Patents by Inventor Yuta FUKAMI

Yuta FUKAMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145147
    Abstract: It is an object to provide a thin film inductor element using a new type of emergent electromagnetic field, which has a not so high difficulty in selecting materials, and also has a not so high temperature dependency. A thin film inductor element is characterized by including: a stacked layer film including a magnetic body layer, and a non-magnetic body layer or an antiferromagnetic body layer stacked therein, and a pair of electrodes, and is characterized in that the magnetic body layer, and the non-magnetic body layer or the antiferromagnetic body layer are extended in an arbitrary shape in a direction orthogonal to a stacking direction, and a vertical orientation of the stacking direction is also arbitrary, the magnetic body layer has a substantially uniform magnetization structure, and the pair of electrodes are provided at both ends to which the stacked layer film is extended, and an alternating current or a high frequency current is applied.
    Type: Application
    Filed: January 7, 2022
    Publication date: May 2, 2024
    Inventors: Jun'ichi IEDA, Yuta YAMANE, Shunsuke FUKAMI
  • Publication number: 20240111206
    Abstract: An electronic apparatus includes a first case, a second case provided in such a manner that an internal part is disposed between the first case and the second case, and a cover configured to cover an opposite side of the second case to a side facing the internal part, and a heat conductivity of the second case is higher than a heat conductivity of the cover.
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Hirofumi FUJIKURA, Yuta FUKAMI
  • Publication number: 20230236485
    Abstract: A first cooling apparatus includes a first heat sink having multiple first fins having a U-shaped opening and an O-shaped opening which are provide therein, a first heat receiving member configured to be brought into abutment with a heat source, and a first heat pipe which extends from one end which is connected with the heat receiving member towards the other end, and the first heat pipe has a first extending portion which extends from the one end, a bent portion which is bent from the first extending portion and at least a part of which is disposed inside the U-shaped opening, and a second extending portion which extends from the bent portion and at least a part of which is disposed inside the O-shaped opening.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 27, 2023
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Yuta FUKAMI, Tomoyuki UEDA