Patents by Inventor Yutaka Tsubokura
Yutaka Tsubokura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8030379Abstract: Provided is a polycarbonate resin composition having high rigidity, high flowability, high heat resistance, and excellent flame retardancy and molded articles with good appearance using the polycarbonate resin composition. The polycarbonate resin composition comprises 4 to 50 parts by mass of a nonmetallic inorganic filler (B) and 0.01 to 1 part by mass of a phosphate compound (C) relative to 100 parts by mass of a resin mixture (A) which is composed of 60 to 97% by mass of an aromatic polycarbonate resin (a-1) and 40 to 3% by mass of a fatty acid polyester (a-2).Type: GrantFiled: December 2, 2005Date of Patent: October 4, 2011Assignee: Idemitsu Kosan Co., Ltd.Inventors: Akio Nodera, Yusuke Hayata, Yutaka Tsubokura, Yoshiaki Miura
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Publication number: 20110009516Abstract: A ultraviolet-curable coating agent contains: a hydrophilic polymer having the specific structure represented by the following general formula (1); a polymerization-reactive urethane oligomer; a water-soluble monomer; a photo polymerization initiator; and a water-absorptive filler. The polymerization-reactive urethane oligomer is preferably formed of a carboxyl-group-containing dihydroxyl compound, polymer polyol, organic diisocyanate compound and hydroxyl-group-containing acrylic ester, and a number average molecular weight of the polymerization-reactive urethane oligomer is preferably 1000 to 10000. By applying the ultraviolet-curable coating agent onto a front face of a substrate, an ink-receiving layer having excellent ink absorptivity, drying characteristics of printed images, bleeding resistance, anti-tacking and water resistance can be formed.Type: ApplicationFiled: May 2, 2008Publication date: January 13, 2011Applicant: Idemitsu Technofine, Co., Ltd.Inventors: Yutaka Tsubokura, Yoshinori Machida, Fumioki Fukatsu
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Publication number: 20090239983Abstract: Provided is a polycarbonate resin composition having high rigidity, high flowability, high heat resistance and excellent flame retardancy and molded articles with good appearance using the polycarbonate resin composition. The polycarbonate resin composition comprises 4 to 50 parts by mass of a nonmetallic inorganic filler (B) and 0.01 to 1 part by mass of a phosphate compound (C) relative to 100 parts by mass of a resin mixture (A) which is composed of 60 to 97% by mass of an aromatic polycarbonate resin (a-1) and 40 to 3% by mass of a fatty acid polyester (a-2).Type: ApplicationFiled: December 2, 2005Publication date: September 24, 2009Applicant: IDEMITSU KOSAN CO., LTD.Inventors: Akio Nodera, Yusuke Hayata, Yutaka Tsubokura, Yoshiaki Miura
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Publication number: 20060052578Abstract: A polyarylene sulfide resin which has an index of coupling reactivity at 320° C. of 2.0 or lower and an amount of SO2 generated therefrom at 300° C. of 0.02 mg/g or smaller; and a process for producing the polyarylene sulfide resin, which comprises polymerizing a polyfunctional halogenated aromatic compound with lithium sulfide in an aprotic organic solvent, and then washing the resultant polymer in a molten state. A composition comprising the polyarylene sulfide resin obtained by such process and an inorganic filler is reduced in unevenness of fluidity between lots and is reduced in sulfur odor emission during molding.Type: ApplicationFiled: November 27, 2003Publication date: March 9, 2006Inventors: Hiroyuki Higuchi, Minoru Senga, Yutaka Tsubokura
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Publication number: 20020188096Abstract: Provided is a polyarylene sulfide resin composition comprising (a) from 30 to 75% by mass of a polyarylene sulfide resin and (b) from 25 to 70% by mass of a filler, and containing (c) from 0.08 to 1.0 part by weight, relative to 100 parts by mass of the sum of (a) and (b), of an oxidized polyethylene wax having an acid value of at least 10 mg KOH/g and a dropping point of not higher than 120° C., or (d) from 0.1 to 1.0 part by weight relative to the same of a silicone oil having a viscosity at 25° C. of from 30 to 6,000 mm2/sec. The mold releasability of the moldings of the composition is improved, not interfering with the mechanical and chemical properties intrinsic to polyarylene sulfide resins.Type: ApplicationFiled: February 28, 2002Publication date: December 12, 2002Inventors: Yutaka Tsubokura, Wataru Kosaka, Kazuhiro Okuyama, Nobuyuki Kojima
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Patent number: 6476106Abstract: Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.Type: GrantFiled: August 24, 2000Date of Patent: November 5, 2002Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Tomoyoshi Murakami, Yutaka Tsubokura, Shigemasa Suzuki, Satoru Kinouchi
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Patent number: 5231142Abstract: A rubber-modified styrene-based resin composition comprising (A) 70 to 92% by weight of a styrene-based polymer and 30 to 8% by weight of a rubbery polymer wherein the rubbery polymer is dispersed in the styrene-based polymer in the form of particles having an occlusion structure with a plane of symmetry, an area average particle diameter of 0.1 to 0.7 .mu.m, and a ratio of area average particle diameter to number average particle diameter of 1.0 to 2.5, the weight ratio of gel content to rubbery polymer is 1.1:1 to 4.0:1, and the swelling index is 5 to 20. The styrene-based resin composition has excellent physical properties and can be used as a material for office automation equipment, home electric appliances, sheets and so on.Type: GrantFiled: February 28, 1990Date of Patent: July 27, 1993Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Yutaka Tsubokura, Yoshiyuki Suetsugu, Shinichi Nakamura, Eiichi Terada
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Patent number: 5206302Abstract: The rubber-modified styrene-based resin composition, which is a composite of a styrene-based resin as a continuum of the matrix phase and a diene-based rubbery polymer as a dispersed particulate phase in the matrix, is characterized by the parameters including an average particle diameter of the particles of the rubbery polymer in the range from 0.08 to 1.00 .mu.m, peripheral parameter thereof in the range from 0.1 to 2.5 (.mu.m).sup.-1. (% by weight).sup.-1 and relaxation time T.sub.2 thereof in the range from 300 to 2000 .mu. seconds as the determinant factors of the moldability of the resin composition as well as the impact strength and surface gloss of the shaped articles prepared from the composition.Type: GrantFiled: March 21, 1990Date of Patent: April 27, 1993Assignee: Idemitsu Petrochemical Company LimitedInventors: Tuneaki Kohsaka, Kazuo Sato, Yutaka Tsubokura, Takashi Kanezaki
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Patent number: 5175213Abstract: A styrene-based resin composition comprising (A) a styrene-based polymer and (B) a rubber-like polymer dispersed in the styrene-based polymer. The dispersed particles of the rubber-like polymer comprise a styrene-butadiene-based block copolymer comprising 5 to 95% by weight of a conventional diblock-type polymer and 95 to 5% by weight of a tapered block-type polymer, wherein the butadiene unit content of the styrene-butadiene-based block copolymer is 6 to 16% by weight, based on the weight of the composition. The particles have a weight ratio of gel content to rubber-like polymer of 1.1:1 to 4.0:1 and have a swelling index of 5 to 20. The particles have an area average diameter of 0.1 to 0.9 .mu.m, with a ratio of area particle diameter to number average particle diameter of 1.0 to 1.8. The styrene-based resin composition has a high Izod impact strength and a high drop-weight impact strength, and further has excellent gloss and stiffness properties.Type: GrantFiled: June 4, 1990Date of Patent: December 29, 1992Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Yoshiyuki Suetsugu, Yutaka Tsubokura, Kazuo Sato