Abstract: The present disclosure includes a conversion circuit (10) having a switching element and converting DC voltage into AC voltage by switching operation of the switching element, an isolation transformer (3) for which an input side is connected to the conversion circuit (10), a rectifier circuit (4) connected to an outside of the isolation transformer (3), a resonance circuit connected to the output side of the isolation transformer (3), and a control circuit (100) for controlling the switching element, wherein the control circuit (100) turning on the switching element in a period when current flowing through resonance circuit flows from a low potential side terminal to a high potential side terminal of the switching element via the isolation transformer (3).

Abstract: The present disclosure includes by controlling at least either one of a switching frequency of a switching element (S) or a duty ratio indicating an ON period of the switching element, securing delay time from voltage at both ends of the switching element reaches zero voltage by resonance of the resonant circuit (L0, C0) in an OFF state of the switching element until the switching element is turned on, and turning on the switching element within the delay time.

Abstract: The present invention is related to a control method for controlling a power converter including a first power conversion circuit 11 and a second power conversion circuit 12 by using a control circuit 13. The first power conversion circuit 11 is connected to a solar cell module 1 and a capacitor 2, converts output power of the solar cell module 1, and outputs the converted power to the capacitor 2, the second power conversion circuit 12 is connected to the capacitor 2, and converts a voltage at a connection terminal connected to the capacitor 2. The control method comprises step of controlling operation of the second power conversion circuit 12 based on the output voltage of the solar cell module 1, to use output power of the second power conversion circuit 12 for charging the capacitor 2.

Abstract: The present disclosure includes a conversion circuit (10) having a switching element and converting DC voltage into AC voltage by switching operation of the switching element, an isolation transformer (3) for which an input side is connected to the conversion circuit (10), a rectifier circuit (4) connected to an outside of the isolation transformer (3), a resonance circuit connected to the output side of the isolation transformer (3), and a control circuit (100) for controlling the switching element, wherein the control circuit (100) turning on the switching element in a period when current flowing through resonance circuit flows from a low potential side terminal to a high potential side terminal of the switching element via the isolation transformer (3).

Abstract: The present invention is related to a control method for controlling a power converter including a first power conversion circuit 11 and a second power conversion circuit 12 by using a control circuit 13. The first power conversion circuit 11 is connected to a solar cell module 1 and a capacitor 2, converts output power of the solar cell module 1, and outputs the converted power to the capacitor 2, the second power conversion circuit 12 is connected to the capacitor 2, and converts a voltage at a connection terminal connected to the capacitor 2. The control method comprises step of controlling operation of the second power conversion circuit 12 based on the output voltage of the solar cell module 1, to use output power of the second power conversion circuit 12 for charging the capacitor 2.

Abstract: A photovoltaic device includes an organic semiconductor and an inorganic semiconductor. The organic semiconductor includes a photoactive region that generates excitons. The inorganic semiconductor has piezoelectricity and includes a dissociation region for dissociating carriers included in the excitons. A relationship of energy levels between the photoactive region and the dissociation region satisfies at least one equation ELUMO>EC or equation EHOMO<EV.

Abstract: A photovoltaic device includes an organic semiconductor and an inorganic semiconductor. The organic semiconductor includes a photoactive region that generates excitons. The inorganic semiconductor has piezoelectricity and includes a dissociation region for dissociating carriers included in the excitons. A relationship of energy levels between the photoactive region and the dissociation region satisfies at least one equation ELUMO>EC or equation EHOMO<EV.

Abstract: The present disclosure includes by controlling at least either one of a switching frequency of a switching element (S) or a duty ratio indicating an ON period of the switching element, securing delay time from voltage at both ends of the switching element reaches zero voltage by resonance of the resonant circuit (L0, C0) in an OFF state of the switching element until the switching element is turned on, and turning on the switching element within the delay time.

Abstract: An inductor includes a substrate as a base material, a core portion, a coil portion, an insulating portion formed between conductors of the coil portion, and a terminal portion connecting the core portion and the coil portion to the outside. A main direction of a magnetic field that is generated in accordance with current flowing through the coil portion extends in a planar direction of the substrate. In at least a portion of the coil portion, both width and thickness of a rectangular cross-sectional area of the coil portion are larger than the width of the insulating portion.

Abstract: A semiconductor capacitor includes a semiconductor substrate, an electrode group formed on the semiconductor substrate, and a plurality of insulators sandwiched between the electrode groups to form a plurality of capacitors. At least one of the plurality of capacitors is set to be different from at least one of a tolerance, which is a capability of the capacitors to withstand a prescribed voltage, and a conductance, which is an ease with which a leakage current flows in the capacitors.

Abstract: An inductor includes a substrate as a base material, a core portion, a coil portion, an insulating portion formed between conductors of the coil portion, and a terminal portion connecting the core portion and the coil portion to the outside. A main direction of a magnetic field that is generated in accordance with current flowing through the coil portion extends in a planar direction of the substrate. In at least a portion of the coil portion, both width and thickness of a rectangular cross-sectional area of the coil portion are larger than the width of the insulating portion.

Abstract: A semiconductor capacitor includes a semiconductor substrate, an electrode group formed on the semiconductor substrate, and a plurality of insulators sandwiched between the electrode groups to form a plurality of capacitors. At least one of the plurality of capacitors is set to be different from at least one of a tolerance, which is a capability of the capacitors to withstand a prescribed voltage, and a conductance, which is an ease with which a leakage current flows in the capacitors.

Abstract: A power conversion device includes a gate voltage adjustment unit (a detection circuit 12) which acts on a drive signal from a gate drive circuit 11 that sends a drive signal to the respective gates of a plurality of semiconductor elements Q1 to Q2 provided in parallel, and which adjusts the gate voltages of the semiconductor elements. The gate voltage adjustment unit superimposes an induction voltage generated on the basis of a difference between a magnetic flux due to a current flowing through one of the plurality of semiconductor elements and a magnetic flux due to a current flowing through each of the other semiconductor elements, onto a gate voltage sent to at least one gate of the plurality of semiconductor elements.

Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

Abstract: A power conversion device includes a gate voltage adjustment unit (a detection circuit 12) which acts on a drive signal from a gate drive circuit 11 that sends a drive signal to the respective gates of a plurality of semiconductor elements Q1 to Q2 provided in parallel, and which adjusts the gate voltages of the semiconductor elements. The gate voltage adjustment unit superimposes an induction voltage generated on the basis of a difference between a magnetic flux due to a current flowing through one of the plurality of semiconductor elements and a magnetic flux due to a current flowing through each of the other semiconductor elements, onto a gate voltage sent to at least one gate of the plurality of semiconductor elements.

Abstract: There is provided a power conversion device including a plurality of Direct Current (DC) power sources (VB) that converts an output voltage of each of the DC power sources into an Alternating Current (AC) voltage, and outputs the converted AC voltage in series connection, and the device includes: a DC/DC converter (21) connected to each of the DC power sources (VB) to convert the output voltage of the DC power sources; a control device (31) that controls an output voltage of the each DC/DC converter (21); and an H-bridge circuit (22) provided on the output side of the DC/DC converter (21) to convert the voltage output from the DC/DC converter (21) into an AC voltage.

Abstract: A power supply device has a first power supply capable of storing and discharging electric power, a second power supply connected in series to the first power supply and capable of storing and discharging the electric power, an isolated DC-DC converter including a primary side terminal to which the first power supply is connected, and a secondary side terminal to which the second power supply is connected, and a power supply control unit that controls a voltage of the second power supply using the isolated DC-DC converter. A direct-current voltage outputted from the first power supply and the second power supply connected in series is inputted to a first inverter, converted into an alternating-current voltage by the first inverter, and then supplied to a vehicle drive motor.

Abstract: There is provided a power conversion device including a plurality of Direct Current (DC) power sources (VB) that converts an output voltage of each of the DC power sources into an Alternating Current (AC) voltage, and outputs the converted AC voltage in series connection, and the device includes: a DC/DC converter (21) connected to each of the DC power sources (VB) to convert the output voltage of the DC power sources; a control device (31) that controls an output voltage of the each DC/DC converter (21); and an H-bridge circuit (22) provided on the output side of the DC/DC converter (21) to convert the voltage output from the DC/DC converter (21) into an AC voltage.

Abstract: An electric drive unit includes an inverter, a stator that receives an AC current from the inverter and forms a magnetic field, a rotor rotated by the magnetic field formed by the stator, a shaft that protrudes into both sides in an axial direction of the rotor and moves in synchronization with the rotor, an inverter casing that stores the inverter in a galvanic isolation state, and a motor housing. The motor housing stores the stator and the rotor in a galvanic isolation state, rotatably supports one end of the shaft using a first bearing, and rotatably supports the other end of the shaft using a second bearing. The inverter and the inverter casing are arranged in an inner side from a pair of bearings including the first and second bearings.

Abstract: A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.