Abstract: A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.

Abstract: A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate.

Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

Abstract: A cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of a inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element.

Abstract: A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: A cooling device includes a case including a mount surface having a power transistor mounted thereon, a coolant accommodating chamber formed in the case located above the mount surface, for accommodating a coolant capable of evaporating by heat from the power transistor, a cooling pipe provided in the case and being capable of cooling the coolant in a gaseous state, and a defining member provided in the coolant accommodating chamber and being capable of defining in the coolant accommodating chamber a first region capable of guiding the coolant in a gaseous state evaporated by the heat from the power transistor toward the cooling pipe, and a second region located downstream in a flow direction of the coolant with respect to the first region and being capable of guiding the coolant cooled by the cooling pipe toward a bottom of the coolant accommodating chamber.

Abstract: A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate.

Abstract: A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element.

Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

Abstract: The present invention is a cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of an inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member. Thereby, it is possible to provide a cooling device of improving cooling efficiency and reducing cooling unevenness.

Abstract: A cooler is provided with a thermal transmission member having a surface to be sprayed with a cooling fluid. The heat transmission member includes a first groove formed on the surface, and a second groove intersecting with the first groove and being formed on the surface.

Abstract: A cooler includes a substrate for disposing a semiconductor device thereon, a plate member fixed to a back surface of the substrate, a primary pipe, and a secondary pipe. A space sandwiched between the substrate and the primary pipe defines a first flow path for a coolant. The primary pipe and the secondary pipe configure a second flow path for a coolant. The secondary pipe is positioned to jet a coolant toward a region opposite to that having the semiconductor device disposed therein. The second flow path is separated from the first flow path.

Abstract: An apparatus for efficiently purifying NOx in the exhaust gas or soluble organic substance in the exhaust gas from a diesel engine. A plurality of purification units are arranged in a housing, each of which is composed of a catalytic layer for reducing NOx and a cooling core for cooling the exhaust gas admitted through the catalytic layer. The multi-staged purification units are so constructed to admit the exhaust gas to flow therethrough. The catalytic layer in the form of a porous carrier such as a honeycomb structure carries catalytic components. Upon purifying soluble organic substance in the exhaust gas from a diesel engine, the catalytic components carried on the catalytic layer serve to efficiently purify such substance, as well as inhibiting the reaction to form sulfate.

Abstract: A fuel vaporizer for internal combustion engines is disposed at a suitable position in an intake passage of a carburetor or an intake manifold. The fuel vaporizer comprises a heating cylinder installed in registry with a barrel of the carburetor or a heating plate embedded in a wall of the intake manifold. The heating cylinder or plate includes a base body of electrically and thermally insulative ceramics coated on a surface thereof with a thin film of electrically resistive material such as metal capable of being heated when an electric current flows therethrough, the thin film lying substantially flush with the wall of the intake passage and being electrically connected to a power supply via a switch. When the heating cylinder or plate is heated, it effectively and reliably evaporates fuel in liquid phase flowing down the intake passage into contact with the heated thin film.