imaging target. The current adjusting device is configured to divide an LED-mounted area of each of the LED-mounted boards into multiple illumination areas and to individually adjust the current flowing to the LEDs of each of the LED-mounted boards for each of the multiple illumination areas.

Abstract: An optimization processing computer, before production starts, sends a production job on which optimization processing was performed but is incomplete to each component mounter, causes an automatic exchanging device to operate so as to change the feeder arrangement of each component mounter to a feeder arrangement specified in the production job, then causes each component mounter to operate so as to start production. After production is started, optimization processing on the production job is continued by the optimization processing computer, and during production, an updated production job for which optimization has progressed is acquired from the optimization processing computer so as to update the production job being executed by each component mounter, then the automatic exchanging device is operated so as to change the feeder arrangement of each component mounter to a feeder arrangement specified in the production job, then production continues.

Abstract: A CPU of a management computer, when a work allocation processing routine is started, first, acquires a specified accuracy of each mounter, then acquires required accuracies of component types for components from a first to a last component to be mounted on a single board. Next, the CPU of the management computer performs allocation of mounting work of components from the first to the last component, and then ends the routine. Specifically, the CPU, for each component, allocates the mounting work of a given component to a mounter with a specified accuracy that satisfies the required accuracy for that component type.

Abstract: A board work system including ark arrangement members, on which are arranged multiple marks that have a specified relative positional relationship, are arranged straddling first work area in which first work head moves and second work area in which second work head moves, and, when performing work with respect to a board, which is a single board held by a board holding device in a state straddling the first work area and the second work area, based on positions of the marks in first work area measured based on image data of first imaging device that is moved along with the first work head and positions of the marks in second work area measured based on image data of second imaging device that is moved along with the second work head.

Abstract: To provide a control device and a control method of a component mounting machine which is capable of improving the accuracy of mounting control. In a case where the holding member is moved from a current position to a predetermined processing position within the component mounting machine, the control device of the component mounting machine moves a holding member to a preparation position which is set to a defined propelling direction and distance with respect to the processing position, and then moves the holding member from the preparation position to a mounting position.

Abstract: A CPU of a management computer sets an nth component in a mounting operation order of the current sequence as a target component, calculates nearby state data of the target component, sets the required accuracy of the target component based on the nearby state data and memorizes the required accuracy of HDD. Because the required accuracy is automatically set based on the nearby state data in this manner, the set required accuracy matches actual circumstances better compared to than with conventional technology. Therefore, it is possible to automatically set appropriate required accuracy of a target component.

Abstract: There is provided a component mounting machine in which when detecting a lowermost end position of a component sucked by a suction nozzle, a lower edge position of the component is detected at predetermined intervals from a left side and a right side using the lowermost end position as a reference. The component mounting machine derives an approximate straight line obtained by approximating multiple lower edge positions detected from the side having a larger detection number and the lowermost end position and an angle of the approximate straight line is detected as the suction angle of the component. Accordingly, the component mounting machine can appropriately detect the suction angle of the component with a simple process and correctly determine the suction posture of the component.

Abstract: A mounting device sets a processing region for super-resolution processing based on an approximate position of a main body portion of a component included in a mark image for use in obtaining a position of a fiducial mark and then performs super-resolution processing. Thus, the processing region for super-resolution processing can be appropriately set and prevented from becoming larger than necessary with respect to the main body portion of the component. Further, the processing region for super-resolution processing is determined using the mark image captured under an imaging condition different from that for the component image for use in super-resolution processing. Thus, the processing region can be appropriately set while the component image is kept under an imaging condition suitable for super-resolution processing. Therefore, the processing region for performing super-resolution processing can be set more appropriately, and the super-resolution processing can be efficiently performed.