Abstract: The image forming apparatus includes: an intermediate transfer body; a liquid adhesion device which provides a first liquid having a viscosity not less than 15 mPa·s and not greater than 300 mPa·s at 25° C, on the intermediate transfer body; a droplet ejection device which ejects a second liquid containing a coloring material onto a region of the intermediate transfer body where the first liquid is provided by the liquid adhesion device, in a state where the first liquid on the intermediate transfer body has a thickness not less than 1.6 ?m; a viscosity raising device which raises a viscosity of the second liquid on the intermediate transfer body; and a transfer device which transfers an image including dots of the second liquid formed on the intermediate transfer body, onto a recording medium.

Abstract: The image forming apparatus has a shear mode liquid ejection head for ejecting ink, the shear mode liquid ejection head including: a pressure chamber into which the ink is filled; and a liquid affinity film which is made from a material containing a polyparaxylylene or a derivative of polyparaxylylene and is formed on an interior wall of the pressure chamber, wherein the ink is an oil-based ink containing a radiation-polymerizable compound.

Abstract: A silver halide color photographic photosensitive material having, on a support, at least one layer of a blue sensitive emulsion layer unit containing a yellow color forming coupler, a green sensitive emulsion layer unit containing a magenta color forming coupler, and a red sensitive emulsion layer unit containing a cyan color forming coupler, wherein 70% or more of the projection area of the entire silver halide grains has at least one layer of a silver halide photographic emulsion layer containing silver halide grains satisfying the following (a) to (c), and (1) the photosensitive material contains at least one inter-image effect providing layer, or (2) the photosensitive material contains a compound represented by the following Formula (I): (a) the material comprises a tabular silver halide host grain with an aspect ratio of 5 or more having two principal surfaces parallel with each other and a protrusion portion of silver halide epitaxially joined onto the surface of the tabular silver halide host grain,

Abstract: A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiating section, and a guide provided on the housing to direct gases around the circuit substrate toward the intake face.

Abstract: Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing. In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat.

Abstract: A silver halide color photographic photosensitive material having, on a support, at least one layer of a blue sensitive emulsion layer unit containing a yellow color forming coupler, a green sensitive emulsion layer unit containing a magenta color forming coupler, and a red sensitive emulsion layer unit containing a cyan color forming coupler, wherein 70% or more of the projection area of the entire silver halide grains has at least one layer of a silver halide photographic emulsion layer containing silver halide grains satisfying the following (a) to (c), and (1) the photosensitive material contains at least one inter-image effect providing layer, or (2) the photosensitive material contains a compound represented by the following Formula (I): (a) the material comprises a tabular silver halide host grain with an aspect ratio of 5 or more having two principal surfaces parallel with each other and a protrusion portion of silver halide epitaxially joined onto the surface of the tabular silver halide host grain,

Abstract: A silver halide color reversal photographic lightsensitive material comprising a support and, superimposed thereon, at least one red-sensitive silver halide emulsion layer, at least one green-sensitive silver halide emulsion layer and at least one blue-sensitive silver halide emulsion layer, the red-sensitive silver halide emulsion layer having a weight-averaged wavelength (?ra) of spectral sensitivity distribution satisfying the relationship: 600 nm<?ra<625 nm, which silver halide color reversal photographic lightsensitive material contains at least one interimage effect intensifying layer substantially not forming any image, the interimage effect intensifying layer containing: (a) at least one kind of lightsensitive silver halide grains in an amount of less than 10% in terms of silver quantity based on all the silver halide grains for image formation; and (b) nonlightsensitive silver halide fine grains.

Abstract: Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing. In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat.

Abstract: A silver halide color reversal photographic light-sensitive material comprising at least one interimage effect imparting layer (a) defined below and at least one interimage effect imparting layer (b) defined below, wherein, when the photographic light-sensitive material is exposed to light of a “skin color” having the spectral distribution of Table 1 described in the specification and is then subjected to development, a ratio of the chroma C*70 at a brightness L*=70 represented by CIE Lab color system to the chroma C*50 at a brightness L*=50, C*70/C*50, is 0.7 or more. (a) an interimage effect imparting layer containing a short-wavelength green-sensitive silver halide emulsion having a weight-averaged wavelength of a spectral sensitivity distribution of 500 to 560 nm; (b) an interimage effect imparting layer containing a red-sensitive silver halide emulsion having a weight-averaged wavelength of a spectral sensitivity distribution of 580 to 700 nm.

Abstract: A silver halide color reversal photographic light-sensitive material comprising at least one interimage effect imparting layer (a) defined below and at least one interimage effect imparting layer (b) defined below, wherein, when the photographic light-sensitive material is exposed to light of a “skin color” having the spectral distribution of Table 1 described in the specification and is then subjected to development, a ratio of the chroma C*70 at a brightness L*=70 represented by CIE Lab color system to the chroma C*50 at a brightness L*=50, C*70/C*50, is 0.7 or more.

Abstract: In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.

Abstract: A silver halide color reversal photographic lightsensitive material comprising a support and, superimposed thereon, at least one red-sensitive silver halide emulsion layer, at least one green-sensitive silver halide emulsion layer and at least one blue-sensitive silver halide emulsion layer, the red-sensitive silver halide emulsion layer having a weight-averaged wavelength (&lgr;ra) of spectral sensitivity distribution satisfying the relationship: 600 nm<&lgr;ra<625 nm, which silver halide color reversal photographic lightsensitive material contains at least one interimage effect intensifying layer substantially not forming any image, the interimage effect intensifying layer containing:

Abstract: In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.

Abstract: In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.

Abstract: There is provided a semiconductor device composed of lead frame in which the possibility of a complicated manufacturing process is prevented and a reduction in manufacturing cost can be satisfactorily achieved.

Abstract: In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost.In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.

Abstract: A method for producing a silver halide emulsion in which grains having an aspect ratio of from 1.5 to 100 occupy from 75 to 100% of the total projected area of all grains comprising at least nucleation, ripening and grain growth processes in a dispersion medium solution containing water and a dispersion medium, wherein the dispersion medium solution contains low molecular weight gelatin having a molecular weight of from 1,000 to 70,000 at least during a nucleation process and chemically modified gelatin having a chemical modification rate of the amino group of from 15% to 100% at least during a grain growth process.

Abstract: A printed circuit board is provided on its surface with position detecting patterns at specific positions with respect to conductor patterns for connecting the leads of an integrated circuit. The position of the lead connecting conductor patterns is obtained an indirect manner through a calculation based on the positional information of the position detecting patterns.