Patents by Inventor Yusuke Yamanari
Yusuke Yamanari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230104276Abstract: Provided is a double-sided pressure-sensitive adhesive tape excellent in impact-absorbing property in the entirety of a wide temperature range, in particular, in a low-temperature region. The double-sided pressure-sensitive adhesive tape of the present invention includes: a base material layer; and pressure-sensitive adhesive layers arranged on both surface sides of the base material layer, wherein an entirety of the double-sided pressure-sensitive adhesive tape has a storage modulus of elasticity E' in a range of from 1.0×105 Pa to 1.0×108 Pa, which is measured at from -25° C. to 120° C. and a frequency of 1 Hz.Type: ApplicationFiled: April 16, 2021Publication date: April 6, 2023Applicant: NITTO DENKO CORPORATIONInventors: Toru ISEKI, Yusuke YAMANARI, Makoto SAITO, Mitsuhiro KANADA
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Publication number: 20230034147Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. and 50% RH of from ?0.39 to ?0.20, provided that the dimensional change ratio at 23° C. and 50% RH is calculated in accordance with a predetermined equation by: cutting the pressure-sensitive adhesive tape into a belt shape having a width of 20 mm to produce a measurement sample; and tensioning the measurement sample under an environment at 23° C. and 50% RH with a tensile tester at an initial chuck-to-chuck distance set to 20 mm and a tensile rate of 300 mm/min in a longitudinal direction of the measurement sample so that a deformation amount thereof becomes 100%.Type: ApplicationFiled: September 28, 2020Publication date: February 2, 2023Applicant: NITTO DENKO CORPORATIONInventors: Yusuke YAMANARI, Makoto SAITO, Naoaki HIGUCHI, Hiroki IEDA
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Patent number: 11434341Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.Type: GrantFiled: August 7, 2018Date of Patent: September 6, 2022Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Yamanari, Makoto Saito, Akira Hirao, Kenji Furuta
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Patent number: 11401395Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.Type: GrantFiled: August 7, 2018Date of Patent: August 2, 2022Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Yamanari, Makoto Saito, Akira Hirao, Kenji Furuta
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Patent number: 11236253Abstract: Provided is a PSA sheet highly durable against repeated deformation and suited for use in a flexible device as well. The PSA sheet provided by this invention comprises a PSA layer. The PSA sheet shows a recovery rate at 100% elongation of 70% or higher. The PSA layer shows a displacement of 0.5 mm or greater according to the following holding power test: <Holding Power Test> At 23° C., the PSA layer is applied over a 10 mm wide by 20 mm long bonding area to a Bakelite plate as an adherend; a 1 kg load is applied in the length direction; after one hour, the displacement from the initial position where first applied is determined.Type: GrantFiled: January 5, 2018Date of Patent: February 1, 2022Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Yamanari, Makoto Saito, Naoaki Higuchi, Kenta Jozuka
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Patent number: 11186750Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.Type: GrantFiled: July 24, 2018Date of Patent: November 30, 2021Assignee: NITTO DENKO CORPORATIONInventors: Yusuke Yamanari, Makoto Saito, Naoaki Higuchi, Kenta Jozuka
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Publication number: 20210062049Abstract: Provided is a pressure-sensitive adhesive tape that is hard to see through even in the case where a tensile stress is applied thereto. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material laver, wherein the pressure-sensitive adhesive tape has a total light transmittance T1 of 20% or less under a state of being elongated by a degree of elongation of 0%, and wherein the pressure-sensitive adhesive tape has a total light transmittance T2 of 30% or less under a state of being elongated by a degree of elongation of 100%.Type: ApplicationFiled: October 25, 2018Publication date: March 4, 2021Applicant: NITTO DENKO CORPORATIONInventors: Yusuke YAMANARI, Makoto SAITO, Naoaki HIGUCHI, Kenta JOZUKA
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Publication number: 20200224000Abstract: A resin sheet with a pressure-sensitive adhesive layer including the resin sheet. The resin sheet including a main surface A and a main surface B opposite to each other across a thickness “d”, where the resin sheet has a 50% compression load of 20 N/cm2 or less at 23±5° C. in a direction of the thickness “d”, which is measured in conformity with a method of measuring a compression hardness described in JIS K 6767:1999; where the resin sheet has a Poisson's ratio at 23° C. of 0.10 or less; and the resin sheet has a thickness recovery ratio of 40% or more when compressed by 20% in the direction of the thickness “d” at 23° C.Type: ApplicationFiled: August 7, 2018Publication date: July 16, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yusuke YAMANARI, Makoto SAITO, Akira HIRAO, Kenji FURUTA
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Publication number: 20200165489Abstract: Provided is a pressure-sensitive adhesive tape excellent in unevenness followability. The pressure-sensitive adhesive tape of the present invention includes: a base material layer; and a pressure-sensitive adhesive layer arranged on at least one side of the base material layer, wherein the pressure-sensitive adhesive tape has a dimensional change ratio at 23° C. of from 0.20 to 0.39.Type: ApplicationFiled: July 24, 2018Publication date: May 28, 2020Applicant: NITTO DENKO CORPORATIONInventors: Yusuke YAMANARI, Makoto SAITO, Naoaki HIGUCHI, Kenta JOZUKA
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Publication number: 20180194975Abstract: Provided is a PSA sheet highly durable against repeated deformation and suited for use in a flexible device as well. The PSA sheet provided by this invention comprises a PSA layer. The PSA sheet shows a recovery rate at 100% elongation of 70% or higher. The PSA layer shows a displacement of 0.5 mm or greater according to the following holding power test: <Holding Power Test> At 23° C., the PSA layer is applied over a 10 mm wide by 20 mm long bonding area to a Bakelite plate as an adherend; a 1 kg load is applied in the length direction; after one hour, the displacement from the initial position where first applied is determined.Type: ApplicationFiled: January 5, 2018Publication date: July 12, 2018Applicant: NITTO DENKO CORPORATIONInventors: Yusuke YAMANARI, Makoto SAITO, Naoaki HIGUCHI, Kenta JOZUKA
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Publication number: 20170121481Abstract: Provided is a resin foam (13) that highly restrains the occurrence of display irregularities in a display unit when the resin foam is used in a touch-screen-equipped device (1), where the display irregularities may occur with user's touch operations. The resin foam (13) according to the present invention is obtained by expansion of a resin composition including a resin. The resin foam has a 25% compression load of 0.1 N/cm2 to 8.0 N/cm2 and is used in the touch-screen-equipped device (1). The resin is preferably at least one resin selected from the group consisting of polyolefin resins, polyester resins, and acrylic resins.Type: ApplicationFiled: March 12, 2015Publication date: May 4, 2017Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro HATANAKA, Tetsuya OTSUKA, Yusuke YAMANARI, Hiroyuki SUZUKI, Kazumichi KATO, Kohei DOI
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Publication number: 20150174865Abstract: A repeelable foam laminate for use of an electronic device has a structure in which a layer containing a polyolefin-based resin is laminated to at least one surface of a foam layer, and surface roughness Sa of the layer containing a polyolefin-based resin is no more than 10 micrometers.Type: ApplicationFiled: July 22, 2013Publication date: June 25, 2015Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro Hatanaka, Yusuke Yamanari