Patents by Inventor Yutaka Koshiba
Yutaka Koshiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7524356Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: GrantFiled: August 2, 2005Date of Patent: April 28, 2009Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20050262968Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: ApplicationFiled: August 2, 2005Publication date: December 1, 2005Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 6944930Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: GrantFiled: February 26, 2001Date of Patent: September 20, 2005Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 6682824Abstract: An adhesion-resistant oxygen-free roughly drawn copper wire having an oxygen concentration of 1 to 10 ppm and a hydrogen concentration of 1 ppm or less, has a surface oxide film having a total thickness of 50 to 500 angstroms, in which 0.2 to 90% of the total thickness of the oxide film is Cu2O. The adhesion-resistant oxygen-free roughly drawn copper wire is prepared using a continuous casting process, in which the molten copper is agitated and dehydrogenated in a casting trough containing weirs, and the thickness of the oxide layer is controlled by alcohol cleaning the cast copper bar material prior to rolling.Type: GrantFiled: April 11, 2001Date of Patent: January 27, 2004Assignee: Mitsubishi Materials CorporationInventors: Yutaka Koshiba, Tutomu Masui, Kazumasa Hori, Yoshiaki Hattori
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Patent number: 6640876Abstract: A method and apparatus for manufacturing copper and/or copper alloy ingots having no shrinkage cavities and having smooth surfaces without wrinkles are provided. The apparatus comprises a bottom-casting type melting furnace and a heating furnace for heating a mold in which the molten metal is cast. The method comprises the steps of melting the material of copper and/or copper alloy, and casting the molten copper and/or molten copper alloy into a cylindrical mold which is placed on a cooled pedestal provided at the bottom of the heating furnace and the side wall of which is heated by the heating furnace so as to form a temperature gradient increasing from the bottom to the top of the mold.Type: GrantFiled: December 7, 2001Date of Patent: November 4, 2003Assignee: Mitsubishi Materials CorporationInventors: Kenji Yajima, Norikazu Ishida, Yutaka Koshiba, Keiji Nogami, Akihiro Kakimoto
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Patent number: 6589473Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.Type: GrantFiled: February 22, 2001Date of Patent: July 8, 2003Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20030106664Abstract: A method and apparatus for manufacturing copper and/or copper alloy ingots having no shrinkage cavities and having smooth surfaces without wrinkles are provided. The apparatus comprises a bottom-casting type melting furnace and a heating furnace for heating a mold in which the molten metal is cast. The method comprises the steps of melting the material of copper and/or copper alloy, and casting the molten copper and/or molten copper alloy into a cylindrical mold which is placed on a cooled pedestal provided at the bottom of the heating furnace and the side wall of which is heated by the heating furnace so as to form a temperature gradient increasing from the bottom to the top of the mold.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Inventors: Kenji Yajima, Norikazu Ishida, Yutaka Koshiba, Keiji Nogami, Akihiro Kakimoto
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Publication number: 20010029659Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: ApplicationFiled: February 26, 2001Publication date: October 18, 2001Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20010028135Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a soaking furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the soaking furnace in a non-oxidizing atmosphere and for transferring the molten copper to a turn-dish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the turn-dish, and a cutter for cuffing the cast copper into a predetermined length.Type: ApplicationFiled: February 22, 2001Publication date: October 11, 2001Applicant: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 5798008Abstract: A method for producing copper alloy materials for molds for continuous steel casting and molds as produced by the method. The molds are highly resistant to thermal fatigue and are hardly cracked. To produce the materials, cast ingots of a copper-based chromium-zirconium alloy comprising from 0.2 to 1.5% by weight of Cr and from 0.02 to 0.2% by weight of Zr are heated at between 900.degree. C. and 1000.degree. C. for 30 minutes or longer and then rolled, while hot, at a reduction ratio of 60% or more to be at 850.degree. C. or higher at which the hot rolling is finished , and immediately after the hot rolling, these are rapidly cooled to 400.degree. C. or lower at a cooling rate of 10.degree.C./sec or more, and then aged at between 400.degree. C. and 520.degree. C. for from 1 hour to 5 hours.Type: GrantFiled: July 15, 1996Date of Patent: August 25, 1998Assignee: Mitsubishi Materials CorporationInventors: Keishi Nogami, Masato Koide, Takashi Morimoto, Yutaka Koshiba
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Patent number: 5705125Abstract: A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, 0.05 to 0.15% Sn, and 10 ppm or less O, and if required, further contains 0.01 to 0.1% Si, or 0.01 to 0.1% Si and 0.001 to 0.05% Mg, with the balance being Cu and inevitable impurities.Type: GrantFiled: November 22, 1994Date of Patent: January 6, 1998Assignees: Mitsubishi Materials Corporation, Railway Technical Research InstituteInventors: Motoo Goto, Shizuo Kawakita, Yoshiharu Mae, Takuro Iwamura, Yutaka Koshiba, Kenji Yajima, Syunji Ishibashi, Hiroki Nagasawa, Atsushi Sugahara, Sumihisa Aoki, Haruhiko Asao
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Patent number: 5391243Abstract: A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, and 10 ppm or less O, and if required, further contains at least one element selected from the group consisting of 0.01 to 0.1% Si and 0.001 to 0.05% Mg, with the balance being Cu and inevitable impurities. The wire is manufactured by hot working a copper alloy billet having the above composition, immediately quenching the hot worked billet to prepare an element wire, cold working the element wire at least once, and subjecting the cold worked element wire to aging treatment.Type: GrantFiled: October 28, 1993Date of Patent: February 21, 1995Assignees: Mitsubishi Materials Corporation, Railway Technical Research InstituteInventors: Motoo Goto, Shizuo Kawakita, Yoshiharu Mae, Takuro Iwamura, Yutaka Koshiba, Kenji Yajima, Syunji Ishibashi, Hiroki Nagasawa, Atsushi Sugahara, Sumihisa Aoki, Haruhiko Asao
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Patent number: 5024814Abstract: A copper alloy consists essentially by weight percent of 0.5 to 3% Ni, 0.5 to 2.5% Sn, 0.05 to 0.9% Si, 0.1 to 2% Zn, 0.025 to 0.25% Fe, and the balance of Cu and inevitable impurities. The inevitable impurities include C in an amount of not more than 10 ppm. The obtained copper alloy possesses improved hot rollability and exhibits excellent adhesion strength of a plated surface thereof when heated, while having satisfactory strength and platability.Type: GrantFiled: November 17, 1989Date of Patent: June 18, 1991Assignee: Mitsubishi Shindoh Co., Ltd.Inventors: Rensei Futatasuka, Yutaka Koshiba, Shunich Chiba, Toyoaki Orikasa, Seiji Noguchi, Takuya Idoshita