Patents by Inventor Yutaka Shimazaki

Yutaka Shimazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIFU probe for treating tissue with in-line degassing of fluid
    Patent number: 7559905
    Abstract: A HIFU system is disclosed including a fluid circulation system including a degasser.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: July 14, 2009
    Assignee: Focus Surgery, Inc.
    Inventors: Shuhei Kagosaki, Yutaka Shimazaki, Kenji Yamashita, Bernard J. Esarey, Artur P. Katny, Ralf Seip, Narendra T. Sanghvi
  • HIFU probe for treating tissue with in-line degassing of fluid
    Publication number: 20080077056
    Abstract: A HIFU system is disclosed including a fluid circulation system including a degasser.
    Type: Application
    Filed: September 21, 2006
    Publication date: March 27, 2008
    Inventors: Shuhei Kagosaki, Yutaka Shimazaki, Kenji Yamashita, Bernard J. Esarey, Artur P. Katny, Ralf Seip, Narendra T. Sanghvi
  • Abrasive wire for a wire saw and a method of manufacturing the abrasive wire
    Patent number: 6463921
    Abstract: An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: October 15, 2002
    Assignee: Ricoh Company, Ltd.
    Inventors: Yutaka Shimazaki, Toshiyuki Enomoto, Yasuhiro Tani
  • ABRASIVE WIRE FOR A WIRE SAW AND A METHOD OF MANUFACTURING THE ABRASIVE WIRE
    Publication number: 20020100469
    Abstract: An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.
    Type: Application
    Filed: February 1, 2000
    Publication date: August 1, 2002
    Inventors: Yutaka Shimazaki, Toshiyuki Enomoto, Yasuhiro Tani
  • Electrolytic in-process dressing method, electrolytic in-process dressing apparatus and grindstone
    Patent number: 6117001
    Abstract: An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: September 12, 2000
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshiyuki Enomoto, Hiroyuki Endo, Yutaka Shimazaki, Yasuhiro Tani, Yoshiyuki Sato
  • Electrolytic in-process dressing method, electrolytic in process dressing apparatus and grindstone
    Patent number: 5868607
    Abstract: An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.
    Type: Grant
    Filed: August 7, 1996
    Date of Patent: February 9, 1999
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshiyuki Enomoto, Hiroyuki Endo, Yutaka Shimazaki, Yasuhiro Tani, Yoshiyuki Sato
  • Liquid crystal display panel with plural substrates
    Patent number: 5164853
    Abstract: A liquid crystal display panel is composed of a plurality of panel elements. The panel elements are arranged in matrix form in a plane. Each element comprises an upper flexible substrate having a plurality of electric terminals formed thereon and a lower flexible substrate having a plurality of electric terminals formed thereon. Two adjacent panel elements are arranged in such a manner that the terminals of the upper substrate are electrically connected to the terminals of the lower substrate through a conductive resin layer disposed therebetween.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: November 17, 1992
    Assignee: Ricoh Company, Ltd.
    Inventor: Yutaka Shimazaki