Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Abstract: A sheet punching apparatus includes a waste box formed of insulating resin, a detection sensor provided in the waste box and configured to detect the amount of paper chips in the waste box, and a conductive member disposed such that at least a part thereof is positioned in midair in the waste box below the detection sensor. With this configuration, erroneous detection of the detection sensor can be prevented.

Abstract: An inspection apparatus is provided to inspect an imaging device formed on an inspection object by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device. The light enters the imaging device from a back surface that is a surface on the side opposite to the side on which the wiring layer is formed. The inspection apparatus includes a substrate support made of a light-transmissive material and on which the inspection object is supported such that the substrate support faces a back surface of the imaging device, and a light irradiation mechanism disposed to be opposite to the inspection object with the substrate support interposed therebetween and having a plurality of LEDs such that light from the LEDs is oriented toward the inspection object.

Abstract: There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness t1 of a polishing plate, a thickness t2 of a polishing wafer and a magnitude t3 extending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude t4 of a lip seal protruding from an upper surface of a chuck top.

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Abstract: A stage on which an inspection object having an electronic device is placed, the electronic device being pressed against a contact terminal of a probe card of an inspection apparatus by applying a load, includes: a first cooling plate including a first coolant flow path formed in the first cooling plate; a heating source mounted on the first cooling plate and configured to heat the inspection object; a transmission member installed on the heating source and transmits light output from the heating source; and a second cooling plate installed on the transmission member, including a placement surface configured to vacuum-suction the inspection object and a second coolant flow path, made of ceramic, and subjected to a mirror polishing process on the placement surface.

Abstract: This inspection device inspects an imaging device formed in an object to be inspected by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device, wherein the light enters the imaging device from a back surface that is a surface on the side reverse to the side on which the wiring layer is provided, and the inspection device is provided with: a mounting table which is formed from a light transmissive material and on which the object to be inspected is mounted in such a manner that the mounting table faces the back surface of the imaging device; and a light irradiation mechanism which is disposed to face the object to be inspected with the mounting table interposed therebetween, and which has a plurality of LEDs oriented toward the object to be inspected.

Abstract: A punching apparatus, including: a punching portion configured to punch a sheet; and a chad box configured to store a chad of a sheet punched by the punching portion, wherein the chad box includes: a first inner wall portion formed of an insulator; and a second inner wall portion formed of a conductor and arranged above the first inner wall portion.

Abstract: There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness t1 of a polishing plate, a thickness t2 of a polishing wafer and a magnitude t3 extending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude t4 of a lip seal protruding from an upper surface of a chuck top.

Abstract: A sheet punching apparatus includes a waste box formed of insulating resin, a detection sensor provided in the waste box and configured to detect the amount of paper chips in the waste box, and a conductive member disposed such that at least a part thereof is positioned in midair in the waste box below the detection sensor. With this configuration, erroneous detection of the detection sensor can be prevented.

Abstract: A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

Abstract: A punching apparatus, including: a punching portion configured to punch a sheet; and a chad box configured to store a chad of a sheet punched by the punching portion, wherein the chad box includes: a first inner wall portion formed of an insulator; and a second inner wall portion formed of a conductor and arranged above the first inner wall portion.

Abstract: A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

Abstract: A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation ring, wherein a temperature of a target object held on the surface plate is capable of being controlled and the surface plate is formed of ceramic. The surface plate and the temperature control unit are coupled to each other by a first coupling member at each portion thereof except for each peripheral portion thereof such that the peripheral portion of the surface plate being not coupled thereto. The peripheral portion of the temperature control unit is coupled to the heat insulation ring by a second coupling member.

Abstract: A transfer mechanism for a target object includes at least two insulating wire materials disposed spaced from each other to transverse a mounting table, at least two pairs of supporting bodies horizontally disposed at outsides of the mounting table, for stretching said at least two wire materials in parallel with a mounting surface of the mounting table, and at least two grooves formed on the mounting surface of the mounting table to respectively receive therein said at least two wire materials by said at least two pairs of supporting bodies. The transfer mechanism further includes a first elevation driving mechanism for vertically moving said wire materials between said grooves and above of the mounting surface through said pairs of supporting bodies, wherein the target object is transferred between a carrying mechanism and the mounting table through said at least two wire materials.

Abstract: To enable accurate image reading and concurrently therewith, enable a reading optical system to be varied easily in an apparatus configuration in which first and second read portions are disposed in planes inclined a predetermined angle, the apparatus has an apparatus housing 10, a platen 11 disposed in the apparatus housing to form the first read portion 11a and the second read portion 11b in planes mutually inclined a predetermined angle, a reading carriage 12, 40 disposed to be able to shift to positions between the first read portion and the second read portion, and a light source lamp 15, 41 for applying light to a document sheet on the platen, and a reflecting mirror 16, 42 for guiding the reflected light from the document sheet toward image reading means 13 each mounted on the reading carriage, and is configured so that an angular attitude of the reflecting mirror 16 is deflected by a predetermined angle or deflecting means 46 disposed in the second read portion guides the reflected light to the reflec

Abstract: A test device includes a movable mounting table having a temperature controlling mechanism therein; a probe card provided with a plurality of probes positioned above the mounting table; and a first temperature control unit for controlling the temperature controlling mechanism so that a target object on the mounting table can be heated to a predetermined temperature to test electrical characteristics of the target object. The mounting table is provided with a heater facing a plurality of probes protruding from the mounting table in the high-temperature test on the target object.

Abstract: A transfer mechanism for a target object includes at least two insulating wire materials disposed spaced from each other to transverse a mounting table, at least two pairs of supporting bodies horizontally disposed at outsides of the mounting table, for stretching said at least two wire materials in parallel with a mounting surface of the mounting table, and at least two grooves formed on the mounting surface of the mounting table to respectively receive therein said at least two wire materials by said at least two pairs of supporting bodies. The transfer mechanism further includes a first elevation driving mechanism for vertically moving said wire materials between said grooves and above of the mounting surface through said pairs of supporting bodies, wherein the target object is transferred between a carrying mechanism and the mounting table through said at least two wire materials.

Abstract: A substrate supporting unit includes a supporter for supporting a substrate, and a temperature controller for controlling the supporter. The supporter includes liquid supply openings opened at a top surface of the supporter. A liquid is supplied between the substrate and the supporter through the liquid supply opening. Liquid discharge grooves are formed in the top surface of the supporter near the liquid supply openings, and the liquid between the substrate and the supporter is discharged through the liquid discharge grooves. Liquid discharge openings are opened in the liquid discharge grooves, and the liquid is discharged through the liquid discharge openings. Further, the supporter includes exhaust grooves formed in the top surface of the supporter and exhaust openings opened in the exhaust grooves, the exhaust grooves and the exhaust openings also serving as the liquid discharge grooves and the liquid discharge openings, respectively.