Patents by Inventor Yutaka Hosokawa

Yutaka Hosokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240110779
    Abstract: A mirror unit 2 includes a mirror device 20 including a base 21 and a movable mirror 22, an optical function member 13, and a fixed mirror 16 that is disposed on a side opposite to the mirror device 20 with respect to the optical function member 13. The mirror device 20 is provided with a light passage portion 24 that constitutes a first portion of an optical path between the beam splitter unit 3 and the fixed mirror 16. The optical function member 13 is provided with a light transmitting portion 14 that constitutes a second portion of the optical path between the beam splitter unit 3 and the fixed mirror 16. A second surface 21b of the base 21 and a third surface 13a of the optical function member 13 are joined to each other.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomofumi SUZUKI, Kyosuke KOTANI, Tatsuya SUGIMOTO, Yutaka KURAMOTO, Katsumi SHIBAYAMA, Noburo HOSOKAWA, Hirokazu YAMAMOTO, Takuo KOYAMA
  • Patent number: 11942495
    Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 26, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Daisuke Chino, Hiroyuki Shigeta, Shigekazu Ishii, Koyo Hosokawa, Hirohisa Yasukawa, Mitsuhito Kanatake, Kosuke Hareyama, Yutaka Ootaki, Kiyohisa Sakai, Atsushi Tsukada, Hirotaka Kobayashi, Ninao Sato, Yuki Yamane
  • Patent number: 6090026
    Abstract: An automatic tool exchanging machine include a machine body such as gear box, a tool exchanging arm having a tool grasping member and supported by the machine body to be rotatable and to be linearly reciprocally movable in an axial direction of a rotation shaft of the machine body, a rotation drive mechanism provided for the machine body, and a power transmission mechanism for transmitting a driving power of the rotation drive mechanism to the tool exchanging arm. The power transmission mechanism is provided with a motion conversion mechanism for converting a rotational motion of the rotation drive mechanism including servo-motors to a linear reciprocal motion of the tool exchanging arm and the motion conversion mechanism is composed of a feed screw mechanism. The feed screw mechanism is a ball screw mechanism.
    Type: Grant
    Filed: November 13, 1998
    Date of Patent: July 18, 2000
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Yutaka Hosokawa, Toshihiro Ueta, Hirohiko Honda
  • Patent number: 5803229
    Abstract: A pallet changer such that deformation of the pallet at the time of clamping the pallet is suppressed and drawing-in and drawing-out operations of the pallet with respect to the pallet clamping apparatus is eliminated to contribute to high speed pallet exchange is provided. Holding portions 41 projected toward an bore portion 34 opened to the central portion at the lower surface of the pallet 30 are provided. Engagement portions 37 which can be engaged and withdrawn or disengaged with respect to the holding portions 41 are provided at the outer circumferential portion of a disk-shaped clamping member 36 to rotatably and vertically movably supporting the clamping member 36 through a clamping shaft 46, and to connect the clamping member 36 to a driving section 50 for producing a clamping force through the clamping shaft 46.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: September 8, 1998
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventor: Yutaka Hosokawa
  • Patent number: 5549177
    Abstract: A system for lubricating and cooling the main spindle head of a machine tool includes a cooling device 12 having a pipe 64 at the outlet side thereof, which is bifurcated into two lines, i.e. a lubricating oil circuit and a cooling oil circuit. Simultaneously, Venturi tubes 38 are arranged in the pipe line at the return side of the cooling oil circuit, and the Venturi tubes 38 and the oil bath 18 of the lubricating oil circuit are connected by pipes 43 and 44.
    Type: Grant
    Filed: May 11, 1995
    Date of Patent: August 27, 1996
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Yutaka Hosokawa, Haruzi Hosoi