Abstract: The embodiment provides a transparent electrode having low resistance and high stability against impurities such as halogen and sulfur, a method of producing the transparent electrode, and an electronic device using the transparent electrode. A transparent electrode according to an embodiment includes a transparent substrate and a plurality of conductive regions disposed on a surface of the transparent substrate and separated from each other by a separation region, wherein the conductive region has a structure in which a first transparent conductive metal oxide layer, a metal layer, and a second transparent conductive metal oxide layer are laminated in this order from the substrate side, and in the separation region, there is disposed a trapping material. This transparent electrode can be produced by scribing the conductive region to form a separation region, and then using a halide or a sulfur compound.

Abstract: A method and an apparatus of inspecting the surface of a wafer, where two or more kinds of laser are switched or mixed to make the laser incident on the film-coated wafer by a same incident angle, in which inspection data regarding an inspection apparatus and film parameters regarding a film are stored in storage means of the inspection apparatus in an associated state with each other so as to obtain predetermined inspection conditions. When performing each measurement, an operator sets the film parameters of the wafer to be measured by setting means of the inspection apparatus. Thus, desired inspection conditions are automatically set in the inspection apparatus. The film parameters that the operator sets at each measurement are a film thickness and a film refraction index.

Abstract: A method and an apparatus of inspecting the surface of a wafer, where two or more kinds of laser are switched or mixed to make the laser incident on the film-coated wafer by a same incident angle, in which inspection data regarding an inspection apparatus and film parameters regarding a film are stored in storage means of the inspection apparatus in an associated state with each other so as to obtain predetermined inspection conditions. When performing each measurement, an operator sets the film parameters of the wafer to be measured by setting means of the inspection apparatus. Thus, desired inspection conditions are automatically set in the inspection apparatus. The film parameters that the operator sets at each measurement are a film thickness and a film refraction index.

Abstract: The surface inspection apparatus comprises a light source section for emitting a first luminous flux and a second luminous flux; a first irradiation optical system in which the first luminous flux is irradiated on the surface of an inspected object at a first irradiation angle; a second irradiation optical system in which the second luminous flux is irradiated on the surface of an inspected object at a second irradiation angle different from the first irradiation angle; a displacement section for relatively displacing an inspected object and an irradiation luminous flux of the irradiation optical system; a light receiving optical system for receiving scattered light of the first luminous flux irradiated by the first irradiation optical system and produced from an inspection object on the surface of an inspected object and scattered light of the second luminous flux irradiated by the second irradiation optical system and produced from an inspection object on the surface of an inspected object; a first light re

Abstract: A surface inspection apparatus includes a light source section for emitting first and second luminous fluxes; a first irradiation optical system which irradiates the first luminous flux on an inspected object at a first irradiation angle; a second irradiation optical system which irradiates the second luminous flux on an inspected object at a second irradiation angle; a light receiving optical system for receiving scattered light of the first and second luminous fluxes; first and second light receiving sections for converting the scattered light of the first and second luminous fluxes into first and second light receiving signals, respectively; a displacement section for relatively displacing an inspected object and an irradiation luminous flux of the irradiation optical system; and a discrimination section for discriminating the kind of inspection object based on the strength of the scattered light and the scattered range of the first and second light receiving signals.

Abstract: Object of the invention is to finely granulate the granular substances with pollutants, such as the contaminated soils and incinerated ashes, adhered and to separate the pollutants from the granular substances efficiently and further to enable the unnoxious granular substances, from which pollutants as above have been separated, to be recycled.

Abstract: Granular substances with pollutants adhered, such as contaminated soils and incinerated ashes, are finely granulated to separate the pollutants from the granular substances efficiently and to enable the granular substances, from which pollutants have been separated, to be recycled. After fine granulation of the granular substances by a coarse disintegrating treatment through a first fine granulation machine, the granular substances, which have been finely granulated by the first fine granulation machine, are subjected to, by a second fine granulation machine, mutual polishing among the granular substances by mutual rubbing forces of the substances themselves and thus the pollutants, such as heavy metals and dioxin class substances adhering strongly to the surfaces of the granular substances, are separated, and also the granular substances not containing the pollutants are classified from the granular substances which have already been finely granulated by a vibrational screen and a classification device.

Abstract: The surface inspection apparatus comprises a light source section for emitting a first luminous flux and a second luminous flux; a first irradiation optical system in which the first luminous flux is irradiated on the surface of an inspected object at a first irradiation angle; a second irradiation optical system in which the second luminous flux is irradiated on the surface of an inspected object at a second irradiation angle different from the first irradiation angle; a displacement section for relatively displacing an inspected object and an irradiation luminous flux of the irradiation optical system; a light receiving optical system for receiving scattered light of the first luminous flux irradiated by the first irradiation optical system and produced from an inspection object on the surface of an inspected object and scattered light of the second luminous flux irradiated by the second irradiation optical system and produced from an inspection object on the surface of an inspected object; a first light re

Abstract: A surface inspection apparatus comprising: a light source section for emitting a first luminous flux and a second luminous flux; a first irradiation optical system in which the first luminous flux is irradiated on the surface of an inspected object at a first irradiation angle; a second irradiation optical system in which the second luminous flux is irradiated on the surface of an inspected object at a second irradiation angle different from the first irradiation angle; a light receiving optical system for receiving scattered light of the first luminous flux irradiated by the first irradiation optical system and produced from an inspection object on the surface of an inspected object and scattered light of the second luminous flux irradiated by the second irradiation optical system and produced from an inspection object on the surface of an inspected object; a first light receiving section for converting the scattered light of the first luminous flux received by the light receiving optical system into a first

Abstract: An apparatus for surface inspection according to the invention comprises an irradiating optical system for throwing an irradiating light beam from a light source onto the surface of an object of inspection, a light receiving optical system for receiving a scattered light beam reflected from the surface of the object of inspection irradiated by the irradiating optical system, a photosensing portion for forming a surface data signal from the scattered light beam received by the light receiving optical system, a displacement portion for displacing the surface of the object of inspection relative to the irradiating optical system, plus the light receiving optical system, continuously in the main scanning direction and intermittently in the sub-scanning direction, and a foreign matter detecting portion for detecting a foreign matter present on the surface of the object of inspection on the basis of the maximum value level of the surface data signal and obtaining the position, in the sub-scanning direction, of the